F. Wei

发表

Jiqiu Qi, Y. Sui, F. Wei, 2019, Journal of Materials Science: Materials in Electronics.

Jiqiu Qi, Y. Sui, Yezeng He, 2017, Journal of Materials Science: Materials in Electronics.

Jiqiu Qi, Y. Sui, Yezeng He, 2019, Journal of Materials Science: Materials in Electronics.

Fei Yang, Jiqiu Qi, Y. Sui, 2018, Journal of Materials Science: Materials in Electronics.

Z. Sun, Jiqiu Qi, Y. Sui, 2017, Journal of Materials Science: Materials in Electronics.

Yingli Li, Jiqiu Qi, Y. Sui, 2019, Journal of Materials Science: Materials in Electronics.

Jiqiu Qi, Y. Sui, Yezeng He, 2017, Journal of Wuhan University of Technology-Mater. Sci. Ed..

Jiqiu Qi, Y. Sui, Yezeng He, 2019, Journal of Materials Science: Materials in Electronics.

Jiqiu Qi, Y. Sui, Yezeng He, 2019, Journal of Materials Science: Materials in Electronics.

Jiqiu Qi, Y. Sui, Yezeng He, 2017, Journal of Materials Science: Materials in Electronics.

Y. Sui, Yezeng He, Qingkun Meng, 2018, Journal of Materials Science: Materials in Electronics.

P. Cao, Y. Sui, Yezeng He, 2018, Journal of Materials Science: Materials in Electronics.

J. Chen, Y. Sui, F. Wei, 2021, Journal of Materials Science: Materials in Electronics.

Xiaolong Zhang, Y. Sui, Yezeng He, 2020, Journal of Materials Science: Materials in Electronics.

Y. Sui, Yezeng He, Qingkun Meng, 2018, Journal of Materials Science.

Y. Sui, Yezeng He, Qingkun Meng, 2018, Journal of Materials Science: Materials in Electronics.

Y. Sui, Yezeng He, Qingkun Meng, 2020, Journal of Materials Science: Materials in Electronics.

Y. Sui, Yezeng He, Qingkun Meng, 2018, Journal of Materials Science: Materials in Electronics.

Lei Zhu, Y. Sui, Qingkun Meng, 2022, Journal of Materials Research and Technology.

Y. Sui, F. Wei, P. Hou, 2017, Journal of Materials Science: Materials in Electronics.

Hao Zhang, Y. Sui, Qingkun Meng, 2021, Surfaces and Interfaces.

Y. Sui, Yezeng He, F. Wei, 2018, Canadian Metallurgical Quarterly.

Y. Sui, Yezeng He, Qingkun Meng, 2017 .

Jing Mao, Kehua Dai, Jun-chao Zheng, 2021, Ceramics International.

Jing Mao, Kehua Dai, Jun-chao Zheng, 2021, Ceramics International.

Y. Sui, Yezeng He, Qingkun Meng, 2017, Journal of Materials Science: Materials in Electronics.

Y. Sui, Qingkun Meng, F. Wei, 2023, Journal of Electroanalytical Chemistry.

Xiaolong Zhang, Y. Sui, Yezeng He, 2019, Journal of Materials Science: Materials in Electronics.

Y. Sui, Yezeng He, Qingkun Meng, 2017, Journal of Materials Science: Materials in Electronics.

Y. Sui, F. Wei, Tie Shu, 2021, Colloids and Surfaces A: Physicochemical and Engineering Aspects.

Y. Sui, Yezeng He, Qingkun Meng, 2016, Journal of Wuhan University of Technology-Mater. Sci. Ed..

Y. Sui, Qingkun Meng, F. Wei, 2023, ACS Applied Nano Materials.

Y. Sui, Qingkun Meng, F. Wei, 2023, ACS Applied Engineering Materials.

Y. Sui, F. Wei, Jinlong Liu, 2021, Journal of Colloid and Interface Science.

Y. Sui, Qingkun Meng, F. Wei, 2022, Journal of Materials Science: Materials in Electronics.

Y. Sui, F. Wei, Zhi Sun, 2021, Journal of Materials Science: Materials in Electronics.

Y. Sui, Qingkun Meng, F. Wei, 2023, Journal of Energy Storage.

Y. Sui, Yezeng He, Qingkun Meng, 2018, Journal of Materials Science: Materials in Electronics.

Y. Sui, Yezeng He, Qingkun Meng, 2018, Journal of Materials Science: Materials in Electronics.

F. Wei, Jinlin Yang, G. Yu, 2015, International Journal of Electrochemical Science.

Yi Wu, Y. Sui, Qingkun Meng, 2023, Colloids and Surfaces A: Physicochemical and Engineering Aspects.

Y. Sui, Qingkun Meng, F. Wei, 2023, Colloids and Surfaces A: Physicochemical and Engineering Aspects.

Y. Sui, Qingkun Meng, F. Wei, 2024, Journal of colloid and interface science.