Charles Lu

发表

Yeast metabolic and signaling genes are required for heat-shock survival and have little overlap with the heat-induced genes

David Botstein, D. Botstein, David C. Hess, 2013, Proceedings of the National Academy of Sciences.

Slow Growth Induces Heat-shock Resistance in Normal and Respiratory-deficient Yeast

Matthew J. Brauer, D. Botstein, M. Brauer, 2022 .

Genome Sequence of Theileria parva, a Bovine Pathogen That Transforms Lymphocytes

Jonathan E. Allen, Samuel V. Angiuoli, Bernard B. Suh, 2005, Science.

Genomic sequence of the pathogenic and allergenic filamentous fungus Aspergillus fumigatus

William H. Majoros, M. J. García, B. Haas, 2005, Nature.

The Princeton Protein Orthology Database (P-POD): A Comparative Genomics Analysis Tool for Biologists

Samuel V. Angiuoli, O. White, D. Botstein, 1997, PloS one.

Corrigendum: Genomic sequence of the pathogenic and allergenic filamentous fungus Aspergillus fumigatus

William H. Majoros, M. J. García, B. Haas, 2006, Nature.

The Princeton Protein Orthology Database (P-POD): A Comparative Genomics Analysis Tool for Biologists

Kara Dolinski, David Botstein, Rose Oughtred, 2007, PloS one.

Predicting Cellular Growth from Gene Expression Signatures

Edoardo M. Airoldi, David Botstein, Olga G. Troyanskaya, 2009, PLoS Comput. Biol..

mua-3, a gene required for mechanical tissue integrity in Caenorhabditis elegans, encodes a novel transmembrane protein of epithelial attachment complexes

D. Hall, E. Hedgecock, Charles Lu, 2001, The Journal of cell biology.

Analysis of the transcriptome of the protozoan Theileria parva using MPSS reveals that the majority of genes are transcriptionally active in the schizont stage

O. White, D. Hoyle, M. Gardner, 2005, Nucleic acids research.

mua-3, a gene required for mechanical tissue integrity in Caenorhabditis elegans, encodes a novel transmembrane protein of epithelial attachment complexes

D. Hall, E. Hedgecock, Charles Lu, 2001, The Journal of cell biology.