C. Wong

发表

Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials

Wei Lin, C. Wong, 2021, Nano-Bio- Electronic, Photonic and MEMS Packaging.

Hierarchical porous carbon aerogel derived from bagasse for high performance supercapacitor electrode.

Hong Liu, C. Wong, A. Umar, 2014, Nanoscale.

Advanced Flip Chip Packaging

Ho-Ming Tong, H. Tong, C. Wong, 2013 .

Selective induction heating for wafer level bonding and packaging

C. Wong, Sheng Liu, Mingxiang Chen, 2009, 2009 59th Electronic Components and Technology Conference.

Recent advances in high-k nanocomposite materials for embedded capacitor applications

Jiongxin Lu, C. Wong, Jiongxin Lu, 2008, IEEE Transactions on Dielectrics and Electrical Insulation.

New electrically conductive adhesives (ECAs) for flexible interconnect applications

K. Moon, Wei Lin, C. Wong, 2009, 2009 59th Electronic Components and Technology Conference.

Characterization of underfill/substrate interfacial toughness enhancement by silane additives

J. Qu, C. Wong, Q. Yao, 1999 .

Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

C. Wong, C. P. Wong, S. H. Shi, 1999 .

Study on the correlation of flip-chip reliability with mechanical properties of no-flow underfill materials

Jianmin Qu, Qizhou Yao, C. Wong, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Biomimetic Lotus Effect Surfaces for Nanopackaging

Y. Xiu, C. Wong, 2021, Nano-Bio- Electronic, Photonic and MEMS Packaging.

MICROELECTRONICS: Flip the Chip.

C. Wong, S. Luo, Z. Zhang, 2000, Science.

Novel stretchable electrically conductive composites for tunable RF devices

John Papapolymerou, Fan Cai, J. Papapolymerou, 2012, 2012 IEEE/MTT-S International Microwave Symposium Digest.

Recent Advances in IC Passivation and Encapsulation: Process Techniques and Materials

C. Wong, 1993 .

Nano-conductive Adhesives for Nano-electronics Interconnection

Yi Li, K. Moon, C. Wong, 2021, Nano-Bio- Electronic, Photonic and MEMS Packaging.

Recent Advances in Developing High Performance Isotropic Conductive Adhesives

C. Wong, D. Lu, Daoqiang Daniel Lu, 2008 .

Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging

C. Wong, Grace Y. Li, 2007 .

Electrically Conductive Adhesives for Electronic Applications

C. Wong, D. Lu, 2002 .

Effects of shrinkage on conductivity of isotropic conductive adhesives

C. Wong, D. Lu, 2000 .

Study of a controlled thermally degradable epoxy resin system for electronic packaging

C. Wong, Haiying Li, Lejun Wang, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Highly Conductive Polyurethane/Polyaniline-Based Composites for Wearable Electronic Applications

K. Moon, Liyi Li, B. Song, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

st Polymers for electronic packaging in the 21 century

R. Tummala, C. Wong, 2000 .

Mechanical Behavior of Encapsulants in Microelectronic Packaging

C. Wong, 1991 .

High performance screen-printable silicone as selective hybrid IC encapsulant

C. Wong, 1990 .

Electrical performance and reaction kinetics of silicone gels

C. Wong, 1990 .

Automated dispersion and orientation analysis for carbon nanotube reinforced polymer composites

Allen Tannenbaum, Sylvain Bouix, Liangjia Zhu, 2012, Nanotechnology.

Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability

C. Wong, Guoqi Zhang, Xuejun Fan, 2015 .

Moisture Barrier, Mechanical, and Thermal Properties of PDMS-PIB Blends for Solar Photovoltaic (PV) Module Encapsulant

K. Moon, C. Wong, S. Graham, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Development of a Novel Polymer-Metal Nanocomposite Obtained through the Route of In Situ Reduction and it's Dielectric Properties

Yi Li, C. Wong, S. Pothukuchi, 2004 .

