John H Lau

High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)

Jinglin Shi, Teck Guan Lim, Ying Ying Lim, 2010, IEEE Transactions on Advanced Packaging.

Fan-out wafer-level packaging for 3D IC heterogeneous integration

John H Lau, J. Lau, 2018, 2018 China Semiconductor Technology International Conference (CSTIC).

Electronic Packaging: Design, Materials, Process, and Reliability

Wataru Nakayama, John H Lau, J. Lau, 1998 .