C.C. Lee

发表

Experimental verification of the Kramers-Kronig relationship for acoustic waves

B. G. Martin, C.C. Lee, M. Lahham, 1990, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

Silver Joints Between Silicon Chips and Copper Substrates Made by Direct Bonding at Low-Temperature

C.C. Lee, P.J. Wang, P. Wang, 2010, IEEE Transactions on Components and Packaging Technologies.

Are Intermetallics in Solder Joints Really Brittle?

C.C. Lee, P.J. Wang, J.S. Kim, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

A new bonding technology dealing with large CTE mismatch between large Si chips and Cu substrates

C.C. Lee, P.J. Wang, C.C. Lee, 2008, 2008 58th Electronic Components and Technology Conference.

Fluxless Bonding of Silicon to Molybdenum Using Sn-rich Solders

C.C. Lee, P.J. Wang, Dongwook Kim, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

An electrical model with junction temperature for light-emitting diodes and the impact on conversion efficiency

C.C. Lee, C.C. Lee, Jeong Park, 2005, IEEE Electron Device Letters.

Fluxless Sn-rich Sn-Au flip-chip bonding using electroplating processes

C.C. Lee, Jongsung Kim, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Fluxless Hermetic Lid Sealing Using Electroplated Sn-Rich Solder

C.C. Lee, P.J. Wang, J.S. Kim, 2008, IEEE Transactions on Components and Packaging Technologies.

Very High-Temperature Joints Between Si and Ag–Copper Substrate Made at Low Temperature Using InAg System

C.C. Lee, P.J. Wang, J. S. Kim, 2008, IEEE Transactions on Components and Packaging Technologies.

Fluxless bonding of silicon to copper with high-temperature Ag-Sn joint made at low temperature

C.C. Lee, J.S. Kim, T. Yokozuka, 2006, 56th Electronic Components and Technology Conference 2006.

Thermal modeling and measurement of AlGaN-GaN HFETs built on sapphire and SiC substrates

C.C. Lee, Jeong Park, Moo Whan Shin, 2004, IEEE Transactions on Electron Devices.

Temperature measurement of visible light-emitting diodes using nematic liquid crystal thermography with laser illumination

C.C. Lee, C.C. Lee, Jeong Park, 2004, IEEE Photonics Technology Letters.

Ag–Copper Structure for Bonding Large Semiconductor Chips

C.C. Lee, J. S. Kim, P. Wang, 2008, IEEE Transactions on Components and Packaging Technologies.

Millimeter-wave coplanar strip (CPS) line flip chip packaging on PCBs

C.C. Lee, Y.K. Song, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

High temperature joints manufactured at low temperature

C.C. Lee, W. So, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

A fluxless oxidation-free bonding technology

C.C. Lee, G. Matijasevic, Yi-Chia Chen, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Fluxless Bonding of Silicon to Ag–Copper Using In–Ag With Two UBM Designs

C.C. Lee, J.S. Kim, P. Wang, 2008, IEEE Transactions on Components and Packaging Technologies.

Extremely reliable bonding of large silicon dice using gold-tin alloy

G. Matijasevic, C.C. Lee, Chin C. Lee, 1990, 40th Conference Proceedings on Electronic Components and Technology.

High temperature Cu-Sn joints manufactured by a 250/spl deg/C fluxless bonding process

C.C. Lee, S.J. Lee, Yi-Chia Chen, 1995, Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95).

A fluxless process of producing tin-rich gold-tin joints in air

C.C. Lee, R. Chuang, C.C. Lee, 2004, IEEE Transactions on Components and Packaging Technologies.

Fluxless Sn-Bi-Au bonding process using multilayer design

C.C. Lee, R. Chuang, S. Choe, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

A fluxless Sn-In bonding process achieving high remelting temperature

C.C. Lee, R. Chuang, S. Choe, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

A barrier metallization technique on copper substrates for soldering applications

C.C. Lee, R. Chuang, W. So, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Low temperature fluxless bonding technique using In-Sn composite

William W. So, C.C. Lee, Chin C. Lee, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Thermal and package design of high power laser diodes

D. H. Chien, C.C. Lee, C.C. Lee, 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

An intelligent controller based on approximate reasoning and reinforcement learning

C.-C. Lee, H. R. Berenji, H. Berenji, 1989, Proceedings. IEEE International Symposium on Intelligent Control 1989.

Electroplated Sn-Au structures for fabricating fluxless flip-chip Sn-rich solder joints

C.C. Lee, Jeong H. Park, Jongsung Kim, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

A New Carrier Transport Model for Light Emitting Devices with Quantum Well

C.C. Lee, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

A reliability study of Au-Sn eutectic binding with Ga-As dice

C.C. Lee, G. Matijasevic, C.C. Lee, 1989, 27th Annual Proceedings., International Reliability Physics Symposium.

Thermal study of GaN-based HFET devices

M. Shin, C.C. Lee, Jeong H. Park, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Point source thermal response of five-layer anisotropic plate structures

A. Palisoc, C.C. Lee, Y. Min, 1990, InterSociety Conference on Thermal Phenomena in Electronic Systems.