Brian Henderson

The OLYMPUS Target System

Brian Henderson, 2012 .

A Wide I/O Memory-on-Logic Product Prototype Enabled by Through-Silicon Stacking Technology

Brian Henderson, Matt Nowak, Sam Gu, 2013 .

A fully automated wirelessly powered centrifugal platform towards a sample-to-answer chemiluminescent ELISA assay for CVD detection

Jan G. Korvink, Dario Mager, Brian Henderson, 2016 .

Can High Density 3D Through Silicon Stacking Replace Lithography-Driven CMOS Scaling as the Engine for the Semiconductor Industry?

Brian Henderson, Matt Nowak, 2011 .

Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

Riko Radojcic, Brian Henderson, Ahmer Syed, 2017 .

Development of 3D through silicon stack (TSS) assembly for wide IO memory to logic devices integration

Wei Zhao, Riko Radojcic, Dong Wook Kim, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.