R. Joshi

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

Seungbae Park, R. Joshi, I. Ahmed, 2008 .

Thermomechanical behavior of organic and ceramic flip chip BGA packages under power cycling

R. Joshi, S.B. Park, B. Sammakia, 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

How Much Baking Time is Needed for Moisture-Sensitive Packages?

R. Joshi, Xuejun Fan, K. Newman, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages

Rahul Joshi, S. B. Park, R. Joshi, 2008, Microelectron. Reliab..

Reliability of lead-free copper columns in comparison with tin-lead solder column interconnects

R. Joshi, L. Goldmann, S.B. Park, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Comparative Analysis of BGA Deformations and Strains Using Digital Image Correlation and Moiré Interferometry

Seungbae Park, Ramji Dhakal, Seungbae Park, 2005 .

Investigation on the Behavior of Detonation Gun Sprayed Stellite-6 Coating on T-22 Boiler Steel in Actual Boiler Environment

Y. Sharma, R. Joshi, Anuranjan Sharda, 2019, Proceedings of the 1st International Conference on Smart Innovation, Ergonomics and Applied Human Factors (SEAHF).