L. Ye
发表
Carl Zandén,
Lilei Ye,
Johan Liu,
2014
.
Lilei Ye,
Zonghe Lai,
Johan Liu,
1999
.
Johan Liu,
W. Ke,
L. Ye,
2019,
Materials Science and Engineering: A.
Johan Liu,
Xiaowu Hu,
L. Ye,
2018,
International Journal of Applied Mechanics.
Johan Liu,
W. Ke,
L. Ye,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
K. Jeppson,
Johan Liu,
L. Ye,
2016
.
K. Jeppson,
Johan Liu,
T. Xu,
2018,
Advanced Materials Interfaces.
Teng Wang,
Johan Liu,
L. Ye,
2010,
10th IEEE International Conference on Nanotechnology.
Yan Zhang,
Johan Liu,
L. Ye,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
N. Wang,
W. Ke,
2019,
Soldering & Surface Mount Technology.
Johan Liu,
L. Ye,
Xiuzhen Lu,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Johan Liu,
C. Zandén,
Xin Luo,
2016
.
A. Ziaei,
L. Ye,
J. Liu,
2015,
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Johan Liu,
L. Ye,
Yifeng Fu,
2020,
Nanotechnology.
Teng Wang,
Johan Liu,
J. Bielecki,
2012
.
Teng Wang,
Johan Liu,
L. Ye,
2013
.
Johan Liu,
L. Ye,
Si Chen,
2012
.
Johan Liu,
L. Ye,
T. Nilsson,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Johan Liu,
L. Ye,
Xiuzhen Lu,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Johan Liu,
V. Kuzmenko,
I. Mijakovic,
2017
.
Johan Liu,
L. Ye,
Xitao Wang,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Johan Liu,
L. Ye,
Nan Wang,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Peter Enoksson,
Tao Xu,
Per Lundgren,
2019,
Journal of Power Sources.
Johan Liu,
L. Ye,
Nan Wang,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
K. Jeppson,
Johan Liu,
L. Ye,
2016,
2016 China Semiconductor Technology International Conference (CSTIC).
K. Jeppson,
Johan Liu,
L. Ye,
2016
.
Teng Wang,
K. Jeppson,
Johan Liu,
2012
.
Johan Liu,
L. Nyborg,
E. Hryha,
2018
.
Johan Liu,
L. Ye,
Nan Wang,
2019,
Coatings.
Johan Liu,
L. Ye,
Yifeng Fu,
2020,
Journal of Nanobiotechnology.
Josef Hansson,
Lilei Ye,
Torbjorn M.J. Nilsson,
2018
.
Johan Liu,
Xiangfan Xu,
Jie Chen,
2018,
Small.
Johan Liu,
P. Enoksson,
Qi Li,
2020
.
Johan Liu,
L. Ye,
Nan Wang,
2014
.
Johan Liu,
L. Ye,
Nan Wang,
2019,
Chemistry.
Yu Cao,
Johan Liu,
C. Zandén,
2014,
Journal of Materials Science: Materials in Electronics.
Johan Liu,
L. Ye,
Z. Lai,
2001
.
Johan Liu,
A. Sabirsh,
Xiaoqiu Wu,
2021,
ChemistryOpen.
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
Johan Liu,
L. Ye,
Nan Wang,
2019,
2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Josef Hansson,
Lilei Ye,
Johan Liu,
2016,
2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO).
Li Xiao,
L. Ye,
A. Tholen,
2000,
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).
Zonghe Lai,
L. Ye,
J. Liu,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
Johan Liu,
Xin Luo,
L. Ye,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
L. Ye,
Z. Lai,
A. Tholen,
1999,
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
Johan Liu,
L. Ye,
Nan Wang,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
L. Ye,
Yifeng Fu,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Johan Liu,
C. Lambert,
S. Bailey,
2015,
Nature Communications.
L. Ye,
B. Carlberg,
J. Liu,
2012,
2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO).
Lilei Ye,
Björn Carlberg,
Johan Liu,
2012
.
Johan Liu,
L. Ye,
Yifeng Fu,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
K. Jeppson,
Johan Liu,
L. Ye,
2016,
Electronic Materials Letters.
Di Jiang,
Nan Wang,
Lilei Ye,
2015
.
Yan Zhang,
Johan Liu,
J. Bielecki,
2012,
Advanced materials.
Johan Liu,
L. Ye,
Yifeng Fu,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Andreas Nylander,
Josef Hansson,
Majid Kabiri Samani,
2019,
Energies.
K. Jeppson,
Johan Liu,
L. Ye,
2016
.
Lilei Ye,
Teng Wang,
Teng Wang,
2011,
Small.
Johan Liu,
K. Svensson,
L. Ye,
2020,
Nanotechnology.
Johan Liu,
L. Ye,
Dong‐sheng Li,
2011
.
Johan Liu,
L. Ye,
Nan Wang,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
K. Jeppson,
Johan Liu,
L. Ye,
2017
.
Johan Liu,
L. Ye,
Nan Wang,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Johan Liu,
L. Ye,
Yifeng Fu,
2021,
ACS applied materials & interfaces.
K. Jeppson,
Di Jiang,
Lilei Ye,
2012,
IEEE Electron Device Letters.
Johan Liu,
L. Ye,
J. Hansson,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Carl Zandén,
Mikael Syväjärvi,
Lilei Ye,
2014
.
Johan Liu,
L. Ye,
Dongsheng Li,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
L. Ye,
Nan Wang,
Ya Liu,
2019,
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Johan Liu,
L. Ye,
Nan Wang,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
L. Ye,
Maulik Satwara,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
C. Zandén,
Xin Luo,
2013,
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Johan Liu,
L. Ye,
Si Chen,
2015
.
Johan Liu,
A. Fazi,
L. Ye,
2020,
Nanotechnology.
Johan Liu,
L. Ye,
Xitao Wang,
2018,
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
The effects of graphene-based films as heat spreaders for thermal management in electronic packaging
K. Jeppson,
Johan Liu,
W. Ke,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Teng Wang,
Johan Liu,
L. Ye,
2011,
Small.
Yan Zhang,
Johan Liu,
W. Ke,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
L. Ye,
Si Chen,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).