Bi-block copolymer surfactant study for high dielectric constant polymer-ceramic composite

C. Wong, Y. Rao, A. Takahashi, 2002, 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).

A new approach in the development of no-flow underfill materials for both eutectic and lead-free solders with high melting temperature

C. Wong, C. Wong, Haiying Li, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Study of non-anhydride curing system for no-flow underfill applications

Zhuqing Zhang, C. Wong, L. Fan, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Tungsten as a CMOS compatible catalyst for the Metal-assisted Chemical Etching of silicon to create 2D and 3D nanostructures

O. Hildreth, C. Wong, C. Álvarez, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Quantitative characterization of underfill/substrate interfacial toughness enhancement by silane additives

J. Qu, C. Wong, Q. Yao, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Adhesion enhancement of underfill materials by silane additives

C. Wong, J. Qu, C. Wong, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Evaluation of reworkable underfills for area array packaging encapsulation

D. Baldwin, C. Wong, Haiying Li, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives

Yi Li, K. Moon, C. Wong, 2005 .

Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering

Yi Li, K. Moon, C. Wong, 2006 .

Boundary layer transition effects on flow separation around V/STOL engine inlets at high incidence

D. P. Hwang, K. Salari, C. Wong, 1984 .

Magnetic Nanocomposite Materials for RFID and RF Passives Miniaturization

C. Wong, D. Staiculescu, Haiying Li, 2007 .

Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: Tryptophan-cured diglycidyl ether of bisphenol A epoxy

Yi Li, Yi Li, C. Wong, 2007 .

Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: Enhancement of electrical and thermal properties

Yi Li, K. Moon, C. Wong, 2005 .

Self-Patterning of Silica/Epoxy Nanocomposite Underfill by Tailored Hydrophilic-Superhydrophobic Surfaces for 3D Integrated Circuit (IC) Stacking.

K. Moon, Ziyin Lin, Yan Liu, 2017, ACS applied materials & interfaces.

Thermal-mechanical enhanced high-performance silicone gels and elastomeric encapsulants in microelectronic packaging

C. Wong, 1995 .

Novel ZnO nanowires/silicon hierarchical structures for superhydrophobic, low reflection, and high efficiency solar cells

K. Moon, Ziyin Lin, Yan Liu, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Development of low viscosity, high dielectric constant (k) polymers for integral passive applications

R. Tummala, C. Wong, T. S. Troutman, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Nanowires-based high-density capacitors and thinfilm power sources in ultrathin 3D glass modules

R. Tummala, Liyi Li, P. Chakraborti, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

A Novel Approach to Integrating 3D/4D Printing and Stretchable Conductive Adhesive Technologies for High Frequency Packaging Applications

M. Tentzeris, C. Wong, Chia-Chi Tuan, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Stretchable conductors based on in-situ polymerizde poly(3,4-ethylenedioxythiophene) and three dimensional structure design

R. Sun, C. Wong, Guoping Zhang, 2016, 2016 China Semiconductor Technology International Conference (CSTIC).

Thermal conductivity of epoxy/surface functionalized carbon nano materials

K. Moon, C. Wong, Q. Liang, 2009, 2009 59th Electronic Components and Technology Conference.

Silver/polymer nanocomposite as a high-kpolymer matrix for dielectric composites with improved dielectric performance

K. Moon, C. Wong, Jiongxin Lu, 2008 .

Different valence Sn doping - A simple way to detect oxygen concentration variation of ZnO quantum dots synthesized under ultrasonic irradiation.

B. Song, Fan Wu, C. Wong, 2017, Ultrasonics sonochemistry.

A facile chemical approach for preparing a SERS active silver substrate.

M. Yuen, C. Wong, Yutao Xie, 2010, Physical chemistry chemical physics : PCCP.

UV-Resistant and Superhydrophobic Self-Cleaning Surfaces Using Sol–Gel Processes

Ching-Ping Wong, Dennis W. Hess, Y. Xiu, 2008 .

Silver dendrites based electrically conductive composites, towards the application of stretchable conductors

C. Wong, R. Sun, C. Wong, 2020 .

Investigation of the optical properties of ZnO/epoxy resin nanocomposite: Application in the LED

C. Wong, Rong Sun, Guoping Zhang, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.

Design and Surface Modification of PET Substrates Using UV/Ozone Treatment for Roll-to-Roll Processed Solar Photovoltaic (PV) Module Packaging

K. Moon, B. Song, C. Wong, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Modeling of Thermal Conductivity of Graphite Nanosheet Composites

Wei Lin, C. Wong, Rongwei Zhang, 2010 .

