Huiqin Ling
发表
Yang Liu,
Yutong Han,
Yunwen Wu,
2019
.
Huiqin Ling,
Ming Li,
D. Mao,
2012
.
T. Hang,
Huiqin Ling,
Anmin Hu,
2021,
Journal of Materials Science: Materials in Electronics.
Huiqin Ling,
Ming Li,
D. Mao,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Huiqin Ling,
Ming Li,
D. Mao,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2019,
ACS applied materials & interfaces.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Scripta Materialia.
T. Hang,
Huiqin Ling,
Ming Li,
2013
.
Ming Li,
Huiqin Ling,
Anmin Hu,
2018
.
Huiqin Ling,
Ming Li,
D. Mao,
2006,
2006 7th International Conference on Electronic Packaging Technology.
T. Hang,
Huiqin Ling,
Anmin Hu,
2019,
Electrochimica Acta.
T. Hang,
Huiqin Ling,
Anmin Hu,
2020
.
T. Hang,
Huiqin Ling,
Anmin Hu,
2019,
International Journal of Hydrogen Energy.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021
.
T. Hang,
Huiqin Ling,
Anmin Hu,
2020,
Electronic Materials Letters.
T. Hang,
Huiqin Ling,
Ming Li,
2015
.
A Transient and Biocompatible Biomemristor Integrated with NonVolatile Memory and Artificial Synapse
Kecheng Zhang,
Yunwen Wu,
T. Hang,
2022,
Advanced Materials Interfaces.
Kecheng Zhang,
Yunwen Wu,
T. Hang,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Yang Liu,
T. Hang,
Huiqin Ling,
2018
.
Huiqin Ling,
Ming Li,
Ning Wang,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Huiqin Ling,
Ming Li,
D. Mao,
2006
.
Huiqin Ling,
Ming Li,
D. Mao,
2004
.
Huiqin Ling,
Ming Li,
D. Mao,
2005
.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021,
Journal of The Electrochemical Society.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2019,
Journal of The Electrochemical Society.
Hua Hu,
Yunwen Wu,
T. Hang,
2021,
Electronic Materials Letters.
T. Hang,
Huiqin Ling,
Liming Gao,
2014
.
Huiqin Ling,
Ming Li,
D. Mao,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021,
Materials Characterization.
T. Hang,
Huiqin Ling,
Anmin Hu,
2020
.
T. Hang,
Huiqin Ling,
Ming Li,
2019,
Applied Surface Science.
Ming Li,
Yunwen Wu,
Huiqin Ling,
2022,
Journal of Industrial and Engineering Chemistry.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2020
.
Yang Liu,
Lishuang Xiong,
T. Hang,
2019,
Applied Surface Science.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021,
Electronic Materials Letters.
Huiqin Ling,
D. Mao,
Chengkang Chang,
2007
.
Huiqin Ling,
Anmin Hu,
Ming Li,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021
.
T. Hang,
Huiqin Ling,
Ming Li,
2021,
Materials Characterization.
Hua Hu,
Yunwen Wu,
T. Hang,
2021,
Journal of The Electrochemical Society.
L. Ye,
Huiqin Ling,
Ming Li,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
High-performance Si-based 3D Cu nanostructured electrode assembly for rechargeable lithium batteries
T. Hang,
Huiqin Ling,
Ming Li,
2015
.
T. Hang,
Huiqin Ling,
Ming Li,
2011
.
Huiqin Ling,
Ming Li,
Menglong Sun,
2019,
Electronic Materials Letters.
Ming Li,
T. Hang,
Huiqin Ling,
2018,
Electronic Materials Letters.
Ming Li,
Liqiang Cao,
Fengwei Dai,
2018,
Journal of Materials Science: Materials in Electronics.
T. Hang,
Huiqin Ling,
Liming Gao,
2020
.
Liqiang Cao,
Kai Chen,
Huiqin Ling,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Materials Letters.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Journal of Materials Science.
Ming Li,
T. Hang,
Huiqin Ling,
2022,
Materials Letters.
Liqiang Cao,
Kai Chen,
Huiqin Ling,
2018,
Journal of Materials Science: Materials in Electronics.
Yunwen Wu,
Huiqin Ling,
Ming Li,
2021
.
T. Hang,
Huiqin Ling,
Ming Li,
2020,
Materials Letters.
T. Hang,
Huiqin Ling,
Ming Li,
2021,
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Yunwen Wu,
T. Hang,
Huiqin Ling,
2019,
Thin Solid Films.
Huiqin Ling,
Ming Li,
D. Mao,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Materials Chemistry and Physics.
J. Komadina,
Yunwen Wu,
T. Hang,
2014,
Nanoscale.
Ming Li,
Tao Hang,
Anmin Hu,
2010
.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2022,
Journal of Materials Science & Technology.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2021,
Electronic Materials Letters.
Huiqin Ling,
Ming Li,
Qi Sun,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Ming Li,
Tao Hang,
Dali Mao,
2007
.
T. Momma,
Wang Hu,
Yunwen Wu,
2022,
Advanced Materials Interfaces.
Huiqin Ling,
Ming Li,
Xiaoying Miao,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Huiqin Ling,
Ming Li,
D. Mao,
2007,
2007 8th International Conference on Electronic Packaging Technology.
Huiqin Ling,
Kailin Liu,
2007
.
Daquan Yu,
Huiqin Ling,
Ming Li,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Huiqin Ling,
Ming Li,
Ziming Zhang,
2014,
2014 15th International Conference on Electronic Packaging Technology.
J. Komadina,
Yunwen Wu,
T. Hang,
2014,
Nanoscale.
Yang Liu,
Yutong Han,
Yunwen Wu,
2020
.
Huiqin Ling,
Ming Li,
Yue Lu,
2012
.
Huiqin Ling,
Ming Li,
D. Mao,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Huiqin Ling,
Ming Li,
D. Mao,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Yunwen Wu,
T. Hang,
Huiqin Ling,
2024,
Journal of Materials Science & Technology.