P. He

发表

P. He, Hongyan Huang, Zhansheng Liu, 2019, Tribology International.

D. P. Sekulic, Mengyuan Zhao, P. He, 2017, Journal of Electronic Materials.

P. He, Jun Wang, Tiesong Lin, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Shuai Li, P. He, W. Long, 2020, Journal of Materials Science: Materials in Electronics.

K. Paik, P. He, Mingliang L. Huang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

P. He, Jun Wang, Tiesong Lin, 2015, Journal of Electronic Materials.

P. He, Zhilong Cao, Ruiyang Wang, 2018, Construction and Building Materials.

Meng Zhao, Lei Sun, Liang Zhang, 2019, Science and technology of advanced materials.

P. He, Hongyun Zhao, F. Shu, 2019, Transactions of Nonferrous Metals Society of China.

Zhe Sun, P. He, Y. Lv, 2014, Journal of Materials Engineering and Performance.

P. He, Wei Guo, Tiesong Lin, 2019, Ceramics International.

D. P. Sekulic, P. He, Wanqin Zhao, 2021, Journal of Materials Research and Technology.

Wei Guo, P. He, Tiesong Lin, 2019, Ceramics International.

P. He, Wei Guo, Tiesong Lin, 2019, Materials Characterization.

P. He, Tiesong Lin, Shuye Zhang, 2019, Journal of Materials Science: Materials in Electronics.

D. P. Sekulic, P. He, Yan Liu, 2019, Journal of the European Ceramic Society.

P. He, Ji Shi, Hua-jun Wang, 2019, Transactions of the Indian Institute of Metals.

D. P. Sekulic, Zhihua Yang, P. He, 2017 .

D. P. Sekulic, P. He, Jianhao Xu, 2020, Journal of Materials Science.

K. Paik, P. He, Tiesong Lin, 2019, Journal of Materials Science: Materials in Electronics.

Shuye Zhang, Peng He, Tiesong Lin, 2019, Journal of Materials Science: Materials in Electronics.

Yang Cao, K. Paik, P. He, 2019, Journal of Materials Science: Materials in Electronics.

P. He, Yongtao Jiu, Shuai Li, 2021, Journal of Manufacturing Processes.

W. Cao, M. Cao, Jie Yuan, 2021, Nano-micro letters.

Peng He, Shiyun Dong, Shixing Yan, 2018, Surface and Coatings Technology.

S. Dong, P. He, Binshi Xu, 2018, Optics & Laser Technology.

H. Inoue, P. He, Panpan Lin, 2021, Journal of the European Ceramic Society.

D. P. Sekulic, Yulong Li, W. Liu, 2013, Journal of Materials Science.

P. He, Hui Yang, Hong Chen, 2020, Transactions of the Indian Institute of Metals.

W. Guo, P. He, Panpan Lin, 2019, Procedia Manufacturing.

P. He, Dongyang Li, Fengjiang Wang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

K. Paik, P. He, Tiesong Lin, 2019, Lead Free Solders.

Ming Yang, K. Paik, P. He, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Yanhong Tian, P. He, Z. Xiu, 2016, Journal of Materials Science: Materials in Electronics.

P. He, Liang Zhang, Su-juan Zhong, 2020, Journal of Materials Science: Materials in Electronics.

Peng Xue, Hao Zhang, Weiliang Liang, 2019, Applied Sciences.

P. He, Huachang Wang, Hongfu Wang, 2014, Journal of Wuhan University of Technology-Mater. Sci. Ed..

Xing Ma, Ling Zhang, Jiaheng Zhang, 2019, Nanotechnology.

D. P. Sekulic, P. He, Tiesong Lin, 2016, Journal of Materials Engineering and Performance.

P. He, Tiesong Lin, Shuye Zhang, 2019, Journal of Materials Science: Materials in Electronics.

K. Paik, P. He, Tiesong Lin, 2018, 2018 20th International Conference on Electronic Materials and Packaging (EMAP).

JiaCheng Yu, Peng He, QingLin Wang, 2006, 2006 IEEE/RSJ International Conference on Intelligent Robots and Systems.