Three-dimensional graphene foam and carbon fibers reinforced epoxy resin composites with enhanced thermal conductivity

R. Sun, M. Yuen, C. Wong, 2016, 2016 China Semiconductor Technology International Conference (CSTIC).

Adhesion performance and thermo-mechanical property of epoxy-based underfill

C. Wong, C. Wong, S. Luo, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Highly Sensitive Conformal Pressure Sensing Coatings Based on Thermally Expandable Microspheres

C. Wong, Jianing Wu, Yuhan Zhang, 2020, Advanced Materials Technologies.

An Overview of Integrated Circuit Device Encapsulants

C. Wong, 1989 .

Mechanical studies of high-strength, high-modulus poly(p-phenylenebenzobisthiazole) fibers

R. Farris, E. Thomas, C. Wong, 1981 .

Magnetic Nanocomposite for Potential Ultrahigh Frequency Microelectronic Application

K. Moon, C. Wong, Hongjin Jiang, 2007 .

Siloxane Polymers as Low Dielectric Materials for Microelectronics

C. Wong, 1995 .

Magnetic and crystallization studies in amorphous neodymium‐cobalt alloys

G. Hadjipanayis, C. Wong, K. Gudimetta, 1985 .

High Performance Supercapacitors from Hierarchical Porous Carbon Aerogels Based on Sliced Bread

Hong Liu, B. Tang, C. Wong, 2017 .

Wafer level batch packaging (WLBP): incorporation of air pores/foams in a polyimide matrix using a low modulus sacrificial commercial polymer

C. Wong, C. Wong, J. Williamson, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Novel periodic mesoporous organosilica thin film with low dielectric constant and high mechanical property

R. Sun, C. Wong, Jiawei Zhang, 2016, 2016 China Semiconductor Technology International Conference (CSTIC).

Processing and shape effects on silver paste electrically conductive adhesives (ECAs)

Yi Li, Cho-Liang Chung, Yi Li, 2005 .

High performance phase change thermal interface materials based on porous graphitic carbon spheres-paraffin wax composite

R. Sun, M. Yuen, C. Wong, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Development and application of polymer-based nanocomposites dielectrics

Shuhui Yu, S. Luo, R. Sun, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Influence of interphase and moisture on the dielectric spectroscopy of epoxy/silica composites

Zhuqing Zhang, C. Wong, Yangyang Sun, 2005 .

Thermo-mechanical properties of epoxy formulations with low glass transition temperatures

Shijian Luo, C. Wong, C. P. Wong, 2002, 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).

Improved method to evaluate the adhesion properties of thin film conformal coatings

O. Hildreth, C. Wong, 2009, 2009 59th Electronic Components and Technology Conference.

Lead-free interconnect technique by using variable frequency microwave

Yi Li, K. Moon, C. Wong, 2005 .

Use of dispersant in high K polymer-ceramic nano-composite to improve manufacturability and performance of integral capacitors

K. Moon, C. Wong, S. Pothukuchi, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Lanthanide porphyrin complexes. Evaluation of nuclear magnetic resonance dipolar probe and shift reagent capabilities.

C. Wong, W. Horrocks, 1976, Journal of the American Chemical Society.

Adhesion improvement of thermoplastic-based isotropic conductive adhesives under humid environment using self-assembled monolayer compounds

K. Moon, C. Wong, C. Rockett, 2004 .

Enhanced-performance wireless conformal "smart skins" utilizing inkjet-printed carbon-nanostructures

M. Tentzeris, Ziyin Lin, C. Wong, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Experimental investigation of time dependent degradation of coupling agent bonded interfaces

C. Wong, D. Lam, C. Wong, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Robust titanate-modified encapsulants for high voltage potting application of multi-chip module

C. Wong, R. McBride, 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

Use of dendirimers to control nanoparticle size in polymer-metal nanocomposites for embedded capacitor application

C. Wong, C. Wong, S. Pothukuchi, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging

K. Moon, C. Wong, Hongjin Jiang, 2021, Nano-Bio- Electronic, Photonic and MEMS Packaging.

Enhancing the electrical and optoelectronic performance of nanobelt devices by molecular surface functionalization.

Yi Li, C. Lao, C. Wong, 2007, Nano letters.

Letter: Lanthanide porphyrin complexes. A potential new class of nuclear magnetic resonance dipolar probe.

