P. Lee

发表

P. Lee, Shi Zeng, 2019, International Journal of Heat and Mass Transfer.

S. Chou, P. Lee, Yong-Jiun Lee, 2009 .

P. Lee, Xin Xiong, Yogesh Fulpagare, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

P. Lee, Xin Xiong, Yogesh Fulpagare, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

B. Chua, P. Lee, Liwen Jin, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Mohammad Nurul Alam Hawlader, Poh Seng Lee, M. Hawlader, 2012 .

Siaw Kiang Chou, Poh Seng Lee, S. Chou, 2014 .

P. Lee, C. Yap, Tamanna Alam, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

P. Lee, N. Chen, Lijun Liu, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Peter C. Y. Chen, H. See, P. Lee, 2022, Heat and Mass Transfer.

Peter C. Y. Chen, H. See, P. Lee, 2018, Micromachines.

P. Lee, K. Balasubramanian, Pallikonda Mahesh, 2021, Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering.

Peter C. Y. Chen, P. Lee, Heng Wang, 2018, International Journal of Fluid Machinery and Systems.

P. Lee, C. Yap, J. Mathew, 2019, International Journal of Heat and Mass Transfer.

K. Loh, P. Lee, S. Xi, 2022, Nature Communications.

Peter C. Y. Chen, P. Lee, S. D. Marshall, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Chuan Sun, Kent Loong Khoo, Poh Seng Lee, 2018, International Journal of Heat and Mass Transfer.

P. Singh, P. Lee, Sanjeev Kumar, 2019, International Communications in Heat and Mass Transfer.

P. Singh, P. Lee, Yan-qing Fan, 2015 .

Siaw Kiang Chou, Poh Seng Lee, S. Chou, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

P. Lee, Dong Liu, Suresh V. Garimellaand, 2004 .

Moonyong Lee, Muhammad Wakil Shahzad, Muhammad Abdul Qyyum, 2021, Energies.

C. C. Kong, P. Lee, M. Pallikonda, 2021, Asia-Pacific Journal of Chemical Engineering.

Siaw Kiang Chou, Chiang Juay Teo, Poh Seng Lee, 2013 .

P. Lee, J. Mathew, Tianqing Wu, 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

P. Singh, P. Lee, Ritesh Kumar, 2019, Numerical Heat Transfer, Part A: Applications.

Suresh V. Garimella, Poh Seng Lee, S. Garimella, 2003 .

Hong Xue, J. C. Ho, Poh Seng Lee, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Chen-Nan Sun, P. Lee, J. Mathew, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

C. C. Kong, P. Lee, V. Chandramohan, 2022, Asia-Pacific Journal of Chemical Engineering.

S. Chou, P. Lee, Yong-Jiun Lee, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Kent Loong Khoo, S. Chou, P. Lee, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Peter C. Y. Chen, P. Lee, R. Arayanarakool, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Shirun Ding, P. Lee, K. Cheng, 2023, Proceeding of 8th Thermal and Fluids Engineering Conference (TFEC).