T. Hang
发表
Yang Liu,
Yutong Han,
Yunwen Wu,
2019
.
T. Yokoshima,
T. Osaka,
T. Momma,
2013
.
T. Hang,
Ming Li,
Ning Wang,
2016
.
T. Yokoshima,
T. Osaka,
T. Momma,
2014
.
T. Osaka,
T. Momma,
H. Nara,
2020
.
T. Hang,
Huiqin Ling,
Anmin Hu,
2021,
Journal of Materials Science: Materials in Electronics.
Q. Deng,
T. Hang,
Ming Li,
2020
.
Yunwen Wu,
T. Hang,
Ming Li,
2020
.
J. Rogers,
Jan-Kai Chang,
T. Hang,
2019,
Advanced materials.
T. Hang,
Ming Li,
Yuequan Wang,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Yunwen Wu,
T. Hang,
Huiqin Ling,
2019,
ACS applied materials & interfaces.
T. Hang,
Ming Li,
Xue Feng,
2016
.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Scripta Materialia.
T. Hang,
Anmin Hu,
Ming Li,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
T. Hang,
Anmin Hu,
Ming Li,
2009
.
T. Hang,
Huiqin Ling,
Ming Li,
2013
.
Yunwen Wu,
T. Hang,
Ming Li,
2022,
Nanotechnology.
Yunwen Wu,
T. Hang,
Ming Li,
2021
.
T. Hang,
Ming Li,
Di Lu,
2022,
ACS Applied Nano Materials.
T. Hang,
Huiqin Ling,
Anmin Hu,
2019,
Electrochimica Acta.
Hollow nitrogen-doped carbon spheres as efficient and durable electrocatalysts for oxygen reduction.
S. Shanmugam,
T. Hang,
Jakkid Sanetuntikul,
2014,
Chemical communications.
T. Hang,
Huiqin Ling,
Anmin Hu,
2020
.
Peng Zhang,
T. Hang,
Ming Li,
2016
.
T. Hang,
Huiqin Ling,
Anmin Hu,
2019,
International Journal of Hydrogen Energy.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021
.
T. Hang,
Huiqin Ling,
Anmin Hu,
2020,
Electronic Materials Letters.
T. Hang,
Ming Li,
Hanzhi Ju,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
T. Hang,
Ming Li,
Ning Wang,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
T. Hang,
Huiqin Ling,
Ming Li,
2015
.
Q. Deng,
T. Hang,
Ming Li,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
A Transient and Biocompatible Biomemristor Integrated with NonVolatile Memory and Artificial Synapse
Kecheng Zhang,
Yunwen Wu,
T. Hang,
2022,
Advanced Materials Interfaces.
Kecheng Zhang,
Yunwen Wu,
T. Hang,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
T. Hang,
Ming Li,
Jianghu Liang,
2022,
ACS applied materials & interfaces.
Yang Liu,
T. Hang,
Huiqin Ling,
2018
.
Lishuang Xiong,
T. Hang,
Ming Li,
2021
.
T. Hang,
Anmin Hu,
Ming Li,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
S. Shanmugam,
T. Hang,
Ming Li,
2015,
ACS applied materials & interfaces.
Yang Liu,
Yunwen Wu,
T. Hang,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021,
Journal of The Electrochemical Society.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2019,
Journal of The Electrochemical Society.
T. Hang,
Anmin Hu,
Ming Li,
2013
.
Hua Hu,
Yunwen Wu,
T. Hang,
2021,
Electronic Materials Letters.
T. Hang,
Huiqin Ling,
Liming Gao,
2014
.
Yunwen Wu,
T. Hang,
Ming Li,
2022,
Langmuir : the ACS journal of surfaces and colloids.
Y. Zheng,
Yunwen Wu,
T. Hang,
2022,
ACS Applied Electronic Materials.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021,
Materials Characterization.
T. Hang,
Huiqin Ling,
Anmin Hu,
2020
.
T. Hang,
Huiqin Ling,
Ming Li,
2019,
Applied Surface Science.
T. Hang,
Ming Li,
Ning Wang,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Yunwen Wu,
T. Hang,
Huiqin Ling,
2020
.
Yang Liu,
Lishuang Xiong,
T. Hang,
2019,
Applied Surface Science.
T. Hang,
Ming Li,
Dewei Chu,
2015,
Nano-micro letters.
T. Hang,
Ming Li,
Jiangbin Xia,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
T. Hang,
D. Mao,
Chengkang Chang,
2008
.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021,
Electronic Materials Letters.
T. Hang,
Dewei Chu,
Peiyuan Guan,
2017,
Journal of colloid and interface science.
Jeonghyun Kim,
John A. Rogers,
Seungyong Han,
2019,
Science Advances.
Tao Hang,
Erqing Xie,
E. Xie,
2011
.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021
.
J. A. Rogers,
R. Tseng,
S. Mehta,
2020
.
T. Hang,
Huiqin Ling,
Ming Li,
2021,
Materials Characterization.
Hua Hu,
Yunwen Wu,
T. Hang,
2021,
Journal of The Electrochemical Society.
High-performance Si-based 3D Cu nanostructured electrode assembly for rechargeable lithium batteries
T. Hang,
Huiqin Ling,
Ming Li,
2015
.
