Luhua Xu

发表

Interconnect Quality and Reliability of 3D Packaging

K. Tu, Yaodong Wang, Yingxia Liu, 2020, 3D Microelectronic Packaging.

Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

F. Che, J. Pang, Luhua Xu, 2008 .

Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints

S. L. Ngoh, J. Pang, Wei Zhou, 2004 .

Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies

F. Che, J. Pang, B. Xiong, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Intermetallic Growth and Failure Study for Sn-Ag-Cu/ENIG PBGA Solder Joints Subject to Thermal Cycling

F. Che, J. Pang, Luhua Xu, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Dilution effect of Ar/H2 on the microstructures and photovoltaic properties of nc-Si:H deposited in low frequency inductively coupled plasma

Luhua Xu, Shu-Chen Huang, S. Xiao, 2011 .

Investigation of IMC layer effect on PBGA solder joint thermal fatigue reliability

F. Che, J. Pang, Luhua Xu, 2005, 2005 7th Electronic Packaging Technology Conference.

The thermal stability and catalytic performance of Ce-Zr promoted Rh-Pd/γ-Al2O3 automotive catalysts

Luhua Xu, D. Weng, Xiaodong Wu, 2004 .

Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish

W.H. Zhu, C.K. Wang, A.Y.S. Sun, 2008, 2008 58th Electronic Components and Technology Conference.

Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)

F. Che, J. Pang, D.Y.R. Chong, 2008, IEEE Transactions on Advanced Packaging.

Effects of plasma-sprayed NiCrAl/ZrO2 intermediate on the combination ability of coatings

Zhen Chen, Luhua Xu, D. Weng, 2001 .

Structure and performance of γ-alumina washcoat deposited by plasma spraying

Luhua Xu, D. Weng, Xiaodong Wu, 2001 .

Nanoindentation on SnAgCu lead-free solder joints and analysis

J. Pang, Luhua Xu, 2006 .

Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects

J. Miao, J. Pang, Luhua Xu, 2007 .

Amorphous/crystalline silicon heterojunction solar cells via remote inductively coupled plasma processing

S. Huang, Luhua Xu, S. Xiao, 2012 .

Electromigration effect on intermetallic growth and Young’s modulus in SAC solder joint

K. Tu, J. Pang, Luhua Xu, 2006 .

Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability

Luhua Xu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

in-situ electromigration study on Sn−Ag−Cu solder joint by digital image speckle analysis

J. Pang, Luhua Xu, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Influence of cerium on the performance of LaMO3+λ (M = Mn or Mn–Cu) perovskite-type catalyst

Luhua Xu, D. Weng, Xiaodong Wu, 2003 .

Surface characterization and catalytic performance of La0.7Sr0.3MnO3+λ coating deposited by plasma spraying

Luhua Xu, D. Weng, Xiaodong Wu, 2004 .

Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Jianmin Miao, John H. L. Pang, Robert Preisser, 2007 .

Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper

J. Miao, K. Tu, J. Pang, 2008 .

Study on the interconnection failure in lead-free soldered assemblies

Luhua. Xu, Luhua Xu, 2007 .

Electromigration effect on strain and mechanical property change in lead-free solder joints

K. Tu, J. Pang, Luhua Xu, 2006, 2006 8th Electronics Packaging Technology Conference.

Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints

K. Tu, J. Pang, Luhua Xu, 2006 .

Intermediate strain rate dependant mechanical properties for lead-free solders

Luhua Xu, K. E. Tan, J. Pang, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM

K. Tu, Luhua Xu, S. Liang, 2009, 2009 59th Electronic Components and Technology Conference.

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

Y. Lai, K. Tu, Luhua Xu, 2008 .

Intermetallic growth studies on SAC/ENIG and SAC/Cu-OSP lead-free solder joints

Luhua Xu, J. Pang, Luhua Xu, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging

J. Pang, Luhua Xu, 2006 .

Interfacial IMC and Kirkendall void on SAC solder joints subject to thermal cycling

J. Pang, Luhua Xu, 2005, 2005 7th Electronic Packaging Technology Conference.

Electromigration induced ductile-to-brittle transition in lead-free solder joints

John H. L. Pang, Jae-Woong Nah, King-Ning Tu, 2006 .

Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

Y. Lai, K. Tu, Luhua Xu, 2010 .

Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints

Y. Lai, Luhua Xu, Chih Chen, 2009 .

Characterization of Nano-grained High Aspect Ratio Through-wafer Copper Interconnect Column

K. Tu, J. Pang, Luhua Xu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Thermo-electromigration induced failure in WL-CSP Pb-free solder joints

K. Tu, Luhua Xu, L. Nguyen, 2008 .

Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating

J. Miao, J. Pang, Luhua Xu, 2007 .

Influence of aging on the morphology and wettability of polytetrafluoroethylene implanted by high-fluence carbon ion

Xianghuai Liu, Luhua Xu, Jizhong Zhang, 2002 .

Material Properties and Intermetallic Compounds of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC)

N. Lee, J. Lau, J. Pang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

The NO selective reduction on the La1−xSrxMnO3 catalysts

Luhua Xu, D. Weng, Xiaodong Wu, 2004 .

Nanotwin-modified copper interconnects and its effect on the physical properties of copper

K. Tu, Jenn‐Ming Yang, Luhua Xu, 2009, 2009 59th Electronic Components and Technology Conference.

Nanoindentation on SnAgCu lead-free solder and analysis

J. Pang, Luhua Xu, 2005, Electronic Packaging Technology Conference.

Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint

Luhua Xu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

Strain-rate effects on mechanical properties for SAC387 and SAC105-Y solder

J. Pang, Luhua Xu, K. E. Tan, 2008, 2008 2nd Electronics System-Integration Technology Conference.

In-situ study of the effect of electromigration on strain evolution and mechanical property change in lead-free solder joints

K. Tu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

Amorphous/crystalline silicon heterojunction solar cells via remote inductively coupled plasma processing

S. Huang, Luhua Xu, S. Xiao, 2012 .