C. Wong, W. Horrocks, R. Venteicher, 1974, Journal of the American Chemical Society.

Multiscale characterization of the joint bonded by Cu@Ag core@shell nanoparticles

R. Sun, C. Wong, G. Li, 2020 .

Advanced interconnect materials for ink-jet printing by low temperature sintering

C. Wong, Rongwei Zhang, Rongwei Zhang, 2009, 2009 59th Electronic Components and Technology Conference.

Evaluation and characterization of high-performance filling encapsulants for system chips application

H. B. Pogge, R. Tummala, C. Wong, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

New Reworkable High Temperature Low Modulus (in Excess of 400–500 °C) Adhesives for MCM-D Assembly

S. Sitaraman, C. Wong, Jiali Wu, 2000 .

Multi-layered structure: adhesive selection and process mechanics [HDI]

S. Sitaraman, C. Wong, Jiali Wu, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Single/few-layer boron nitride-based nanocomposites for high thermal conductivity underfills

K. Moon, Ziyin Lin, C. Wong, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

High-k polymer nanocomposites for gate dielectric applications

C. Wong, Kyoung-sik Moon, Jiongxin Lu, 2007, 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces.

Comparative Analysis of Temperature-induced Micro-scale Deformation of Package by Experiment and Finite Element Analysis

R. Sun, C. Wong, Jibao Lu, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Study on mono-dispersed nano-size silica by surface modification for underfill applications.

Yangyang Sun, Zhuqing Zhang, C. Wong, 2005, Journal of colloid and interface science.

Wet chemical method to etch sophisticated nanostructures into silicon wafers using sub-25nm feature sizes and high aspect ratios

Y. Xiu, O. Hildreth, C. Wong, 2009, 2009 59th Electronic Components and Technology Conference.

Highly Reliable Copper-Based Conductive Adhesives Using an Amine Curing Agent for in Situ Oxidation/Corrosion Prevention

K. Moon, Wei Lin, C. Wong, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Low cost copper-based electrically conductive adhesives

C. Wong, Rongwei Zhang, R. Zhang, 2010, 2010 12th Electronics Packaging Technology Conference.

Low-temperature Mössbauer studies of FeNb2O6

C. Wong, B. Wanklyn, A. Morrish, 1978 .

A precise numerical prediction of effective dielectric constant for polymer-ceramic composite based on effective-medium theory

Yang Rao, Jianmin Qu, J. Qu, 2000 .

Some Nanomaterials for Microelectronics and Photonics Packaging

K. Moon, C. Wong, 2021 .

Nanomaterials for Microelectronic and Bio-packaging

Kyoung-Sik Moon, K. Moon, C. Wong, 2010 .

High dielectric constant polymer-ceramic (Epoxy varnish-barium titanate) nanocomposites at moderate filler loadings for embedded capacitors

S. Bhattacharya, C. Wong, Jianwen Xu, 2006 .

Development of a novel aluminum-filled composite for embedded passive applications

C. Wong, C. Wong, Jianwen Xu, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

INCREASE THE PACKING DENSITY OF VERTICALLY ALIGNED CARBON NANOTUBE ARRAY FOR THE APPLICATION OF THERMAL INTERFACE MATERIALS

Wei Lin, Meilin Liu, C. Wong, 2011 .

Understanding the use of silicone gels for non-hermetic plastic packaging

J. W. Balde, J. M. Segelken, J. Segelken, 1989, Proceedings., 39th Electronic Components Conference.

Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives

Yi Li, Kyoung-Sik Moon, Myung Jin Yim, 2007 .

Application of polymer in encapsulation of electronic parts

C. P. Wong, C. Wong, 1988 .

Preparation, thermal and mechanical properties of POSS epoxy hybrid composites

Y. Xiu, C. Wong, Yangyang Sun, 2007 .

Polymers for electronic and photonic applications

C. Wong, C. P. Wong, 1993 .

Films, Coatings, Adhesives, Polymers, and Thermoelectric Materials

Yi Li, K. Moon, A. Maignan, 2008 .

Highly conductive, flexible, bio-compatible poly-urethane based isotropic conductive adhesives for flexible electronics

Yan Liu, C. Wong, Zhuo Li, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Fast preparation of printable highly conductive polymer nanocomposites by thermal decomposition of silver carboxylate and sintering of silver nanoparticles.

K. Moon, Wei Lin, C. Wong, 2010, ACS applied materials & interfaces.

Preparation of highly conductive polymer nanocomposites by low temperature sintering of silver nanoparticles

Wei Lin, Kyoung-Sik Moon, K. Moon, 2010 .

