Nan Wang

发表

Sihui Zhan, J. Yang, Yu Liu, 2011, Journal of colloid and interface science.

Hong-Liang Cui, Tianying Chang, Nan Wang, 2020, IEEE Transactions on Microwave Theory and Techniques.

Johan Liu, L. Ye, Xitao Wang, 2018, 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Johan Liu, L. Ye, Nan Wang, 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Johan Liu, L. Ye, Nan Wang, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Guohua Jiang, Nan Wang, Bo Zhao, 2015 .

Hongbing Lu, Johan Liu, D. Mencarelli, 2020, 2002.11336.

Johan Liu, Yifeng Fu, Nan Wang, 2019, 2019 IEEE 14th Nanotechnology Materials and Devices Conference (NMDC).

Jun Xu, P. Yao, Nan Wang, 2015, Journal of Materials Science: Materials in Electronics.

Hongbing Lu, T. Thiringer, Johan Liu, 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).

Hongbing Lu, Johan Liu, A. Balandin, 2019, 2D Materials.

Johan Liu, L. Ye, Yifeng Fu, 2020, Journal of Nanobiotechnology.

Johan Liu, L. Ye, Nan Wang, 2019, 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Johan Liu, L. Ye, Nan Wang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Johan Liu, C. Lambert, S. Bailey, 2015, Nature Communications.

L. Ye, B. Carlberg, J. Liu, 2012, 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO).

Johan Liu, L. Ye, Nan Wang, 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Johan Liu, L. Ye, Nan Wang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

L. Ye, Nan Wang, Ya Liu, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

Johan Liu, L. Ye, Nan Wang, 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Johan Liu, L. Ye, Xitao Wang, 2018, 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Johan Liu, Yifeng Fu, Nan Wang, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).