文
论文分享
演练场
杂货铺
论文推荐
字
编辑器下载
登录
注册
S. Haumann
发表
Novel bonding and joining technology for power electronics - Enabler for improved lifetime, reliability, cost and power density
S. Haumann, M. Becker, J. Rudzki, 2013, 2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC).