H. Kiritani

Transonic Flow Field Analysis of a Free Flight Capsule using Ballistic Range

H. Nagai, K. Ohtani, H. Kiritani, 2020 .

Pre-applied inter chip fill material for 3D chip stack integration – How to improve bonding quality and reliability

H. Kiritani, Y. Kawase, Kan Takeshita, 2016 .

Pre-Applied Inter Chip Fill for 3D-IC Chip Joining

H. Kiritani, Y. Kawase, M. Ikemoto, 2015 .

High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks

H. Kiritani, H. Mori, Y. Orii, 2014, 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-applied Joining Process

H. Kiritani, A. Horibe, H. Mori, 2013 .

Sub-millimeter resolution pressure measurement on free flight model at Mach 1.5 using novel non-intrusive optical technique

H. Nagai, A. Jemcov, H. Kiritani, 2021, Experimental Thermal and Fluid Science.

Surface Pressure Measurements over a Free Flight Object in a Ballistic Range Facility using Two-Color Pressure-Sensitive Paint

H. Nagai, H. Kiritani, Koji Fujita, 2020 .

A Feasibility Analysis of Collaborative Mission Using Mars Airplane and Mars Balloon - Mars Aerial-Exploration for Terrestrial and Tropospheric Environment Observation -

H. Nagai, H. Kiritani, Koji Fujita, 2020 .

The Quantitative Density Measurement of Unsteady Flow around the Projectile

H. Nagai, K. Ohtani, H. Kiritani, 2019, Journal of Flow Control, Measurement & Visualization.