Guotao Wang

发表

Investigation of interfacial delamination for Cu/low k structures during flip-chip packaging

P. Ho, Guotao Wang, S. Groothuis, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Effect of packaging on interfacial cracking in Cu/ low k Damascene structures

Paul S. Ho, S. Groothuis, P. Ho, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Packaging effects on reliability of Cu/low-k interconnects

Paul S. Ho, Steven K. Groothuis, P. Ho, 2003 .

Interfacial fracture mechanics: chip-level interconnect reliability

P. Ho, Guotao Wang, S. Groothuis, 2003, Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488).

Thermal deformation analysis on flip-chip packages using high resolution moire interferometry

Paul S. Ho, Min Ding, P. Ho, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

New Method of Mix Design for Self-Compacting Concrete Based on Material Characteristics

Guotao Wang, Jiangxiong Wei, Qijun Yu, 2012 .

A Finite Element Method to Investigate Electrical Contact Behaviors Considering Asperity Interactions

Guotao Wang, W. Ren, Chao Zhang, 2020, 2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM).

Packaging effect on reliability for Cu/low k structures

P. Ho, Guotao Wang, S. Groothuis, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

Thermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structures

Guotao Wang, 2004 .

Research on the hot tensile deformation mechanism of Ti-6Al-4V alloy sheet based on the α+β dual phase crystal plasticity modeling

Bangcheng Zhang, Guotao Wang, Qi-han Li, 2022, Journal of Alloys and Compounds.

Electromigration in solder joints: A cross-sectioned model system for real-time observation

M. Mayer, Guotao Wang, D. Xu, 2021 .

Reliability issues for flip-chip packages

Xiang Dai, Guotao Wang, Paul S. Ho, 2004, Microelectron. Reliab..

Effect of contact metallization on electromigration reliability of Pb-free solder joints

Peng Su, Paul S. Ho, Min Ding, 2006 .

Electromigration study of high lead solders in flip-chip packages using the Wheatstone bridge method

P. Ho, H. Matsuhashi, Guotao Wang, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Reliability challenges and recent advances for Cu interconnects

Ki-Don Lee, P. Ho, Ki-Don Lee, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Chip-packaging interaction: a critical concern for Cu/low k packaging

Guotao Wang, Paul S. Ho, Steven Groothuis, 2005, Microelectron. Reliab..

Packaging effect on reliability of Cu/low k interconnects

Guotao Wang, P.S. Ho, S. Groothuis, 2004, 2004 IEEE Workshop on Microelectronics and Electron Devices.

A study of electromigration failure in Pb-free solder joints

Peng Su, Min Ding, P. Ho, 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..

Experimental Study on Fracture Mechanism of Aluminum Plates in Tension and Laser Irradiation with High Temperature Moiré Interferometry

D. Fang, H. Shang, F. Dai, 2004 .

Copper die bumps (first level interconnect) and low-K dielectrics in 65nm high volume manufacturing

S. Balakrishnan, C. Pelto, G. Leatherman, 2006, 56th Electronic Components and Technology Conference 2006.

Oxygen recoil implant from SiO2 layers into single-crystalline silicon

S. Banerjee, Guotao Wang, A. Tasch, 2001 .

Thermal stress and debonding in Cu/low k damascene line structures

Paul S. Ho, P. Ho, Guotao Wang, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).