The fabrication of vertically aligned and periodically distributed carbon nanotube bundles and periodically porous carbon nanotube films through a combination of laser interference ablation and metal-catalyzed chemical vapor deposition

Wei Lin, C. Wong, S. Das, 2012, Nanotechnology.

Materials science. Electronics without lead.

Yi Li, K. Moon, C. Wong, 2005, Science.

Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials

John H. Lau, Ning-Cheng Lee, John Lau, 2002 .

1D Ni-Co oxide and sulfide nanoarray/carbon aerogel hybrid nanostructures for asymmetric supercapacitors with high energy density and excellent cycling stability.

C. Wong, Chia-Chi Tuan, P. Hao, 2016, Nanoscale.

The hybrid nanostructure of MnCo2O4.5 nanoneedle/carbon aerogel for symmetric supercapacitors with high energy density.

Huaidong Jiang, Liyi Li, Hong Liu, 2015, Nanoscale.

Recent advances of nanolead-free solder material for low processing temperature interconnect applications

C. P. Wong, Hongjin Jiang, Kyoung-sik Moon, 2013, Microelectron. Reliab..

Synthesis of High-Quality Vertically Aligned Carbon Nanotubes on Bulk Copper Substrate for Thermal Management

K. Moon, Wei Lin, C. Wong, 2010, IEEE Transactions on Advanced Packaging.

Electronic Packaging: Design, Materials, Process, and Reliability

Wataru Nakayama, John H Lau, J. Lau, 1998 .

Novel method to extract arrays of aligned carbon nanotube bundles from CNT film using solder ball grid arrays for higher performance device interconnects

Wei Lin, O. Hildreth, C. Wong, 2009, 2009 59th Electronic Components and Technology Conference.

Fine-pitch carbon nanotube bundles assembly using CNT transfer for electrical interconnects

D. Hess, C. Wong, Kyoung-sik Moon, 2007, 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces.

Isotropic conductive adhesives filled with low-melting-point alloy fillers

Daoqiang Lu, C. Wong, C. P. Wong, 2000 .

Recent advances on Electrically Conductive Adhesives

C. Wong, C. P. Wong, Rongwei Zhang, 2010, 2010 12th Electronics Packaging Technology Conference.

Solution-processed flexible solid-state micro-supercapacitors for on-chip energy storage devices

K. Moon, Zhenkun Wu, Liyi Li, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Magnetic and structural studies in Nd-based metallic glasses

G. Hadjipanayis, C. Wong, S. H. Aly, 1986 .

Robust, novel, and low cost superhydrophobic nanocomposites coating for reliability improvement of microelectronics

K. Moon, Ziyin Lin, Yan Liu, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Eutectic liquid in Sol-Gel process for superhydrophobic silica thin films — antistiction of MEMS devices

D. Hess, C. Wong, Lingbo Zhu, 2007, 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces.

Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging

Ephraim Suhir, Yung-Cheng Lee, Yung-Cheng Lee, 2007 .

ZnO quantum dots-filled encapsulant for LED packaging

K. Moon, Ziyin Lin, Yan Liu, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Influence of flux on wetting behavior of lead-free solder balls during the infrared-reflow process

K. Moon, C. Wong, C. Chung, 2005 .

Kinetically controlled assembly of terpheny-4,4”-dithiol self-assembled monolayers (SAMs) for highly conductive anisotropically conductive adhesives (ACA)

C. Wong, D. Staiculescu, J. Agar, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Conductive Polymer Composites with Large Positive Temperature Coefficients

C. Wong, S. Luo, 2002 .

Miniaturized Integrated Micro-Supercapacitors as Efficient Power Sources for Wearable and Biocompatible Electronic Devices

K. Moon, Liyi Li, B. Song, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications

Wei Lin, C. Wong, K. Lawrence, 2010 .

A study of impact performance of conductive adhesives

Yang Rao, Daoqiang Lu, C. Wong, 2004 .

The preparation of stable metal nanoparticles on carbon nanotubes whose surfaces were modified during production

K. Moon, Lingbo Zhu, C. Wong, 2007 .

Three-dimensional graphene-based composite for flexible electronic applications

K. Moon, Zhenkun Wu, B. Song, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Effect of silica on the non-linear electrical property of polymer composites

C. Wong, Fei Xiao, Kyoung-sik Moon, 2007, 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces.

Carbon fiber paper supported hybrid nanonet/nanoflower nickel oxide electrodes for high-performance pseudo-capacitors

Wei Lin, Meilin Liu, Lei Yang, 2013 .

