Seungbae Park

发表

C. Sun, Seungbae Park, Chin-teh Sun, 1995 .

Seungbae Park, Soonwan Chung, 2013, Journal of Mechanical Science and Technology.

Yuling Niu, Seungbae Park, Seungbae Park, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Seungbae Park, Chongyang Cai, K. Pan, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Seungbae Park, Kyung-Woon Jang, Min-Young Park, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Seungbae Park, C. Yoo, A. Park, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Seungbae Park, Seungbae Park, I. Ahmed, 2007 .

Gregory P. Carman, Seungbae Park, G. Carman, 1997 .

Seungbae Park, Junbo Yang, Jiefeng Xu, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

G. Fountain, L. Mirkarimi, Seungbae Park, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Seungbae Park, Gamal Refai-Ahmed, Jing Wang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Seungbae Park, Chongyang Cai, K. Pan, 2022, 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).

Seungbae Park, K. Pan, Charandeep Singh, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Seungbae Park, Huayan Wang, Shuai Shao, 2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Seungbae Park, Yuling Niu, Jing Wang, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Laurene Yip, Gamal Refai-Ahmed, Yuling Niu, 2018, Electronic Components and Technology Conference.

Seungbae Park, Chongyang Cai, K. Pan, 2022, 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).

Seungbae Park, K. Pan, Junbo Yang, 2021, 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).

Seungbae Park, Huayan Wang, Van-Lai Pham, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Da Yu, Soonwan Chung, Tung T. Nguyen, 2011, Microelectron. Reliab..

B. Sammakia, Seungbae Park, Seungbae Park, 2007, IEEE Transactions on Components and Packaging Technologies.

Seungbae Park, Haojun Zhang, 2009, 2009 59th Electronic Components and Technology Conference.

D. C. Sun, Seungbae Park, R. Yang, 2006 .

Seungbae Park, Chongyang Cai, Huayan Wang, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Seungbae Park, K. Pan, Huayan Wang, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Seungbae Park, Chongyang Cai, K. Pan, 2019, Procedia Manufacturing.

Seungbae Park, Tung T. Nguyen, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Seungbae Park, Chongyang Cai, K. Pan, 2022, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Seungbae Park, K. Pan, Huayan Wang, 2019, Procedia Manufacturing.

Seungbae Park, Chongyang Cai, K. Pan, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Seungbae Park, Seungbae Park, L. Lehman, 2007, IEEE Transactions on Components and Packaging Technologies.

Donggun Lee, Jae B. Kwak, Tung T. Nguyen, 2010, Microelectron. Reliab..

Seungbae Park, Yangyang Lai, J. Ha, 2023, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Seungbae Park, Chongyang Cai, K. Pan, 2022, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Seungbae Park, Chongyang Cai, K. Pan, 2022, Soldering & Surface Mount Technology.

C. Okoro, Seungbae Park, K. Pan, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Seungbae Park, S. Cain, K. Pan, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Seungbae Park, Yuling Niu, Jing Wang, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Tung T. Nguyen, Seungbae Park, Seungbae Park, 2011, Microelectron. Reliab..

Seungbae Park, C. T. Sun, Seungbae Park, 1994, Smart Structures.

Yuling Niu, Satish C. Chaparala, Seungbae Park, 2013 .

Gregory P. Carman, Seungbae Park, G. Carman, 1997 .

Da Yu, Soonwan Chung, Seungbae Park, 2012 .

Jae Kwak, Da Yu, Seungbae Park, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Xin Zhang, Seungbae Park, M.W. Judy, 2007, Journal of Microelectromechanical Systems.

Zhaoyang Wang, Huimin Xie, Seungbae Park, 2009, Applied optics.

Seungbae Park, Huayan Wang, Pengcheng Yin, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Seungbae Park, Jongman Kim, Harry Schoeller, 2008 .

Seungbae Park, Soonwan Chung, Zhenming Tang, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Yeonsung Kim, Seungbae Park, Seungbae Park, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Satish C. Chaparala, Seungbae Park, Ah-Young Park, 2016, Microelectron. Reliab..

Yeonsung Kim, Seungbae Park, Seungbae Park, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Soonwan Chung, Seungbae Park, Harold Ackler, 2005 .

Da Yu, Seungbae Park, Soonwan Chung, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Da Yu, John Lee, Jae B. Kwak, 2009, 2009 59th Electronic Components and Technology Conference.

Yeonsung Kim, Seungbae Park, Ruiyang Liu, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Seungbae Park, Hohyun Lee, Dapeng Liu, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Soonwan Chung, Seungbae Park, Zhenming Tang, 2007, IEEE Transactions on Advanced Packaging.

Seungbae Park, Junghyun Cho, Jongman Kim, 2006 .

Hwanjeong Cho, Seungbae Park, Hongchul Lee, 2012 .