P. Gromala
发表
B. Han,
A. Inamdar,
A. Prisacaru,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
B. Han,
A. Prisacaru,
P. Gromala,
2019,
IEEE Sensors Journal.
Bongtae Han,
Przemyslaw Jakub Gromala,
Alicja Palczynska,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
A. Inamdar,
P. Gromala,
A. Prisacaru,
2022,
Reliability of Organic Compounds in Microelectronics and Optoelectronics.
B. Han,
A. Inamdar,
A. Prisacaru,
2021
.
P. Gromala,
A. Sasi,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
P. Gromala,
K. Jansen,
L. Ernst,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
S. Rzepka,
P. Gromala,
Daniel Riegel,
2022,
Microelectronics Reliability.
B. Han,
F. Welschinger,
P. Gromala,
2019,
Constitutive Models for Rubber XI.
B. Han,
A. Prisacaru,
P. Gromala,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
P. Gromala,
Yan Hong,
D. Papathanassiou,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
P. Gromala,
K. Jansen,
H. Yan,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
P. Gromala,
K. Jansen,
L. Ernst,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
P. Gromala,
K. Jansen,
L. Ernst,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Bernhard Wunderle,
Peter Meszmer,
Przemyslaw Jakub Gromala,
2021
.
Bernhard Wunderle,
Mehryar Majd,
Peter Meszmer,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
A. Zimmermann,
B. Wunderle,
P. Gromala,
2023,
Microelectronics Reliability.
Bongtae Han,
Dae-Suk Kim,
Przemyslaw Jakub Gromala,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Bongtae Han,
Przemyslaw Gromala,
Alicja Palczynska,
2018,
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Bongtae Han,
Dae-Suk Kim,
Przemyslaw Jakub Gromala,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Bongtae Han,
Guo Qi Zhang,
Przemyslaw Gromala,
2022,
IEEE Transactions on Industrial Electronics.
Bongtae Han,
Dae-Suk Kim,
Arjun Yadur,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
C. Silber,
L. J. Ernst,
P. Gromala,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
A. Prisacaru,
P. Gromala,
2021,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Bongtae Han,
Guo Qi Zhang,
Przemyslaw Jakub Gromala,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Bongtae Han,
Tobias Melz,
Dirk Mayer,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Tobias Melz,
Sven Rzepka,
Dirk Mayer,
2015
.
Bongtae Han,
Tobias Melz,
Dirk Mayer,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Bongtae Han,
Tobias Melz,
Matthias Werner,
2016,
Electronic Components and Technology Conference.
Bongtae Han,
Przemyslaw Gromala,
Alicja Palczynska,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
A. Sasi,
A. Yadur,
P. Gromala,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
A. Andreescu,
S. Fischer,
P. Gromala,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
M. Hawryluk,
P. Gromala,
M. Dressler,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
S. Rzepka,
P. Gromala,
J. Reichelt,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Bongtae Han,
Guo Qi Zhang,
Andreas Theissler,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yu-Hsiang Yang,
Przemyslaw Jakub Gromala,
Bongtae Han,
2020
.
Sven Rzepka,
Przemyslaw Jakub Gromala,
S. Rzepka,
2018
.
B. Vandevelde,
R. Dudek,
S. Rzepka,
2021,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
A. Prisacaru,
P. Gromala,
J. Keller,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
R. Thewes,
P. Gromala,
Jingyao Sun,
2022,
IEEE Sensors Journal.