Zhiguang Wang

发表

John G. Jones, Gail J. Brown, Alexei D. Matyushov, 2017, Nature Communications.

Zhuangde Jiang, Ming Liu, S. Dong, 2021, IEEE Sensors Journal.

Sydney S. Cash, Zhongqiang Hu, N. Sun, 2016, Advanced materials.

John G. Jones, Gail J. Brown, Brandon M. Howe, 2020, IEEE Transactions on Microwave Theory and Techniques.

Zhiguang Wang, Yaodong Yang, J. Bian, 2015, Journal of Materials Science: Materials in Electronics.

D. Viehland, Jiefang Li, Li Yan, 2009, Journal of Materials Science.

Sydney S. Cash, N. Sun, Zhiguang Wang, 2018, npj Flexible Electronics.

D. Viehland, Jiefang Li, Long-qing Chen, 2015, Nature Communications.

Ming Liu, Zhongqiang Hu, Zhiguang Wang, 2020, Advanced Electronic Materials.

W. Cui, Ming Liu, Zhongqiang Hu, 2019, Advanced Electronic Materials.

Ming Liu, Shuxiang Dong, Wei Su, 2021, IEEE Transactions on Industrial Electronics.

Nian X. Sun, Xianfeng Liang, Cunzheng Dong, 2017, IEEE Sensors Letters.

Zhiguang Wang, T. Nan, Menghui Li, 2019, Integrated Multiferroic Heterostructures and Applications.

Q. Jia, D. Viehland, Jiefang Li, 2012 .

D. Viehland, Jiefang Li, Zhiguang Wang, 2012 .

Zhiguang Wang, Yaping Du, Chao Wu, 2019, Physical chemistry chemical physics : PCCP.

Zhuangde Jiang, Ming Liu, Zhongqiang Hu, 2022, IEEE Transactions on Magnetics.

Ming Liu, Ziyao Zhou, Zhongqiang Hu, 2020, IEEE Transactions on Industrial Electronics.

Zhuangde Jiang, Ming Liu, Zhongqiang Hu, 2019, IEEE Transactions on Magnetics.

John G. Jones, Alexei D. Matyushov, Zhongqiang Hu, 2017, Nature Communications.

Shadi Emam, Mohsen Zaeimbashi, Huaihao Chen, 2018, 2018 IEEE International Microwave Biomedical Conference (IMBioC).

Ming Liu, Ziyao Zhou, Zhongqiang Hu, 2019, IEEE Electron Device Letters.

D. Viehland, Zhiguang Wang, W. Ge, 2010 .

D. Viehland, Jiefang Li, Zhiguang Wang, 2019, Physics Letters A.

D. Viehland, Jiefang Li, Zhiguang Wang, 2010 .

Libo Zhao, Zhuangde Jiang, Meilin Liu, 2021, Smart materials and structures (Print).

Zhuangde Jiang, Ming Liu, Z. Zeng, 2020, ACS applied materials & interfaces.