R. Blanc

发表

Design of integrated capacitive modulators for 56Gbps operation

Frederic Boeuf, Charles Baudot, Sebastien Cremer, 2016, 2016 IEEE 13th International Conference on Group IV Photonics (GFP).

Low loss poly-silicon for high performance capacitive silicon modulators.

Charles Baudot, Frédéric Boeuf, Delphine Marris-Morini, 2018, Optics express.

SiGe-enhanced Si capacitive modulator integration in a 300 mm silicon photonics platform for low power consumption.

C. Euvrard, R. Beneyton, S. Kerdilès, 2019, Optics express.

Etch mechanisms of low dielectric constant polymers in high density plasmas: Impact of charging effects on profile distortion during the etching process

M. Assous, R. Blanc, D. Fuard, 2001 .

Copper-SilK integration in a 0.18 /spl mu/m double level metal interconnect

Yves Morand, Christian Arvet, T. Mourier, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

Analyses of the chemical topography of silicon dioxide contact holes etched in a high density plasma source

R. Blanc, O. Joubert, P. Berruyer, 1997 .

Patterning of silicon nitride for CMOS gate spacer technology. II. Impact of subsilicon surface carbon implantation on epitaxial regrowth

F. Leverd, R. Blanc, C. Jenny, 2014 .

Patterning of silicon nitride for CMOS gate spacer technology. I. Mechanisms involved in the silicon consumption in CH3F/O2/He high density plasmas

F. Leverd, R. Blanc, O. Joubert, 2013 .

Conformity of Aluminum Thin Films Deposited onto Micro‐Patterned Silicon Wafers by Pulsed Laser Deposition, Magnetron Sputtering, and CVD

R. Blanc, A. Thomann, Lyacine Aloui, 2011 .

Patterning of silicon nitride for CMOS gate spacer technology. III. Investigation of synchronously pulsed CH3F/O2/He plasmas

F. Leverd, R. Blanc, M. Darnon, 2014 .

Towards high NA patterning readiness: materials, processes and etch transfer for P24 Line Space

E. Hendrickx, M. J. Maslow, P. Bezard, 2021, Photomask Technology.

Challenge of ashing and cleaning on SiOC-H dielectric: characterization and main issues

P. Brun, D. Louis, M. Assous, 2002 .

Wet or plasma clean? Competing or complementary? A dual damascene study with Si-OC-H dielectric on copper wiring

Christian Arvet, M. Assous, P. Brun, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).