Y. En

发表

Modeling of reverse subthreshold currents in the A-Si:H TFTs

Yuan Liu, Y. En, Yujuan He, 2013, 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE).

Radiation Hardening by the Modification of Shallow Trench Isolation Process in Partially Depleted SOI MOSFETs

Bin Li, Yunfei En, Zhiyuan Hu, 2018, IEEE Transactions on Nuclear Science.

Simulations of single event transient effects in the LM139 voltage comparator

Jianbo Liu, Yuan Liu, Yunfei En, 2014, 2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS).

Investigation of maximum proton energy for qualified ground-based evaluation of single-event effects in SRAM devices

Y. En, Z. Lei, Zhangang Zhang, 2019, Nuclear Science and Techniques.

Incorporation of Secondary-Ion Information and TCAD Simulation for Atmospheric Neutron Soft-Error-Rate Prediction in SRAMs

Y. En, Yujuan He, C. Peng, 2019, IEEE Transactions on Nuclear Science.

Investigating Neutron-Induced Single Event Transient Characteristics by TCAD Simulations in 65 nm Technology and Below

Y. En, C. Peng, Z. Lei, 2019, 2019 3rd International Conference on Radiation Effects of Electronic Devices (ICREED).

Effect of gate bias on ESD characteristics in NMOS device

Hongwei Luo, Y. En, Yujuan He, 2011, 2011 International Symposium on Advanced Packaging Materials (APM).

Effect of channel width on ESD characteristics of SOI MOS device

Hongwei Luo, Y. En, Yujuan He, 2011, 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering.

The different gate oxide degradation mechanism under constant voltage/current stress and ramp voltage stress

Yunfei En, Hongwei Luo, Hongwei Luo, 2000, 2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515).

The Function of IR thermal imaging technology for device and circuit reliability research

Y. En, F. Song, Xiaoqi He, 2014, 2014 IEEE International Conference on Electron Devices and Solid-State Circuits.

Analysis of trap and recovery characteristics based on low-frequency noise for E-mode GaN HEMTs with p-GaN gate under repetitive short-circuit stress

Y. En, X. B. Xu, B. Li, 2020, Journal of Physics D: Applied Physics.

Collocated and Simultaneous Measurements of RF Current and Voltage on a Trace in a Noncontact Manner

Wenxiao Fang, Haimi Qiu, Yunfei En, 2019, IEEE Transactions on Microwave Theory and Techniques.

Trap Analysis Based on Low-Frequency Noise for SiC Power MOSFETs Under Repetitive Short-Circuit Stress

Y. En, X. B. Xu, Y. Chen, 2020, IEEE Journal of the Electron Devices Society.

Investigations on the Short-Circuit Degradation and its Mechanism of 1.2-KV 19-A SiC power MOSFETs

Y. En, X. B. Xu, Y. Chen, 2019, 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).

Degradation of current–voltage and low frequency noise characteristics under negative bias illumination stress in InZnO thin film transistors

Li Wang, Y. En, Yuan Liu, 2018, Chinese Physics B.

Microstructure-based multiphysics modeling for semiconductor integration and packaging

P. Conway, Q. Zeng, A. Dinsdale, 2014 .

Investigation of abrupt degradation of drain current caused by under-gate crack in AlGaN/GaN high electron mobility transistors during high temperature operation stress

Li Wang, Y. En, Yuan Liu, 2015 .

High-Fluence Proton-Induced Degradation on AlGaN/GaN High-Electron-Mobility Transistors

Y. En, X. Zhong, Jinbin Wang, 2020, IEEE Transactions on Nuclear Science.

Study on Soldering Technology for Laser Rod by Finite Element Method

Y. En, Hao Mingming, Yun Huang, 2013, ICMT 2013.

Broadband circularly polarized monopole antenna with modified characteristics

Y. En, Yun Huang, Bin Yao, 2022, Microwave and Optical Technology Letters.

Wideband circularly polarized cross‐dipole antenna with folded ground plane

Ke Chen, Y. En, Yun Huang, 2021, IET Microwaves, Antennas & Propagation.

Total Dose Ionizing Radiation Effects in the Indium–Zinc Oxide Thin-Film Transistors

Weijing Wu, Lei Wang, Y. En, 2014, IEEE Electron Device Letters.

