J. Liu

发表

Teng Wang, B. Carlberg, D. Shangguan, 2008, 2008 58th Electronic Components and Technology Conference.
Teng Wang, M. Cole, J. Liu, 2012, IEEE Transactions on Nanotechnology.
J. Liu, L. Liu, C. Andersson, 2006, 2006 1st Electronic Systemintegration Technology Conference.
P. Sun, D. Shangguan, J. Liu, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
D. Shangguan, J. Liu, Xiuzhen Lu, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.
Gang Zou, H. Gronqvist, J. Liu, 2002, 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).
P. Lundstrom, J.B. Nysaether, J. Liu, 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).
J. Liu, H. Kristiansen, F. Raugi, 2006, 2006 1st Electronic Systemintegration Technology Conference.
H. Kristiansen, J. Liu, H. Kristiansen, 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).
A. Ziaei, L. Ye, J. Liu, 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
A.S.G. Andrae, P. Moller, J. Anderson, 2004, IEEE Transactions on Electronics Packaging Manufacturing.
P. Sun, J. Liu, Si Chen, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.
J. Liu, Yan Zhang, Hui-feng Lv, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
J. Liu, Z. Lai, P. Starski, 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).
B. Carlberg, D. Shangguan, J. Liu, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.
J. Liu, J. Morris, H. Kristiansen, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
J. Allen, J. Liu, R. Kraszewski, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).
J. Liu, Yan Zhang, Jing-yu Fan, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Q. Zhai, Yulai Gao, J. Liu, 2008, 2008 10th Electronics Packaging Technology Conference.
J. Liu, Tiebing Wang, M. Becker, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
J. Liu, M. Andréasson, Yan Zhang, 2008, 2008 2nd Electronics System-Integration Technology Conference.
J. Liu, Si Chen, Wenhui Du, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
M. Inoue, J. Liu, 2008, 2008 2nd Electronics System-Integration Technology Conference.
J. Liu, Lei Zhang, Xiuzhen Lu, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
Bin Yang, Q. Zhai, Yulai Gao, 2008, 2008 2nd Electronics System-Integration Technology Conference.
M. Inoue, Teng Wang, B. Carlberg, 2008, 2008 2nd Electronics System-Integration Technology Conference.
M. Rencz, A. Ziaei, J. Liu, 2008, 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.
R. Raj, J. Liu, I. Dutta, 2009, 2009 11th Electronics Packaging Technology Conference.
J. Liu, I. Dutta, R. Raj, 2009, 2008 Second International Conference on Thermal Issues in Emerging Technologies.
Å. Haglund, M. Cole, J. Liu, 2012, IEEE Transactions on Semiconductor Manufacturing.
Xia Zhang, Qi Zhang, J. Liu, 2006, 2006 1st Electronic Systemintegration Technology Conference.
J. Liu, J. Liu, C. Andersson, 2006, 2006 1st Electronic Systemintegration Technology Conference.
Q. Zhai, Yulai Gao, J. Liu, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.
Zhaonian Cheng, Dongkai Shangguan, J. Liu, 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
Zonghe Lai, L. Ye, J. Liu, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
Zhaonian Cheng, Dongkai Shangguan, J. Liu, 2006, 56th Electronic Components and Technology Conference 2006.
J. Liu, Xiuzhen Lu, Si Chen, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
J. Liu, Z. Cheng, Yan Zhang, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.
L. Ye, B. Carlberg, J. Liu, 2012, 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO).
J. Allen, J. Liu, J. Liu, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
J. Liu, H. Kristiansen, L. Ekstrand, 2005, 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005..
J. Liu, I. Dutta, L. Meinshausen, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Yifeng Fu, J. Liu, Yan Zhang, 2012, 18th International Workshop on THERMal INvestigation of ICs and Systems.
Teng Wang, Xia Zhang, J. Liu, 2008, 2008 2nd Electronics System-Integration Technology Conference.
Zhaonian Cheng, Yan Zhang, Teng Wang, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.
Teng Wang, J. Liu, Z. Cheng, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.
Teng Wang, J. Liu, Z. Cheng, 2006, 2006 International Conference on Electronic Materials and Packaging.
J. Liu, Yan Zhang, Z. Mo, 2005, Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
J. Liu, Q. Fan, Si Chen, 2010, 2010 International Symposium on Advanced Packaging Materials: Microtech (APM).
J. Liu, Yu Wang, J. Morris, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
J. Malmodin, Z. Lai, J. Liu, 1998, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).
Teng Wang, B. Carlberg, Yifeng Fu, 2008, 2008 2nd Electronics System-Integration Technology Conference.
Teng Wang, Yifeng Fu, J. Liu, 2008, 2008 2nd Electronics System-Integration Technology Conference.
Teng Wang, Yifeng Fu, J. Liu, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Q. Zhai, Yulai Gao, J. Liu, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.
J. Liu, J. Liu, K. Jonnalagadda, 2005, IEEE Transactions on Components and Packaging Technologies.
P. Sun, J. Liu, Si Chen, 2007, International Symposium on High Density packaging and Microsystem Integration.
J. Liu, R. Larsson, Z. Cheng, 2005, International Conference on Polymers and Adhesives in Microelectronics and Photonics.
J. Liu, Zhimin Mo, J. Liu, 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).