S. Lee
发表
M. Tsai,
Y. Chen,
S. Lee,
2008,
IEEE Transactions on Components and Packaging Technologies.
M. Tsai,
Y. Chen,
S. Lee,
2006,
2006 International Conference on Electronic Materials and Packaging.
S. Lee,
J. Lo,
J. Lam,
2006,
2006 1st Electronic Systemintegration Technology Conference.
S. Lee,
R. Hon,
S. Zhang,
2005,
2005 7th Electronic Packaging Technology Conference.
J. Lau,
S. Lee,
2002
.
S. Lee,
F. Song,
2006,
56th Electronic Components and Technology Conference 2006.
Mingyu Li,
Jongmyung Kim,
Daewon Kim,
2008,
IEEE Transactions on Advanced Packaging.
S. Lee,
H. Chen,
Yutian Ding,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
L. Weng,
S. Lee,
S. Zhang,
2005,
2005 6th International Conference on Electronic Packaging Technology.
J. Lau,
S. Lee,
J. Lau,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
J. H. Lau,
J. Lau,
S. Lee,
2000
.
John H. Lau,
J. Lau,
S. Lee,
2001
.
John H. Lau,
J. Lau,
S. Lee,
2002
.
J. Lau,
S. Lee,
D. Shangguan,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
J. Lau,
S. Lee,
D. Shangguan,
2006,
56th Electronic Components and Technology Conference 2006.
M. Osterman,
M. Pecht,
Fubin Song,
2009,
IEEE Transactions on Components and Packaging Technologies.
S. Lee,
Ming Li,
Xingjia Huang,
2004,
IEEE Transactions on Electronics Packaging Manufacturing.
S. Lee,
Y. S. Chan,
2006,
2006 International Conference on Electronic Materials and Packaging.
S. Lee,
S.W. Lee,
1989,
Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.
S. Lee,
K.H. Lee,
S.W.R. Lee,
2006,
2006 8th Electronics Packaging Technology Conference.
S. Lee,
J. Lo,
Y. S. Chan,
2008,
2008 International Conference on Electronic Materials and Packaging.
S. Lee,
S. Lee,
Xuejun Fan,
2010
.
C. Ouyang,
J. Lau,
S. Lee,
1999,
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
S. Lee,
X. Zhang,
1998,
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).
S. Lee,
D. Lau,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
J. Lau,
S. Lee,
C. Chang,
1999,
Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).
S. Lee,
Xingjia Huang,
Wan Sze Tse,
2000,
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
J. H. Lau,
Chien Ouyang,
C. Ouyang,
1999
.
S. Lee,
J. Lo,
W. Wong,
2007,
2007 International Symposium on High Density packaging and Microsystem Integration.
S. Lee,
T. Jiang,
J. Lo,
2008,
Electronic Components and Technology Conference.
John H. Lau,
S. Lee,
J. Lau,
2000,
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).
Fubin Song,
S. Clark,
K. Newman,
2007,
2007 9th Electronics Packaging Technology Conference.
S. Lee,
F. Song,
2006,
56th Electronic Components and Technology Conference 2006.
Yuming Ye,
Y.S. Chan,
S.W.R. Lee,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
S.W.R. Lee,
Y.K. Tsui,
S. Lee,
2005,
IEEE Transactions on Advanced Packaging.
D. Lau,
S. Lee,
S.W.R. Lee,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Jang-Kyo Kim,
Matthew Ming Fai Yuen,
M. Yuen,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
J. Lau,
S. Lee,
2003
.
Xingjia Huang,
S. Lee,
Shi-Wei Ricky Lee,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
S. Lee,
S. Lee,
B.H.W. Lui,
2002,
2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).
John H. Lau,
J. Lau,
S. Lee,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
Xingjia Huang,
S. Lee,
Chien Chun Yan,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
John H. Lau,
S. Lee,
J. Lau,
2000,
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).
Fubin Song,
S. Clark,
K. Newman,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Fubin Song,
S. Clark,
K. Newman,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Fubin Song,
S. Clark,
K. Newman,
2007,
2007 9th Electronics Packaging Technology Conference.
S. Lee,
F. Song,
2006,
2006 1st Electronic Systemintegration Technology Conference.
S. Lee,
F. Song,
2005,
2005 6th International Conference on Electronic Packaging Technology.
S. Lee,
B. Kondori,
Qiming Zhang,
2021,
Analysis and Prevention of Component and Equipment Failures.
S. Lee,
Ming Li,
Xingjia Huang,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
S. Lee,
R. Hon,
S. Zhang,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
S. Lee,
Xingjia Huang,
Y. Tsui,
2002,
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002..
Yuming Ye,
D. Lau,
Y.S. Chan,
2006,
2006 7th International Conference on Electronic Packaging Technology.
M. Osterman,
M. Pecht,
M. Pecht,
2009,
IEEE Transactions on Components and Packaging Technologies.
S. Lee,
J. Lam,
2008,
2008 10th Electronics Packaging Technology Conference.
S. Lee,
S. Kwak,
J. Choi,
2007
.
S. Lee,
J. Lo,
2004,
Electronic Packaging Technology Conference.
S. Lee,
J. Lam,
2008,
2008 2nd Electronics System-Integration Technology Conference.
K. Lam,
S. Lee,
2007,
Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
S. Lee,
J. Lo,
C. Li,
2005,
2005 International Symposium on Electronics Materials and Packaging.
M. Yuen,
S. Lee,
J. Lo,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).