S. Shanmugam,
T. Hang,
Ming Li,
2017
.
T. Yokoshima,
T. Osaka,
H. Nara,
2014
.
Y. Cho,
T. Hang,
W. Yao,
2021,
Surface and Coatings Technology.
T. Hang,
Huiqin Ling,
Ming Li,
2011
.
Ming Li,
Tao Hang,
Dali Mao,
2014
.
Ming Li,
T. Hang,
Huiqin Ling,
2018,
Electronic Materials Letters.
T. Hang,
Huiqin Ling,
Liming Gao,
2020
.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Materials Letters.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Journal of Materials Science.
Ming Li,
T. Hang,
Huiqin Ling,
2022,
Materials Letters.
T. Hang,
Huiqin Ling,
Ming Li,
2020,
Materials Letters.
T. Hang,
Huiqin Ling,
Ming Li,
2021,
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
T. Hang,
Ming Li,
Zhuo Chen,
2014
.
T. Hang,
Ming Li,
Ning Wang,
2016
.
Ronghong Jin,
Richard W. Ziolkowski,
Xianling Liang,
2019,
Applied Sciences.
Xing Sheng,
John A. Rogers,
Irawati Kandela,
2019,
Nature Biomedical Engineering.
S. Shanmugam,
T. Hang,
Ming Li,
2014
.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2019,
Thin Solid Films.
T. Hang,
Ming Li,
Mengya Dong,
2021
.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Materials Chemistry and Physics.
Battery-free, lightweight, injectable microsystem for in vivo wireless pharmacology and optogenetics
John A Rogers,
Philipp Gutruf,
Abraham Vázquez-Guardado,
2019,
Proceedings of the National Academy of Sciences.
T. Hang,
Ming Li,
G. Ran,
2015
.
Lishuang Xiong,
T. Hang,
Ming Li,
2021,
Applied Surface Science.
T. Hang,
Shuying Ma,
Min Xiang,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
T. Hang,
Ming Li,
D. Mao,
2008,
Nanotechnology.
T. Hang,
Ming Li,
Di Lu,
2021,
Advanced Electronic Materials.
Y. Zheng,
Yunwen Wu,
T. Hang,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
T. Hang,
Ming Li,
Li Peng,
2013
.
Yunwen Wu,
T. Hang,
Ming Li,
2021,
Advanced Materials Interfaces.
Yunwen Wu,
T. Hang,
Ming Li,
2021
.
T. Hang,
Ming Li,
Wei-ming Gan,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Yunwen Wu,
T. Hang,
Ming Li,
2016,
Langmuir : the ACS journal of surfaces and colloids.
Yunwen Wu,
T. Hang,
Ming Li,
2015
.
J. Komadina,
Yunwen Wu,
T. Hang,
2014,
Nanoscale.
Yunwen Wu,
T. Hang,
Ming Li,
2014,
Chemical communications.
T. Hang,
Ming Li,
Han Xiao,
2015
.
Ming Li,
Tao Hang,
Anmin Hu,
2010
.
T. Hang,
Ming Li,
D. Mao,
2010
.
T. Hang,
Haiyan Yang,
Yuqing Li,
2023,
Electrochemistry Communications.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Journal of Materials Science & Technology.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021,
Electronic Materials Letters.
Yunwen Wu,
T. Hang,
Ming Li,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Daikichi Mukoyama,
Hiroki Nara,
Toshiyuki Momma,
2013
.
Yunwen Wu,
T. Hang,
Ming Li,
2020
.
Yunwen Wu,
T. Hang,
Ming Li,
2015,
Langmuir : the ACS journal of surfaces and colloids.
Anti-wetting Cu/Cr coating with micro-posts array structure fabricated by electrochemical approaches
T. Hang,
Ming Li,
Yufeng Zhou,
2013
.
T. Hang,
Ming Li,
Zhuo Chen,
2012,
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.
T. Hang,
Ming Li,
Zhuo Chen,
2012
.
Ming Li,
Tao Hang,
Dali Mao,
2007
.
T. Hang,
Ming Li,
Wenjing Zhang,
2012
.
Ming Li,
Yunwen Wu,
T. Hang,
2022,
Thin Solid Films.
Yang Liu,
Yutong Han,
Yunwen Wu,
2019,
ECS Journal of Solid State Science and Technology.
Yunwen Wu,
T. Hang,
Ming Li,
2015,
Langmuir : the ACS journal of surfaces and colloids.
Yunwen Wu,
T. Hang,
Ming Li,
2013,
Chemical communications.
T. Hang,
Ming Li,
Mengya Dong,
2021
.
Wenbin Kang,
T. Hang,
Ming Li,
2019,
Materials Research Express.
Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application
Ming Li,
Tianshen Zhou,
Shuying Ma,
2020,
Sensors.
T. Hang,
Liming Gao,
Ming Li,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
J. Komadina,
Yunwen Wu,
T. Hang,
2014,
Nanoscale.
Yang Liu,
Yutong Han,
Yunwen Wu,
2020
.
T. Hang,
Ming Li,
Xue Feng,
2015
.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2024,
Journal of Materials Science & Technology.
T. Hang,
Qingzong Xue,
Yuhang Chen,
2023,
Nanotechnology.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2024,
Surfaces and Interfaces.