I. Kierzewski
发表
Jianwei Song,
Ying Zhang,
Liangbing Hu,
2017
.
S. Bedair,
C. Meyer,
B. Hanrahan,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
S. Bedair,
C. Meyer,
N. Lazarus,
2014
.
S. Bedair,
C. Meyer,
J. Pulskamp,
2014
.
Nicholas R. Jankowski,
I. Kierzewski,
L. Boteler,
2018
.
Yonggang Yao,
Liangbing Hu,
J. Y. Zhu,
2017,
ACS applied materials & interfaces.
Sarah S. Bedair,
Xueyan Song,
Nathan Lazarus,
2013
.
S. Bedair,
J. Pulskamp,
I. Kierzewski,
2020,
Journal of Microelectromechanical Systems.
J. Pulskamp,
I. Kierzewski,
V. Tseng,
2019,
IEEE Electron Device Letters.
Geoffrey A. Slipher,
S. Bedair,
C. Meyer,
2015,
ACS applied materials & interfaces.
Liangbing Hu,
S. Bedair,
B. Hanrahan,
2020
.
Sevket U. Yuruker,
Boyang Liu,
Liangbing Hu,
2017,
ACS nano.
S. Bedair,
C. Meyer,
J. Pulskamp,
2014,
IEEE Electron Device Letters.
I. Kierzewski,
Adam A. Wilson,
D. Sharar,
2021,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
S. Bedair,
N. Lazarus,
I. Kierzewski,
2017,
ACS applied materials & interfaces.
S. Bergbreiter,
S. Bedair,
J. Pulskamp,
2018
.
Chengwei Wang,
J. Dai,
Liangbing Hu,
2017
.
Ying Zhang,
Apurva Mehta,
Matthew J. Kramer,
2013
.
N. Lazarus,
M. Leite,
I. Kierzewski,
2019,
Advanced Electronic Materials.
S. Bedair,
N. Lazarus,
I. Kierzewski,
2017,
ACS applied materials & interfaces.