Hermetic packaging of Kovar alloy and low-carbon steel structure in hybrid integrated circuit (HIC) system using parallel seam welding process

Yunfei En, Xiaoqi He, Xinping Zhang, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Effect of Atmosphere on Electrical Characteristics of AlGaN/GaN HEMTs Under Hot-Electron Stress

Y. En, C. Liu, P. Lai, 2021, IEEE Transactions on Electron Devices.

Analysis of Indium–Zinc–Oxide Thin-Film Transistors Under Electrostatic Discharge Stress

B. Li, Y. En, Yuan Liu, 2018, IEEE Transactions on Electron Devices.

Total Ionizing Dose Radiation Effects in the P-Type Polycrystalline Silicon Thin Film Transistors*

Liu Yuan, Y. En, Yurong Liu, 2017 .

Low frequency noise and radiation response in the partially depleted SOI MOSFETs with ion implanted buried oxide

B. Li, Lu Yudong, Yuan Liu, 2015 .

Notice of RetractionThe failure mode and mechanism analysis of filament in heater of traveling wave tube

Y. En, F. Song, Xiaoqi He, 2013, 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE).

Investigation of radiation-induced degradations in four-junction solar cell by experiment and simulation

Y. En, C. Peng, Z. Lei, 2020 .

A Wideband Circularly Polarized Microstrip Antenna With Multiple Modes

L. Wang, Y. En, 2020, IEEE Open Journal of Antennas and Propagation.

Broadband circularly polarized dielectric resonator antenna with L‐shaped dielectric resonator strips

Y. En, Lei Wang, 2021, International Journal of RF and Microwave Computer-Aided Engineering.

Degradation mechanisms of AlGaN/GaN HEMTs under 800 MeV Bi ions irradiation

Y. Huang, Zhiguo Zhang, H. Chen, 2018, Microelectron. Reliab..

Microstructural design in ultrafine interconnects under current stressing

Y. En, Zhiheng Huang, Hua Xiong, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Degradation characteristics and analysis of AlGaN/GaN high electron mobility transistors under reverse gate bias step stress

Y. En, Yun Huang, P. Lai, 2013, Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Effect of temperature on the electrical properties of a metal-ferroelectric (SrBi2Ta2O9)-insulator (HfTaO)-silicon capacitor

Y. En, X. Wang, Z. Lei, 2015 .

Effects of surface tension and axis stress on piezoelectric behaviors of ferroelectric nanowires

Xiaojing Zheng, Y. En, Y. Chen, 2011 .

Single Event Effects in COTS Ferroelectric RAM Technologies

Bin Li, Hui Chen, Bin Wang, 2015, 2015 IEEE Radiation Effects Data Workshop (REDW).

Magnetic Near-Field Measurement With a Differential Probe to Suppress Common Mode Noise

L. Wang, Y. En, Yun Huang, 2019, IEEE Sensors Journal.

A new broadband circularly polarized square‐slot antenna with low axial ratios

Y. En, Yun Huang, Bin Yao, 2018, International Journal of RF and Microwave Computer-Aided Engineering.

A New Broadband Circularly Polarized Monopole Antenna With Modified Ground

Y. En, Yun Huang, Bin Yao, 2018, 2018 12th International Symposium on Antennas, Propagation and EM Theory (ISAPE).

Reliability assessment of Algangan Hemts for high voltage applications based on high temperature reverse bias test

Y. En, Ruguan Li, Yiqiang Chen, 2014, 2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS).

Degradation mechanism of AlGaN/GaN HEMTs during high temperature operation stress

Y. En, C. Peng, Y. Chen, 2017 .

Analysis of low frequency noise characteristics in p-type polycrystalline silicon thin film transistors

Y. En, Yuan Liu, F. Wenxiao, 2017 .

Hydrogen effects on AlGaN/GaN MISFET with LPCVD-SiNx gate dielectric

Y. En, Yiqiang Chen, Yun Huang, 2019, Semiconductor Science and Technology.

The analysis of ESD degradation in p-type poly-Si thin film transistor

Y. En, Yuan Liu, Kai Liu, 2016, 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT).

Temperature dependence of conduction and low frequency noise characteristics in GaN Schottky barrier diodes

Li Wang, Y. En, Yuan Liu, 2020 .

Effect of Cryogenic Storage on Reliability of the BGA Interconnect Solder Joint

R. Yao, Y. En, Xingguo Fu, 2018, IOP Conference Series: Materials Science and Engineering.

Thermal resistance measurement of packaged SiC MOSFETs by transient dual interface method

Y. En, Y. Chen, Y. Huang, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Effect of Hydrogen on Electrical Properties of Metal-Ferroelectric (SrBi2Ta2O9)–Insulator (HfTaO)–Silicon Capacitor

Y. En, Z. Lei, X. B. Xu, 2015, IEEE Electron Device Letters.

A Fast Extraction Method of Energy Distribution of Border Traps in AlGaN/GaN MIS-HEMT

Z. Ji, Y. En, Yijun Shi, 2020, IEEE Journal of the Electron Devices Society.

Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints

Lu Yudong, Y. En, Z. Zhuang, 2009 .