High aspect ratio sub-100 nm silicon vias (SVs) by metal-assisted chemical etching (MaCE) and copper filling

Liyi Li, C. Wong, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Development of a novel polymer–metal nanocomposite obtained through the route of in situ reduction for integral capacitor application

Yi Li, C. Wong, S. Pothukuchi, 2004 .

Fabricating photosensitive polymer insulation layer by spin-coating for through silicon vias

R. Sun, C. Wong, Guoping Zhang, 2016, International Conference on Electronic Packaging Technology.

Fabricating polymer insulation layer by spin-coating for through silicon vias

R. Sun, C. Wong, Guoping Zhang, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Self-Cleaning Materials—Lotus Effect Surfaces

Zhuqing Zhang, C. Wong, Jun Li, 2006 .

Smart Self-Cleaning Materials—Lotus Effect Surfaces

Zhuqing Zhang, C. Wong, Jun Li, 2005 .

Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets

K. Moon, Samson Yoon, S. Sitaraman, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Carbon nanotube/polymer nanocomposites: Sensing the thermal aging conditions of electrical insulation components

Kyoung-Sik Moon, Yagang Yao, K. Moon, 2013 .

A highly reliable measurement of thermal transport properties of vertically aligned carbon nanotube arrays

Wei Lin, C. Wong, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Silicon surface structure-controlled oleophobicity.

Y. Xiu, D. Hess, Yan Liu, 2010, Langmuir : the ACS journal of surfaces and colloids.

Low-cost micrometer-scale silicon vias (SVs) fabrication by metal-assisted chemical etching (MaCE) and carbon nanotubes (CNTs) filling

Ziyin Lin, Liyi Li, Yan Liu, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Development of environmentally friendly nonanhydride no-flow underfills

Zhuqing Zhang, L. Fan, C. P. Wong, 2002 .

A combined etching process toward robust superhydrophobic SiC surfaces

Wei Lin, Y. Xiu, Ziyin Lin, 2012, Nanotechnology.

Hierarchical silicon etched structures for controlled hydrophobicity/superhydrophobicity.

Lingbo Zhu, Y. Xiu, Lingbo Zhu, 2007, Nano letters.

A Paradigm of Carbon Nanotube Interconnects in Microelectronic Packaging

Lingbo Zhu, C. Wong, Hongjin Jiang, 2008 .

Electroless plating alloy thin-film embedded resistor materials

R. Sun, C. Wong, Xianzhu Fu, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

UV and thermally stable superhydrophobic coatings from sol-gel processing.

Y. Xiu, D. Hess, C. Wong, 2008, Journal of colloid and interface science.

Reversible superhydrophobic-superhydrophilic transition of ZnO nanorod/epoxy composite films.

K. Moon, Wei Lin, Ziyin Lin, 2012, ACS applied materials & interfaces.

Mechanically robust superhydrophobicity on hierarchically structured Si surfaces

Yan Liu, Y. Xiu, D. Hess, 2010, Nanotechnology.

Graphene-Ag composite film as thermal interface materials

R. Sun, M. Yuen, C. Wong, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

On-Chip Integrated Solid-State Micro-Supercapacitor

B. Song, V. Desmaris, A. Saleem, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Assembling CarbonNanotube Films asThermalInterface Materials

D. Hess, C. Wong, 2015 .

Vertically aligned carbon nanotubes for thermal interface materials: Quality control, alignment improvement and laser flash measurement

Wei Lin, C. Wong, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Vertically aligned carbon nanotubes on copper substrates for applications as thermal interface materials: From synthesis to assembly

K. Moon, Wei Lin, C. Wong, 2009, 2009 59th Electronic Components and Technology Conference.

Recent Advances in Nano-conductive Adhesives

C. Wong, C. P. Wong, D. Lu, 2008 .

Conductive Adhesives for Flip-Chip Applications

C. Wong, D. Lu, 2013 .

Inkjet-printed graphene-based wireless gas sensor modules

V. Lakafosis, Taoran Le, Ziyin Lin, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Interfacial Design of Anisotropic Conductive Adhesive Based Interconnects Using Molecular Wires and Understanding of Their Electrical Conduction

