Jianjun Wang

发表

Sheng Liu, Zhengfang Qian, Daqing Zou, 1999 .

Zhengfang Qian, Sheng Liu, Daqing Zou, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Sheng Liu, Daqing Zou, Jianjun Wang, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Jianjun Wang, D. Zou, Sheng Liu, 1997, Application of Fracture Mechanics in Electronic Packaging.

Jianjun Wang, Ming Lei, Rui-dong Wang, 2021, Materials at High Temperatures.

Kangbo Yuan, Jianjun Wang, W. Meng, 2019, International Journal of Impact Engineering.

Wei-guo Guo, Jianjun Wang, Ziang Wang, 2016, Journal of Materials Engineering and Performance.

P. Zhou, Yu Su, Xin Lin, 2017, Journal of Materials Engineering and Performance.

Jianjun Wang, W. Ren, W. Peng, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Jianjun Wang, S. Quander, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Jianjun Wang, Wei Ren, Jianjun Wang, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Kangbo Yuan, Jianjun Wang, Xueyao Hu, 2019, Journal of Applied Polymer Science.

Zhengfang Qian, Sheng Liu, Daqing Zou, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Jianjun Wang, Yanping Li, Jin Guo, 2019, Journal of Theoretical and Applied Mechanics.