R. Hernandez

Chip‐Level Electromigration Reliability for Cu Interconnects

M. Gall, V. Zolotov, B. Boeck, 2004 .

Statistical analysis of early failures in electromigration

Hisao Kawasaki, Paul S. Ho, C. Capasso, 2001 .

Electromigration of Cu-Sn-Cu micropads in 3D interconnect

Zhihong Huang, S. Pozder, R. Chatterjee, 2008, 2008 58th Electronic Components and Technology Conference.

Analysis of electromigration statistics for Cu interconnects

Hisao Kawasaki, Paul S. Ho, Martin Gall, 2006 .

Statistical Analysis of Electromigration in Cu Interconnects With Multi‐link Test Structures

M. Gall, P. Ho, M. Hauschildt, 2004 .

Critical Length and Resistance Saturation Effects in Al(Cu) Interconnects

Hisao Kawasaki, C. Capasso, M. Gall, 1998 .

Statistical analysis of electromigration lifetimes and void evolution

Hisao Kawasaki, Paul S. Ho, Martin Gall, 2004 .

Statistical Evaluation of Stressmigration Reliability in Al-Cu Interconnects

M. Gall, J. Müller, R. Hernandez, 1998 .