Pre-designed Prognostic cells for host circuits reliability monitoring

Ming Wan, Hong-Wei Luo, Yu-Dong Lu, 2011, 2011 International Conference on Electric Information and Control Engineering.

Failure modes of Sn3.0Ag0.5Cu flip-chip solder joints under current stress

Y. En, X. He, Xin Wang, 2009, 2009 8th International Conference on Reliability, Maintainability and Safety.

Failure mechanism of Sn3.0Ag0.5Cu flip-chip solder joints under electric current stress

Y. En, X. He, Xin Wang, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Ductile-to-brittle transition of flip-chip solder joints influenced by electromigration

M. Pecht, Y. En, X. He, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Mechanical Properties of Flip-Chip Solder Joints Effected by Electromigration

Y. En, Y. Lu, X. He, 2011 .

Effect of Grain Orientation and Microstructure Evolution on Electromigration in Flip-Chip Solder Joint

R. Yao, Y. En, Xingguo Fu, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Failure Mechanism of Electromigration in Solder Joint

Y. En, Y. Lu, X. He, 2008 .

Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature

R. Yao, Y. En, Xingguo Fu, 2019, Materials.

Reliability of Mutil-Layer ceramic capacitor and its conduction mechanism under high electric field

Y. En, Xin Wang, M. Wan, 2011, 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering.

The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface

Si Chen, Fei Qin, Yunfei En, 2018, Microelectron. Reliab..

Electromagnetic Pattern Extraction and Grouping for Near-Field Scanning of Integrated Circuits by PCA and K-Means Approaches

Lei Wang, Wenxiao Fang, Chengyang Luo, 2019, IEEE Transactions on Electromagnetic Compatibility.

Total-Ionizing-Dose Induced Coupling Effect in the 130-nm PDSOI I/O nMOSFETs

Yunfei En, Shichang Zou, Zhiyuan Hu, 2014, IEEE Electron Device Letters.

Contrast Experiments of Pig Positive and Negative Hydrogen Ion Sources for Neutron Tubes

Y. En, Z. Lei, Yang Liu, 2020 .

Electromagnetic interference effects in the bipolar voltage comparators

Yuan Liu, Y. En, Jianbo Liu, 2014, 2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS).

Effect of solder joint parameter on vibration fatigue reliability of high density PCB assembly

Yunfei En, Xueli Qi, Y. En, 2011, 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering.

Wideband circularly polarized cross‐dipole antenna with parasitic metallic cuboids

Y. En, Lei Wang, Zhang‐ming Zhu, 2021, International Journal of RF and Microwave Computer-Aided Engineering.

Broadband Circularly Polarized Cross-Dipole Antenna With Multiple Modes

Yun Huang, Bin Yao, Lei Wang, 2020, IEEE Access.

Effect of Moisture Stress on the Resistance of HfO2/TaOx-Based 8-Layer 3D Vertical Resistive Random Access Memory

Xiaoxin Xu, Y. En, Yiqiang Chen, 2020, IEEE Electron Device Letters.

Low-Frequency Noise in Hybrid-Phase- Microstructure ITO-Stabilized ZnO Thin-Film Transistors

Y. En, Yuan Liu, Yiqiang Chen, 2018, IEEE Electron Device Letters.

Investigation of Threshold Ion Range for Accurate Single Event Upset Measurements in Both SOI and Bulk Technologies

Zhengsheng Han, Yunfei En, Kai Xi, 2014, IEEE Transactions on Nuclear Science.

Effect of Hydrogen on Defects of AlGaN/GaN HEMTs Characterized by Low-Frequency Noise

Y. En, Y. Chen, Y. Huang, 2018, IEEE Transactions on Electron Devices.

Total-dose-induced edge effect in SOI NMOS transistors with different layouts

Jie Liu, Qian Shi, Hongwei Luo, 2010, Microelectron. Reliab..

Noncontact RF Voltage Sensing of a Printed Trace via a Capacitive-Coupled Probe

Lei Wang, Wenxiao Fang, Haimi Qiu, 2018, IEEE Sensors Journal.

