Shiguo Liu

High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)

Jinglin Shi, Teck Guan Lim, Ying Ying Lim, 2010, IEEE Transactions on Advanced Packaging.

Development of Large Die Fine-Pitch Cu/Low- $k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Shiguo Liu, Yue Ying Ong, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Thermo-mechanical design of large die fine pitch copper/low-k FCBGA and lead-free interconnections

Shiguo Liu, T.C. Chai, Xiaowu Zhang, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

John H. Lau, V. Kripesh, Shiguo Liu, 2009, 2009 59th Electronic Components and Technology Conference.

Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP)

John H. Lau, Teck Guan Lim, Ying Ying Lim, 2009, 2009 59th Electronic Components and Technology Conference.

Development of numerical modeling approach on substrate warpage prediction

T. C. Chai, Shiguo Liu, Kalyan Biswas, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).