Brice Achkir

发表

Designing test patterns for effective measurement of typical TSV pairs in a silicon interposer

Jun Fan, Chulsoon Hwang, Qian Wang, 2014, 2014 International Symposium on Electromagnetic Compatibility, Tokyo.

Modeling optimization of test patterns used in de-embedding method for through silicon via (TSV) measurement in silicon interposer

Jun Fan, Chulsoon Hwang, Qian Wang, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Stressed jitter analysis for physical link characterization

Jun Fan, James L. Drewniak, Brice Achkir, 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

Power integrity with voltage ripple spectrum decomposition for physics-based design

Jun Fan, Tamar Makharashvili, Siqi Bai, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Innovative PDN Design Guidelines for Practical High Layer-Count PCBs Session 11 - WA - 1

Jun Fan, Bruce Archambeault, Jingook Kim, 2013 .

Design of on-chip linear voltage regulator module and measurement of power distribution network noise fluctuation at high-speed output buffer

Joungho Kim, Jun Fan, Changwook Yoon, 2015, 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).

On-chip voltage regulator module (VRM) effect on power/ground noise and jitter at high-speed output buffer

Jun Fan, Heegon Kim, Jingook Kim, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Modeling and Analysis of On-Chip Power Noise Induced by an On-Chip Linear Voltage Regulator Module With a High-Speed Output Buffer

James L. Drewniak, Changwook Yoon, Heegon Kim, 2020, IEEE Transactions on Electromagnetic Compatibility.

De-embedding techniques for transmission lines: An exploration, review, and proposal

Jun Fan, Chulsoon Hwang, Ketan Shringarpure, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.

Effectiveness analysis of de-embedding method for typical TSV pairs in a silicon interposer

Jun Fan, Chulsoon Hwang, Qian Wang, 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.

Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board

Jun Fan, James L. Drewniak, Bruce Archambeault, 2016, IEEE Transactions on Electromagnetic Compatibility.

Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs

Jun Fan, Bruce Archambeault, Samuel Connor, 2020, IEEE Electromagnetic Compatibility Magazine.

On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer

Jun Fan, Joungho Kim, Changwook Yoon, 2015, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.

Equivalent Inductance Analysis and Quantification for PCB PDN Design

Jun Fan, Shuang Liang, B. Archambeault, 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).

Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board

Jun Fan, James L. Drewniak, Bruce Archambeault, 2017, IEEE Transactions on Electromagnetic Compatibility.

Modeling and Measurement of Ground Bounce Induced by High-Speed Output Buffer With On-Chip Low-Dropout (LDO) Regulator

Jun Fan, Heegon Kim, Jonghyun Cho, 2018, IEEE Transactions on Electromagnetic Compatibility.

TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization

Jun Fan, Qian Wang, Antonio Orlandi, 2017, IEEE Transactions on Instrumentation and Measurement.

TINTEGRATED APPARATUS TO VALIDATE AND TEST LEDS AND TRANSCEIVER PORTS

Brice Achkir, Jason Zhang, Min Zhu, 2020 .

Inductance extraction for physics-based modeling of power net area fills with complex shapes and voids using the plane-pair PEEC method

Jun Fan, Siqi Bai, Bruce Archambeault, 2016, 2016 IEEE/ACES International Conference on Wireless Information Technology and Systems (ICWITS) and Applied Computational Electromagnetics (ACES).

Revised L–2L Method for On-Chip De-Embedding

Jun Fan, Brice Achkir, Nicholas Erickson, 2019, IEEE Transactions on Electromagnetic Compatibility.

Impact of chip and interposer PDN to eye diagram in high speed channels

Jun Fan, Antonio Orlandi, Stefano Piersanti, 2018, 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI).

Material parameter extraction using Time-Domain TRL (t-TRL) measurements

Brice Achkir, Amendra Koul, James Drewniak, 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.

Parametric Testing of Optical Interfaces

Bill Eklow, Brice Achkir, Pavel Zivny, 2008, 2008 IEEE International Test Conference.

Modeling and Application of Multi-Port TSV Networks in 3-D IC

Jun Fan, Lei He, Wei Yao, 2013, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Surface current distribution for PCB PDNGeometry

Jun Fan, Siqi Bai, Erping Li, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Design of on-chip linear voltage regulator module and measurement of power distribution network noise fluctuation at high-speed output buffer

Joungho Kim, Jun Fan, Changwook Yoon, 2015 .

Analytical PDN voltage ripple calculation using simplified equivalent circuit model of PCB PDN

Jun Fan, Bruce Archambeault, Michael Cracraft, 2015, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.

De-embedding techniques for transmission lines: An application to measurements of on-chip coplanar traces

Jun Fan, Xu Gao, Siming Pan, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Investigation of statistical eye-diagram estimation method for HBM including ISI, X-talk, and power noise

Jun Fan, Heegon Kim, Jonghyun Cho, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

High-Performance and Cost-Effective Time-Domain TRL Calibration Technique for High-Speed PWC Characterization and Qualification

James L. Drewniak, Brice Achkir, Abhilash Rajagopal, 2009 .

Novel De-Embedding Methodology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer

Chulsoon Hwang, Qian Wang, Antonio Orlandi, 2017, IEEE Transactions on Electromagnetic Compatibility.

Capacitance-Enhanced Through-Silicon Via for Power Distribution Networks in 3D ICs

Chulsoon Hwang, Brice Achkir, Jun Fan, 2016, IEEE Electron Device Letters.

Comparative study of transmission lines design for 2.5D silicon interposer

Siming Pan, Brice Achkir, B. Achkir, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.

Optimization of power delivery network design for multiple supply voltages

Siming Pan, Brice Achkir, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.