Dong Shi

Junction Temperature Measurement Method for Power mosfets Using Turn-On Delay of Impulse Signal

Shiwei Feng, Yamin Zhang, Bangbing Shi, 2018, IEEE Transactions on Power Electronics.

Rapid test method for thermal characteristics of semiconductor devices

Shiwei Feng, Yamin Zhang, Dong Shi, 2017, 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

Degradation of the die attach layer in chip-on-board packaged light-emitting diodes during temperature cycling

Shiwei Feng, Dong Shi, Xin Yan, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).