Xing Yu
发表
Zongping Shao,
Bote Zhao,
Huanting Wang,
2012
.
Zongping Shao,
Rui Cai,
Xing Yu,
2009
.
Dan Chen,
Xing Yu,
Baoyu Liu,
2020,
Coatings.
T. Shi,
G. Liao,
Tianxiang Li,
2017
.
Yuping Zeng,
Yongfeng Xia,
K. Zuo,
2019
.
Dan Chen,
Xing Yu,
Baoyu Liu,
2020,
Materials.
Xing Yu,
Baoyu Liu,
X. Zou,
2020
.
Xi Li,
R. Moreau,
Xing Yu,
2017
.
T. Shi,
G. Liao,
Zirong Tang,
2018
.
Dan Chen,
Xing Yu,
Baoyu Liu,
2020,
Materials Research Express.
Xi Li,
R. Moreau,
Xing Yu,
2016
.
Zongping Shao,
Bote Zhao,
Huanting Wang,
2012
.
T. Shi,
G. Liao,
Zirong Tang,
2017,
Journal of Materials Science: Materials in Electronics.
Dan Chen,
Xing Yu,
Baoyu Liu,
2020,
Crystals.
Dan Chen,
Xing Yu,
Baoyu Liu,
2020,
Molecules.
Dan Chen,
Xing Yu,
Baoyu Liu,
2020
.
Dan Chen,
Xing Yu,
Baoyu Liu,
2020,
Materials.
Xionggang Lu,
Xi Li,
Z. Ren,
2019,
Journal of Materials Chemistry A.
Yuping Zeng,
Yongfeng Xia,
K. Zuo,
2020,
Ceramics International.
Xi Li,
Z. Ren,
Xing Yu,
2018
.
T. Shi,
G. Liao,
Tianxiang Li,
2017
.
Yuhan Sun,
Gang Wang,
Xing Yu,
2018
.
Xionggang Lu,
Xi Li,
Z. Ren,
2016
.
Xi Li,
Z. Ren,
Xing Yu,
2015
.
Yuhan Sun,
Hongjiang Liu,
Xing Yu,
2018,
ChemCatChem.
Xing Yu,
Yi Xu,
J. Feng,
2014
.
Yuping Zeng,
Yongfeng Xia,
K. Zuo,
2020
.
Low-Temperature and Low-Pressure Cu-Cu Bonding by Pure Cu Nanosolder Paste for Wafer-Level Packaging
T. Shi,
G. Liao,
Zirong Tang,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
T. Shi,
G. Liao,
Zirong Tang,
2018
.
T. Shi,
G. Liao,
Zirong Tang,
2017,
Nanoscale Research Letters.
Zongping Shao,
Rui Cai,
Xing Yu,
2010
.
Xing Yu,
Yong Tian,
Shilong Liu,
2021
.
Zongping Shao,
R. Cai,
Xing Yu,
2010
.
Xionggang Lu,
Xi Li,
Xing Yu,
2020,
ACS applied materials & interfaces.
Xi Li,
R. Moreau,
Xing Yu,
2018,
Chemical Engineering Journal.
Xi Li,
Z. Ren,
Xing Yu,
2018,
Journal of Power Sources.
Zongping Shao,
R. Cai,
Xiaozhen Liao,
2009
.
Xing Yu,
Baoyu Liu,
X. Zou,
2021
.
Zongping Shao,
R. Cai,
Xiaozhen Liao,
2010
.
Xi Li,
Z. Ren,
Xing Yu,
2020
.