Siming Pan

发表

Designing test patterns for effective measurement of typical TSV pairs in a silicon interposer

Jun Fan, Chulsoon Hwang, Qian Wang, 2014, 2014 International Symposium on Electromagnetic Compatibility, Tokyo.

Comparison among different via models based on Feature Selective Validation technique

Jun Fan, Hanfeng Wang, Siming Pan, 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.

Characterization of Via Structures in Multilayer Printed Circuit Boards With an Equivalent Transmission-Line Model

Jun Fan, Siming Pan, Siming Pan, 2012, IEEE Transactions on Electromagnetic Compatibility.

Innovative PDN Design Guidelines for Practical High Layer-Count PCBs Session 11 - WA - 1

Jun Fan, Bruce Archambeault, Jingook Kim, 2013 .

De-embedding techniques for transmission lines: An exploration, review, and proposal

Jun Fan, Chulsoon Hwang, Ketan Shringarpure, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.

Differential Crosstalk Mitigation in the Pin Field Area of SerDes Channel With Trace Routing Guidance

Jun Fan, Siming Pan, Bichen Chen, 2019, IEEE Transactions on Electromagnetic Compatibility.

Effectiveness analysis of de-embedding method for typical TSV pairs in a silicon interposer

Jun Fan, Chulsoon Hwang, Qian Wang, 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.

Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board

Jun Fan, James L. Drewniak, Bruce Archambeault, 2016, IEEE Transactions on Electromagnetic Compatibility.

Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board

Jun Fan, James L. Drewniak, Bruce Archambeault, 2017, IEEE Transactions on Electromagnetic Compatibility.

An Efficient Method to Extract Surface-Wave Poles of Green's Functions Near Branch Cut in Lossy Layered Media

Jun Fan, Siming Pan, Siming Pan, 2015, IEEE Transactions on Antennas and Propagation.

Equivalent transmission-line model for vias connected to striplines in multilayer print circuit boards

Jun Fan, Jianmin Zhang, Qinghua B. Chen, 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

Applying feature selective validation (FSV) as an objective function for data optimization

Jun Fan, Hanfeng Wang, Siming Pan, 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

Equivalent mixed-mode characteristic impedances for differential signal vias

Jun Fan, Siming Pan, 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.

Modeling and analysis of high-speed sources and serial links for signal integrity

Siming Pan, Siming Pan, 2010 .

Multi-Ports ([$2^{n}$) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization

Jun Fan, Xiaoning Ye, Siming Pan, 2019, IEEE Transactions on Electromagnetic Compatibility.

Coil design for 100 KHz and 6.78 MHz WPT system :Litz and solid wires and winding methods

Jun Fan, Heegon Kim, Jonghyun Cho, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Analytical expressions for transfer function of supply voltage fluctuation to jitter at a single-ended buffer

Jun Fan, Jingook Kim, Siming Pan, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

Modeling and Application of Multi-Port TSV Networks in 3-D IC

Jun Fan, Lei He, Wei Yao, 2013, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Power-bandwidth trade-off on TSV array in 3D IC and TSV-RDL junction design challenges

Wei Yao, Feng Shi, Lei He, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

De-embedding techniques for transmission lines: An application to measurements of on-chip coplanar traces

Jun Fan, Xu Gao, Siming Pan, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Modeling and analysis of conductive voltage noise for a DC-DC buck converter

Jun Fan, Chaoyong Wang, Siming Pan, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Trade-Off Ratio Functions for Linear and Piecewise Linear Multi-objective Optimization Problems

Shengkun Zhu, Siming Pan, Shaokai Lu, 2021, J. Optim. Theory Appl..

EMC ’ 09 / Kyoto Equivalent Characteristic Impedance and Propagation Constant for Multi-Layer Via Structures

James L. Drewniak, Siming Pan, Jun Fan, 2009 .

Fast admittance computation for TSV arrays

Siming Pan, Dazhao Liu, B. Achkir, 2012, 2012 IEEE International Symposium on Electromagnetic Compatibility.

Comparative study of transmission lines design for 2.5D silicon interposer

Siming Pan, Brice Achkir, B. Achkir, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.

An equivalent three-dipole model for IC radiated emissions based on TEM cell measurements

Siming Pan, Jaesu Park, Jun Fan, 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

Optimization of power delivery network design for multiple supply voltages

Siming Pan, Brice Achkir, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.