Yifeng Fu

发表

Nanostructured polymer-metal composite for thermal interface material applications

Teng Wang, B. Carlberg, D. Shangguan, 2008, 2008 58th Electronic Components and Technology Conference.

Photoluminescence of an assembly of size-distributed self-assembled InAs quantum dots

A. Larsson, Yifeng Fu, F. Ferdos, 2002 .

Strain and optical transitions in InAs quantum dots on (001) GaAs

A. Larsson, Yifeng Fu, F. Ferdos, 2001 .

Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors

Hongbing Lu, Johan Liu, Yifeng Fu, 2018 .

Electron wave-packet transport through nanoscale semiconductor device in time domain

M. Willander, Yifeng Fu, 2005 .

Quantum transport andI–Vcharacteristics of quantum size field effect transistor

N. Collaert, M. Willander, K. Meyer, 1998 .

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

K. Jeppson, Johan Liu, L. Ye, 2016 .

Ultrafast Transfer of Metal‐Enhanced Carbon Nanotubes at Low Temperature for Large‐Scale Electronics Assembly

Teng Wang, Johan Liu, Yiheng Qin, 2010, Advanced materials.

Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

K. Jeppson, Johan Liu, T. Xu, 2018, Advanced Materials Interfaces.

Chemically vapor deposited carbon nanotubes for vertical electronics interconnect in packaging applications

Johan Liu, Yifeng Fu, D. Jiang, 2014, 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT).

Carbon nanotubes for electronics manufacturing and packaging: from growth to integration

Teng Wang, Johan Liu, Yifeng Fu, 2013 .

Use of Carbon nanotubes in potential electronics packaging applications

Teng Wang, Johan Liu, L. Ye, 2010, 10th IEEE International Conference on Nanotechnology.

Near-ballistic transport and current–voltage characteristics of a GaAs/AlGaAs heterojunction field effect transistor under the influence of impurity scattering

M. Willander, Yifeng Fu, 1997 .

Current and capacitance characteristics of a metal–insulator–semiconductor structure with an ultrathin oxide layer

M. Willander, P. Lundgren, Yifeng Fu, 2001 .

An overview of carbon nanotubes based interconnects for microelectronic packaging

Yan Zhang, Johan Liu, L. Ye, 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Luca Pierantoni, Wei Mu, Kjell Jeppson, 2016, Nanotechnology.

Threshold voltage and charge control considerations in double quantum wellSi/Si1−xGex p-type MOSFETs

O. Nur, M. Willander, Yifeng Fu, 1998 .

Experimental Microwave Complex Conductivity Extraction of Vertically Aligned MWCNT Bundles for Microwave Subwavelength Antenna Design

A. Ziaei, C. Tripon-Canseliet, J. Chazelas, 2019, Micromachines.

Combination of positive charges and honeycomb pores to promote MC3T3-E1 cell behaviour

Johan Liu, A. Lindahl, Yifeng Fu, 2015 .

High porosity and light weight graphene foam heat sink and phase change material container for thermal management

Johan Liu, L. Ye, Yifeng Fu, 2020, Nanotechnology.

Spatially resolved luminescence investigation of AlGaAs/GaAs single quantum wires modified by selective implantation and annealing

M. Willander, H. Tan, C. Jagadish, 1999 .

Selective growth of double-walled carbon nanotubes on gold films

Teng Wang, Johan Liu, J. Bielecki, 2012 .

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Teng Wang, Johan Liu, B. Carlberg, 2012, Nanotechnology.

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors.

K. Jeppson, Johan Liu, Yifeng Fu, 2016, Small.

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

K. Jeppson, Johan Liu, Yifeng Fu, 2015, Journal of Electronic Materials.

Improved flame-retardant properties of polydimethylsiloxane/multi-walled carbon nanotube nanocomposites

A. Yuen, G. Yeoh, Yifeng Fu, 2020, Journal of Materials Science.

Synthesis Methods of Two-Dimensional MoS2: A Brief Review

Xing Fan, Yifeng Fu, Miao Zhao, 2017 .

Scalable three-dimensional Ni3P-based composite networks for flexible asymmertric supercapacitors

Y. Tong, Yifeng Fu, Luyi Chen, 2020 .

Designing two-dimensional electron gases in GaAs/InGaAs/AlGaAs, δ-doped AlGaAs/GaAs, and AlGaAs/InGaAs/GaAs heterostructures for single electron transistor application

M. Willander, Tongtong Wang, Yifeng Fu, 2001 .

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

K. Jeppson, Johan Liu, Yifeng Fu, 2017 .

Compact and low loss electrochemical capacitors using a graphite / carbon nanotube hybrid material for miniaturized systems

Peter Enoksson, Tao Xu, Per Lundgren, 2019, Journal of Power Sources.

Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

Teng Wang, Johan Liu, Yifeng Fu, 2010 .

Hole conduction characteristics of strained Si1−xGex/Si resonant tunneling diode

M. Willander, Yifeng Fu, 2002 .

A lightweight and high thermal performance graphene heat pipe

Hongbing Lu, Johan Liu, D. Mencarelli, 2020, 2002.11336.

RF Properties of Carbon Nanotube / Copper Composite Through Silicon Via Based CPW Structure for 3D Integrated Circuits

Johan Liu, Yifeng Fu, Nan Wang, 2019, 2019 IEEE 14th Nanotechnology Materials and Devices Conference (NMDC).

Reliability Characterization of Graphene Enhanced Thermal Interface Material for Electronics Cooling Applications

Johan Liu, Yifeng Fu, M. Murugesan, 2022, 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Toward ultrahigh thermal conductivity graphene films

Yan Zhang, Johan Liu, Yifeng Fu, 2022, 2D Materials.

1/f noise characterization of Ir/p‐Si and Ir/p‐Si1−xGex low Schottky barrier junctions

O. Nur, M. Willander, Yifeng Fu, 1996 .

Hall factor and drift mobility for hole transport in strained Si1−xGex alloys

Yifeng Fu, G. V. Hansson, W. Ni, 1997 .

Graphene based thermal management system for battery cooling in electric vehicles

Hongbing Lu, T. Thiringer, Johan Liu, 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).

Alloy scattering in GaAs/AlGaAs quantum well infrared photodetector

M. Willander, Yifeng Fu, 2000 .

Hongbing Lu, Johan Liu, A. Balandin, 2019, 2D Materials.

Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers

K. Jeppson, Yifeng Fu, Guofeng Cui, 2019, Materials.

Synthesis of graphene quantum dots and their applications in drug delivery

Johan Liu, L. Ye, Yifeng Fu, 2020, Journal of Nanobiotechnology.

Underwater sound absorption properties of polydimethylsiloxane/carbon nanotube composites with steel plate backing

Zhongxiao Peng, G. Yeoh, Yifeng Fu, 2021 .

A review on polymer-based materials for underwater sound absorption

Zhongxiao Peng, G. Yeoh, Yifeng Fu, 2021 .

Covalent Anchoring of Carbon Nanotube-Based Thermal Interface Materials Using Epoxy-Silane Monolayers

Johan Liu, Yifeng Fu, Mingliang L. Huang, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Modelling and design of quantum dot cellular automata

Magnus Willander, Yifeng Fu, M. Willander, 1998 .

Two-dimensional subwavelength meta-nanopillar array for efficient visible light absorption

Tongtong Wang, Yifeng Fu, Weixing Yu, 2013 .

Optical transition in infrared photodetector based on V-groove Al0.5Ga0.5As/GaAs multiple quantum wire

M. Willander, H. Tan, C. Jagadish, 2001 .

Optical absorption coefficients of semiconductor quantum‐well infrared detectors

M. Willander, Yifeng Fu, Wen-lan Xu, 1995 .

Cooling hot spots by hexagonal boron nitride heat spreaders

Johan Liu, L. Ye, Yifeng Fu, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Functionalization mediates heat transport in graphene nanoflakes

Johan Liu, C. Lambert, S. Bailey, 2015, Nature Communications.

Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

Johan Liu, L. Ye, Yifeng Fu, 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Synthesis and applications of two-dimensional hexagonal boron nitride in electronics manufacturing

K. Jeppson, Johan Liu, L. Ye, 2016, Electronic Materials Letters.

Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

K. Jeppson, Johan Liu, Yifeng Fu, 2016 .

Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon

Johan Liu, Yifeng Fu, M. Murugesan, 2012 .

Flexible Multifunctionalized Carbon Nanotubes‐Based Hybrid Nanowires

Di Jiang, Nan Wang, Lilei Ye, 2015 .

Synergism of Carbon Nanotubes and Graphene Nanoplates in Improving Underwater Sound Absorption Stability under High Pressure

Yifeng Fu, 2022, ChemistrySelect.

Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

Sebastian Volz, Kjell Jeppson, Nan Wang, 2015 .

Templated Growth of Covalently Bonded Three‐Dimensional Carbon Nanotube Networks Originated from Graphene

Yan Zhang, Johan Liu, J. Bielecki, 2012, Advanced materials.

Fine structures of photoresponse spectra in quantum well infrared photodetector

M. Willander, Yifeng Fu, Xuchun Liu, 1999 .

Graphene-CNT hybrid material as potential thermal solution in electronics applications

Johan Liu, L. Ye, Yifeng Fu, 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Controlling the density of CNTs by different underlayer materials in PECVD growth

Johan Liu, S. Tu, Yifeng Fu, 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

A. Ziaei, Johan Liu, S. Xavier, 2013 .

Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material

Andreas Nylander, Josef Hansson, Majid Kabiri Samani, 2019, Energies.

