Z. Q. Jiang

Interaction of a Screw Dislocation with an Interfacial Crack in Two Dissimilar Piezoelectric Layers

A. Soh, J. Liu, Ai-ping Liu, 2004 .

Thermal Stresses in Layered Electronic Assemblies

Yonggang Huang, Animesh Chandra, Yonggang Huang, 1997 .

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

K. X. Hu, Yonggang Huang, Animesh Chandra, 1999, Electronics Manufacturing Issues.

A hybrid micro-macro BEM with micro-scale inclusion-crack interactions

A. Chandra, Yonggang Huang, Z. Q. Jiang, 1996 .

The numerical calculation of two-dimensional effective moduli for microcracked solids

Yonggang Huang, K. Hu, A. Chandra, 1996 .

Torsional impact response of a cylindrical interface crack between a functionally graded interlayer and a homogeneous cylinder

R. Su, Z. Q. Jiang, W. Feng, 2005 .

A model of evolving damage bands in materials

Z. Suo, Yonggang Huang, Z. Q. Jiang, 1997 .