A new broadband circularly polarized dielectric resonator antenna: Using parasitic elements

L. Wang, Y. En, Yan Chen, 2021 .

Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications

Zhangming Zhu, Yunfei En, Chenbing Qu, 2021, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Temperature-Dependent Drain Current Characteristics and Low Frequency Noises in Indium Zinc Oxide Thin Film Transistors*

Weijing Wu, Lei Wang, Y. En, 2015 .

Investigation of Negative Bias Temperature Instability Effect in Partially Depleted SOI pMOSFET

Rui Gao, Yunfei En, Yun Huang, 2020, IEEE Access.

A Comparative Study of AC Positive Bias Temperature Instability of Germanium nMOSFETs With GeO₂/Ge and Si-cap/Ge Gate Stack

Z. Ji, Y. En, Hong Yang, 2021, IEEE Journal of the Electron Devices Society.

A Comparative Study of AC Positive Bias Temperature Instability of Germanium nMOSFETs with GeO2/Ge and Si-cap/Ge Gate Stack A Comparative Study of AC Positive Bias Temperature Instability of Germanium nMOSFETs with GeO2/Ge and Si-cap/Ge Gate

Z. Ji, Y. En, Hong Yang, 2021 .

Reliability Investigations of AlGaN/GaN HEMTs Based on On-State Electroluminescence Characterization

Yun Huang, Ping Lai, Yi-Qiang Chen, 2015, IEEE Transactions on Device and Materials Reliability.

Systematic Characterization of Dual Probes for Electromagnetic Near-Field Measurement

L. Wang, Y. En, Yun Huang, 2021, IEEE Sensors Journal.

Layer‐dependent resistance variability assessment on 2048 8‐layer 3D vertical RRAMs

Yunfei En, Dengyun Lei, Zhiyuan He, 2019, Electronics Letters.

Influence of Buried Oxide Si+ Implantation on TID and NBTI Effects for PDSOI MOSFETs

Y. En, Yujuan He, C. Peng, 2021, IEEE Transactions on Nuclear Science.

Measurement and Crosstalk Analysis of Hexagonal TSV Bundle in 3D ICs

Y. En, Zhangming Zhu, Chenbing Qu, 2020, 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT).

Movable Noncontact RF Current Measurement on a PCB Trace

Yiqiang Chen, Yuan Liu, Ping Lai, 2017, IEEE Transactions on Instrumentation and Measurement.

Symmetrical double‐loop H‐field probe with floating shield for improving sensitivity and electric field suppression

R. Yao, Y. En, Yun Huang, 2021, IET Microwaves, Antennas & Propagation.

Simultaneous Measurement of Electric and Magnetic Fields With a Dual Probe for Efficient Near-Field Scanning

Y. En, Yun Huang, Yuandong Guo, 2019, IEEE Transactions on Antennas and Propagation.

Loading rate and size effect on the fracture behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects

Y. En, H. Qin, Xin-Ping Zhang, 2012 .

Radiation induced transconductance overshoot in the 130 nm partially-depleted SOI MOSFETs

Yuan Liu, Zhengxuan Zhang, Yunfei En, 2017, Microelectron. Reliab..

Utilizing a shallow trench isolation parasitic transistor to characterize the total ionizing dose effect of partially-depleted silicon-on-insulator input/output n-MOSFETs

Huixiang Huang, Zhengxuan Zhang, Y. En, 2014 .

Experiment and numerical simulation of total dose effects in the substrate PNP transistors

Yuan Liu, Y. En, Yujuan He, 2013, 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE).

Research on Negative Bias Temperature Instability Effects Under the Coupling of Total Ionizing Dose Irradiation for PDSOI MOSFETs

Zhifeng Lei, Zhangang Zhang, Chao Peng, 2021, IEEE Access.

A study on the total-dose response for modified silicon-on-insulator materials with the pseudo-MOS method

Jun Jiang, Hongwei Luo, Zhengxuan Zhang, 2006 .

Thermal Annealing of Total Ionizing Dose Effect for Partially-Depleted SOI MOSFET

Y. En, C. Peng, Z. Lei, 2020, 2020 20th European Conference on Radiation and Its Effects on Components and Systems (RADECS).

Influence of Total Ionizing Dose Irradiation on Low-Frequency Noise Responses in Partially Depleted SOI nMOSFETs

Y. En, Yuan Liu, Chen Yiqiang, 2017 .

The effect of Pb content on the solidification behavior and shear performance of Sn3.0Ag0.5Cu/Cu joint

Y. En, Bin Zhou, Xunping Li, 2014, 2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS).

Cracking failure of Cu pillar bump caused by electromigration and stress concentration under thermo-electric coupling loads

Y. En, Yun Huang, Bin Yao, 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).