A. Prisacaru

发表

Study of Thermal Aging Behavior of Epoxy Molding Compound for Applications in Harsh Environments

B. Han, A. Inamdar, A. Prisacaru, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

B. Han, A. Prisacaru, P. Gromala, 2019, IEEE Sensors Journal.

High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

B. Han, A. Inamdar, A. Prisacaru, 2021 .

Nano- and Micromechanical Parameters of AISI 316L Steel

D. Vilotić, A. Prisacaru, D. Grabco, 2020, Surface Engineering and Applied Electrochemistry.

The surface morphology and strength properties of SiO2-P2O5-Nd2O3 glassy films

A. Prisacaru, D. Ursu, D. Grabko, 2012 .

Effect of Spin Coating Technique on Mechanical Properties of Silicophosphate Thin Film Doped by Neodymium

A. Prisacaru, E. Harea, M. Elisa, 2016 .

Densification contribution as a function of strain rate under indentation of terbium-doped aluminophosphate glass

A. Prisacaru, E. Harea, M. Elisa, 2016, Journal of Materials Science.

Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes

Winco K. C. Yung, Xuejun Fan, Guoqi Zhang, 2020, Laser & Photonics Reviews.

Non-linear Viscoelastic Modeling of Epoxy Based Molding Compound for Large Deformations Encountered in Power Modules

B. Han, A. Prisacaru, P. Gromala, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison

Bernhard Wunderle, Peter Meszmer, Przemyslaw Jakub Gromala, 2021 .

Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter

Bongtae Han, Dae-Suk Kim, Przemyslaw Jakub Gromala, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit

Bongtae Han, Dae-Suk Kim, Przemyslaw Jakub Gromala, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach

Bongtae Han, Guo Qi Zhang, Przemyslaw Gromala, 2022, IEEE Transactions on Industrial Electronics.

Aging of the Molding Compound Identification using Piezoresistive Silicon Based Stress Sensor

A. Prisacaru, P. Gromala, 2021, International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

Bongtae Han, Guo Qi Zhang, Przemyslaw Jakub Gromala, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor

Bongtae Han, Tobias Melz, Dirk Mayer, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Simulation Driven Design of Novel Integrated Circuits -- Physics of Failure Simulation of the Electronic Control Modules for Harsh Environment Application

Bongtae Han, Tobias Melz, Matthias Werner, 2016, Electronic Components and Technology Conference.

Effect of Long-Term Holding Under Contact Loading on the Specific Features of Phase Changes in Silicon

A. Burlacu, A. Prisacaru, O. Shikimaka, 2015, Materials Science.

Influence of loading holding time under quasistatic indentation on electrical properties and phase transformations of silicon

A. Burlacu, A. Prisacaru, L. Bruk, 2012 .

Features of the mechanical properties of phosphate glasses doped with rare earth elements under indentation

A. Prisacaru, D. Ursu, M. Elisa, 2012 .

$In\ Situ$ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

Bongtae Han, Guo Qi Zhang, Andreas Theissler, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

In-situ service load monitoring of automotive electronic systems using silicon-based piezoresistive stress sensor

Yu-Hsiang Yang, Przemyslaw Jakub Gromala, Bongtae Han, 2020 .

Interface Fracture Toughness Characterization in Electronic Packages Using the Crack Surface Displacement Extrapolation Method

A. Prisacaru, P. Gromala, J. Keller, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).