Takahisa Nitta

发表

Giant-grain copper metallization for high reliability and high-speed ULSI interconnects

Tadahiro Ohmi, T. Takewaki, Takashi Hoshi, 1993, Other Conferences.

Significance of Ultra Clean Technology in the Era of ULSIs (Special Issue on Scientific ULSI Manufacturing Technology)

Takahisa Nitta, 1996 .

Technological expectations for the 21st century. Fine pattern processing technology of LSI.

Takahisa Nitta, 1990 .

Characterizing Film Quality and Electromigration Resistance of Giant-Grain Copper Interconnects (Special Issue on Sub-Half Micron Si Device and Process Technologies)

Tadahiro Ohmi, Tadashi Shibata, Takahisa Nitta, 1993 .

N2 Tunnel Wafer Transport System

Yoshio Saito, Takahisa Nitta, Masayuki Toda, 1997 .

Eliminating Metal‐Sputter Contamination in Ion Implanter for Low‐Temperature‐Annealed, Low‐Reverse‐Bias‐Current Junctions

Tadashi Shibata, Tadahiro Ohmi, Takahisa Nitta, 1995 .

Formation of giant-grain copper interconnects by a low-energy ion bombardment process for high-speed ULSIs

Tadahiro Ohmi, T. Takewaki, Takahisa Nitta, 1995 .

A novel self-aligned surface-silicide passivation technology for reliability enhancement in copper interconnects

Tadahiro Ohmi, T. Takewaki, Takahisa Nitta, 1995, 1995 Symposium on VLSI Technology. Digest of Technical Papers.

Electrical Properties of Giant‐Grain Copper Thin Films Formed by a Low Kinetic Energy Particle Process

Tadashi Shibata, Tadahiro Ohmi, Masahito Otsuki, 1992 .

Evaluating the Large Electromigration Resistance of Copper Interconnects Employing a Newly Developed Accelerated Life‐Test Method

Tadashi Shibata, Tadahiro Ohmi, Takahisa Nitta, 1993 .

Excellent electro/stress-migration-resistance surface-silicide passivated giant-grain Cu-Mg alloy interconnect technology for giga scale integration (GSI)

Tadahiro Ohmi, T. Takewaki, Takahisa Nitta, 1995, Proceedings of International Electron Devices Meeting.