Aditya Kumar

High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)

Jinglin Shi, Teck Guan Lim, Ying Ying Lim, 2010, IEEE Transactions on Advanced Packaging.

Artificial Intelligence Assisted Production Forecasting and Well Surveillance

Aditya Kumar, Shashipal Reddy Masini, Shubham Goswami, 2020 .