Tae-Wan Kim

Nanofiber Anisotropic Conductive Films (ACF) for Ultra-Fine-Pitch Chip-on-Glass (COG) Interconnections

K. Paik, Kyung-lim Suk, S. H. Lee, 2015, Journal of Electronic Materials.

Low temperature flex-on-flex assembly using polyvinylidene fluoride nanofiber incorporated Sn58Bi solder anisotropic conductive films and vertical ultrasonic bonding

K. Paik, Kyung-lim Suk, S. H. Lee, 2013 .

Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Wansun Kim, K. Paik, Tae-Wan Kim, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn–Ag Microbump

K. Paik, Tae-Wan Kim, Taek‐Soo Kim, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100- $\mu \text{m}$ -Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method

K. Paik, Tae-Wan Kim, Shuye Zhang, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Nanofiber ACFs (anisotropic conductive films) for ultra-fine pitch interconnection

K. Paik, Tae-Wan Kim, Sang-Hoon Lee, 2015, 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO).

Effect of aligned nanofiber in nanofiber solder anisotropic conductive films (ACFs) on the solder ball movement for flex-on-flex (FOF) assembly

K. Paik, Tae-Wan Kim, Sang-Hoon Lee, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding

Shuye Zhang, Kyung-Wook Paik, K. Paik, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.