K. Moon, Wei Lin, C. Wong, 2010, IEEE Transactions on Advanced Packaging.

Electrical properties of ACA joints assisted by conjugated molecular wires

K. Moon, Wei Lin, C. Wong, 2009, 2009 59th Electronic Components and Technology Conference.

Nano-metal-Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices

O. Hildreth, C. Wong, 2017 .

Electrical and Thermal Conductivities of Polymer Composites Containing Nano-Sized Particles

J. Qu, C. Wong, B. Su, 2004, ECTC 2004.

Thermo-mechanical properties of Isotropic Conductive Adhesive filled with Metallized Polymer Spheres

C. Wong, Zhuo Li, J. Gakkestad, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures

K. Moon, C. Wong, Yong Ding, 2013 .

Investigations of the water-borne isotropically conductive adhesives

M. Yuen, Guohua Chen, C. Wong, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Adhesion and RF properties of electrically conductive adhesives

R. Tummala, K. Moon, V. Sundaram, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

High Performance Nonconductive Film with π-Conjugated Self-Assembled Molecular Wires for Fine Pitch Interconnect Applications

Yi Li, C. Wong, M. Yim, 2007 .

Reliability improvement of conductive adhesives on tin (Sn) surfaces

Yi Li, K. Moon, C. Wong, 2005 .

Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

K. Moon, C. Wong, H. Dong, 2004 .

Biomimetic creation of hierarchical surface structures by combining colloidal self-assembly and Au sputter deposition.

Lingbo Zhu, Y. Xiu, Lingbo Zhu, 2006, Langmuir : the ACS journal of surfaces and colloids.

MEAM molecular dynamics study of lead free solder for electronic packaging applications

Kyoung-Sik Moon, Michael I. Baskes, Lianhua Fan, 2005 .

A novel flexible magnetic composite material for RFID, wearable RF and bio-monitoring applications

Manos M. Tentzeris, Li Yang, Daniela Staiculescu, 2008, 2008 IEEE MTT-S International Microwave Symposium Digest.

Micro/nano structure size effect on superhydrophobicity and anti reflection of single crystalline Si solar cells

Y. Xiu, Yan Liu, C. Wong, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Tin/Indium nanobundle formation from aggregation or growth of nanoparticles

F. Hua, K. Moon, T. Pal, 2008 .

Physics design-reliability and packaging

E. Suhir, C. Wong, Yung-Cheng Lee, 2007 .

Investigation the effect of silane onto fabricating polymer insulation layer by spin-coating for through silicon vias

R. Sun, C. Wong, Guoping Zhang, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Studies of latent catalyst systems for pot-life enhancement of flip chip underfills

C. Wong, Lejun Wang, 1999 .

Graphene for ultracapacitors

K. Moon, C. Wong, C. P. Wong, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Directed 2D-to-3D pattern transfer method for controlled fabrication of topologically complex three- dimensional nanostructures in silicon

A. Fedorov, O. Hildreth, C. Wong, 2011 .

Package Sealing and Encapsulation

K. Otsuka, D. B. Clegg, C. P. Wong, 1997 .

Nano filler dispersion in polymer composites for electronic packaging

A. Tannenbaum, K. Moon, Yi Gao, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Superhydrophobic and low light reflectivity silicon surfaces fabricated by hierarchical etching.

Y. Xiu, V. Yelundur, D. Hess, 2008, Langmuir : the ACS journal of surfaces and colloids.

Smart Skins: Could they be the ultimate sensing tool? Today\uFFFDs industry and personal medical care both strongly demand accurate, reliable, robust, lo

M. M. Tentzeris, Taoran Le, Ziyin Lin, 2015, IEEE Nanotechnology Magazine.

Novel PDMS(silicone)-in-PDMS(silicone): Low cost flexible electronics without metallization

Kyoung-Sik Moon, K. Moon, C. Wong, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Yi Li, K. Moon, C. Wong, 2010 .

Stabilizing contact resistance of isotropically conductive adhesives on various metal surfaces by incorporating sacrificial anode materials

K. Moon, C. Wong, Haiying Li, 2004 .

Wafer-level wet etching of high-aspect-ratio through silicon vias (TSVs) with high uniformity and low cost for silicon interposers with high-density interconnect of 3D packaging

Liyi Li, C. Wong, Jiali Wu, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Uniform metal-assisted chemical etching and the stability of catalysts

Liyi Li, O. Hildreth, C. Wong, 2015 .