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

K. Jeppson, Johan Liu, L. Ye, 2016 .

Etching trenches to effectively create electron quantum wires for single-electron-transistor applications

M. Willander, Tongtong Wang, Yifeng Fu, 2001 .

Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots

M. Yuen, Johan Liu, Yifeng Fu, 2013 .

Effects of high temperature treatment of carbon nanotube arrays on graphite: increased crystallinity, anchoring and inter-tube bonding

Johan Liu, K. Svensson, L. Ye, 2020, Nanotechnology.

Post-growth processing of carbon nanotubes for interconnect applications - a review

Johan Liu, Yifeng Fu, Shirong Huang, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Optical absorption of p‐type GexSi1−x quantum wells

M. Willander, Yifeng Fu, Wen-lan Xu, 1996 .

A portable micro glucose sensor based on copper-based nanocomposite structure

Dongxue Han, Guofeng Cui, Yifeng Fu, 2019, New Journal of Chemistry.

Chemical vapor deposition grown graphene on Cu-Pt alloys

K. Jeppson, Johan Liu, L. Ye, 2017 .

Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation

Johan Liu, L. Ye, Yifeng Fu, 2021, ACS applied materials & interfaces.

Infrared emissivity measurement for vertically aligned multiwall carbon nanotubes (CNTs) based heat spreader applied in high power electronics packaging

K. Jeppson, Johan Liu, Yifeng Fu, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Room temperature transfer of carbon nanotubes on flexible substrate

Yifeng Fu, J. Liu, Yan Zhang, 2012, 18th International Workshop on THERMal INvestigation of ICs and Systems.

Graphene oxide based coatings on nitinol for biomedical implant applications: effectively promote mammalian cell growth but kill bacteria

Johan Liu, I. Mijakovic, Yifeng Fu, 2016 .

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

K. Jeppson, Di Jiang, Lilei Ye, 2012, IEEE Electron Device Letters.

Preparation of polymer-metal nanocomposite films and performance evaluation as thermal interface material

Teng Wang, B. Carlberg, Yifeng Fu, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Experimental study on electrical properties and stability of CNT bumps in high density interconnects

Johan Liu, Yifeng Fu, Ying Zhou, 2013, 2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013).

Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips

Johan Liu, Yifeng Fu, Yong Zhang, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Heat removal of microchannel coolers with Carbon NanoTube suspension as the coolant

Teng Wang, Yifeng Fu, J. Liu, 2008, 2008 2nd Electronics System-Integration Technology Conference.

A study of fluid coolant with carbon nanotube suspension for microchannel coolers

Teng Wang, Yifeng Fu, J. Liu, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

NEAR-FIELD COUPLING EFFECT IN NORMAL-INCIDENCE ABSORPTION OF QUANTUM-WELL INFRARED PHOTODETECTORS

Magnus Willander, Na Li, Yifeng Fu, 1999 .

Theoretical investigation of electroluminescence and current–voltage characteristics in p-i-n resonant tunneling light emitting diode

M. Willander, Yifeng Fu, 1998 .

Understanding noninvasive charge transfer doping of graphene: a comparative study

P. Hyldgaard, Johan Liu, Yifeng Fu, 2018, Journal of Materials Science: Materials in Electronics.

Multiple growth of graphene from a pre-dissolved carbon source

Johan Liu, A. Fazi, L. Ye, 2020, Nanotechnology.

Graphene heat spreader for thermal management of hot spots

M. Yuen, Johan Liu, Yifeng Fu, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Graphene heat spreader for thermal management of hot spots in electronic packaging

M. Yuen, Johan Liu, Yifeng Fu, 2012, 18th International Workshop on THERMal INvestigation of ICs and Systems.

The effects of graphene-based films as heat spreaders for thermal management in electronic packaging

K. Jeppson, Johan Liu, W. Ke, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Use of graphene-based films for hot spot cooling

Johan Liu, Yifeng Fu, Nan Wang, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Double-Densified Vertically Aligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

K. Jeppson, Johan Liu, Yifeng Fu, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

ABSORPTION OF N-TYPE GE, SI QUANTUM-WELLS FOR NORMAL INCIDENT RADIATION

M. Willander, Yifeng Fu, S. Shen, 1995 .

Reliability of carbon nanotube bumps for chip on glass application

Johan Liu, Yifeng Fu, Shirong Huang, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier

Yan Zhang, Johan Liu, W. Ke, 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Enhanced cold wall CVD reactor growth of horizontally aligned single-walled carbon nanotubes

K. Jeppson, Johan Liu, Yifeng Fu, 2016, Electronic Materials Letters.