Paul T. Vianco
发表
Thomas Edward Buchheit,
Neil R Sorensen,
Paul T. Vianco,
2008
.
Paul T. Vianco,
P. Vianco,
2018,
JOM.
Elizabeth A. Holm,
Paul T. Vianco,
Michael K. Neilsen,
2010
.
Paul T. Vianco,
Arlo F. Fossum,
David M. Pierce,
2006
.
Donald Francis Susan,
Alice C. Kilgo,
Paul T. Vianco,
2004
.
Paul T. Vianco,
Michael K. Neilsen,
2010
.
Donald Francis Susan,
Paul T. Vianco,
William Graham Yelton,
2010
.
Elizabeth A. Holm,
Paul T. Vianco,
Michael K. Neilsen,
2012
.
Paul T. Vianco,
2008
.
Alice C. Kilgo,
Paul T. Vianco,
Paul F. Hlava,
2006
.
John Mark Grazier,
Paul T. Vianco,
Michael K. Neilsen,
2013
.
Elizabeth A. Holm,
Paul T. Vianco,
Arlo F. Fossum,
2004
.
Paul T. Vianco,
2015
.
Paul T. Vianco,
Michael K. Neilsen,
Bonnie Beth McKenzie,
2017
.
Paul T. Vianco,
P. Vianco,
2020,
3D Microelectronic Packaging.
Paul T. Vianco,
Michael K. Neilsen,
Jerome A. Rejent,
2008
.
F. M. Hosking,
Paul T. Vianco,
D. R. Frear,
1996
.
Paul T. Vianco,
2007
.
Elizabeth A. Holm,
Paul T. Vianco,
Michael K. Neilsen,
2008
.
Paul T. Vianco,
D. R. Frear,
S. N. Burchett,
1999
.
Paul T. Vianco,
I. Artaki,
D. W. Finley,
1995
.
Alice C. Kilgo,
Paul T. Vianco,
Jerome A. Rejent,
2004
.
Paul T. Vianco,
D. R. Frear,
D. Frear,
1993
.
Paul T. Vianco,
K. J. Lau,
H. E. Fang,
2004
.
Paul T. Vianco,
P. L. Hopkins,
K. L. Erickson,
1994
.
Sheri Sheppard,
Paul T. Vianco,
David M. Pierce,
2007
.
Paul T. Vianco,
J. J. Stephens,
P. Vianco,
1997
.
Paul T. Vianco,
Jing Cheng,
P. Vianco,
2011
.
Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses
Paul T. Vianco,
Jerome A. Rejent,
P. Vianco,
1999
.
Alice C. Kilgo,
Paul T. Vianco,
Jerome A. Rejent,
2004
.
Paul T. Vianco,
Paul F. Hlava,
Jerome A. Rejent,
2004
.
Alice C. Kilgo,
Paul T. Vianco,
Bonnie M. McKenzie,
2018
.
Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis
Paul T. Vianco,
Jerome A. Rejent,
P. Vianco,
1999
.
Paul T. Vianco,
P. Vianco,
C. Chow,
2006
.