S. Tanaka

发表

High-energy density miniature thermoelectric generator using catalytic combustion

M. Esashi, K. Yoshida, S. Tanaka, 2006, Journal of Microelectromechanical Systems.

High energy density miniature electrical and thermal power source using catalytic combustion of butane

M. Esashi, M. Esashi, K. Yoshida, 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.

Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO3 for temperature compensation of RF surface acoustic wave devices

K. Hashimoto, K. Totsu, S. Nakayama, 2012, 2012 IEEE International Ultrasonics Symposium.

Infrared-to-visible transducer using temperature sensitive Eu(TTA)3 on self-suspended thin film for inexpensive thermal imaging device

M. Esashi, S. Tanaka, T. Tsukamoto, 2013, 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS).

Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature

M. Esashi, S. Tanaka, A. Kasuga, 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.

Lithium-niobate-based surface acoustic wave device directly integrated on IC

M. Esashi, S. Tanaka, Kyeongdong Park, 2011, 2011 IEEE International Ultrasonics Symposium.

Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test

M. Esashi, M. Fujita, T. Somekawa, 2013, 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS).

Silicon-carbide microfabrication by silicon lost molding for glass-press molds

M. Esashi, R. Watanabe, Jingfeng Li, 2003, Journal of Microelectromechanical Systems.

Fabrication of microprobes on a ultrathick glass substrate with narrow-pitch electrical feedthroughs for next-generation lsi burn-in tests

M. Esashi, S. Tanaka, S. Fujimoto, 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.

A study of blister formation in ALD Al2O3 grown on silicon

V. Simons, I. De Wolf, R. Mertens, 2012, 2012 38th IEEE Photovoltaic Specialists Conference.

P0-13 Phase Velocity Control of Surface Acoustic Waves Based on Surface Shorting and Electrical Field Application Using MEMS Switches

M. Esashi, M. Esashi, S. Tanaka, 2007, 2007 IEEE Ultrasonics Symposium Proceedings.

Imprinted laminate wafer-level packaging for SAW ID-tags and SAW delay line sensors

M. Esashi, S. Tanaka, J. Kuypers, 2011, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

Etch rate dependence on crystal orientation of lithium niobate

M. Esashi, S. Tanaka, A. Randles, 2010, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

Monolithic Phase Shifter Based on Mechanically Tunable Saw Delay Line

M. Esashi, S. Tanaka, J. Kuypers, 2007, TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.

Silicon carbide diode bridge circuit for capacitive sensor readout in high temperature (673K) environmnet

M. Esashi, S. Tanaka, R. Chand, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

Silicon Carbide Surface Micromachining Technology by Tetramethylsilane-Based Atmospheric Vapor Deposition

M. Esashi, S. Tanaka, Y. Hatakeyama, 2009, 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems.

Gray-scale lithography using mask-less exposure system

M. Esashi, K. Totsu, S. Tanaka, 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

P4L-4 Etch Rate Dependence on Crystal Orientation for Lithium Niobate

M. Esashi, S. Tanaka, A.B. Randies, 2007, 2007 IEEE Ultrasonics Symposium Proceedings.

Micro Thermal Diode with Glass Thermal Insulation Structure Embedded in Vapor Chamber

M. Esashi, S. Tanaka, T. Tsukamoto, 2013 .

Thin palladium membrane microreactor with porous silicon support and their application in hydrogenation reaction

M. Esashi, S. Tanaka, F. Mizukami, 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

MERCURY DROPLET ACTUATION USING NEW DESIGN OF ELECTRODES FOR LONG WORKING RANGE

M. Esashi, S. Tanaka, T. Tsukamoto, 2009 .

2.45 GHZ Saw-based passive binary transponder for wireless interfaces of integrated sensors

M. Esashi, S. Tanaka, J. Kuypers, 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.

Micro/nano glass press molding using silicon carbide molds fabricated by silicon lost molding

M. Esashi, M. Esashi, S. Tanaka, 2005, 18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005..

Application of lithium niobate etch stop technology to SAW pressure sensors

M. Esashi, M. Esashi, S. Tanaka, 2008, 2008 IEEE Ultrasonics Symposium.

Spatial distribution and polarization dependence of the optical near‐field in a silicon microfabricated probe

M. Esashi, T. Ono, S. Tanaka, 2001, Journal of microscopy.

Polyaniline electrochromic micro-display powered by on-chip Mg/AgCl battery for wireless data transfer of disposable bio-sensing chip

S. Tanaka, T. Tsukamoto, Y. Zhu, 2017, 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

MEMS-based thin palladium membrane microreactors

Shu-Ying Ye, Shuji Tanaka, Masayoshi Esashi, 2006, International Commission for Optics.

Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI

Yutaka Nonomura, Masayoshi Esashi, Shuji Tanaka, 2011 .

MEMS-Based Probe Array for Wafer Level LSI Testing Transferred onto Low CTE LTCC Substrate by Au/Sn Eutectic Bonding

M. Esashi, M. Esashi, S. Tanaka, 2007, TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.

Experimental estimation of cooling power of a solid state micro magnetic refrigerator using La(FexSi1−x)13Hy

M. Esashi, S. Tanaka, T. Tsukamoto, 2012, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).

Low contact resistance micro thermal switch with carbon-nanotube-enhanced contactor

M. Esashi, S. Tanaka, T. Tsukamoto, 2009, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.

Flipped CMOS-diaphragm capacitive tactile sensor surface mountable on flexible and stretchable bus line

M. Muroyama, H. Funabashi, Y. Hata, 2015, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

Integration and packaging technology of MEMS-on-CMOS tactile sensor for robot application using molded thick BCB layer and backside-grooved electrical connection

M. Muroyama, M. Fujiyoshi, Y. Nonomura, 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

2.45 GHz Passive Wireless Temperature Monitoring System Featuring Parallel Sensor Interrogation and Resolution Evaluation

M. Esashi, S. Tanaka, J.H. Kuypers, 2006, 2006 5th IEEE Conference on Sensors.

A 1.7mm3 MEMS-on-CMOS tactile sensor using human-inspired autonomous common bus communication

T. Nakayama, M. Muroyama, H. Funabashi, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection

M. Muroyama, H. Funabashi, Y. Omura, 2014, 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).

The wafer-level vacuum sealing and electrical interconnection using electroplated gold bumps planarized by single-point diamond fly cutting

S. Tanaka, K. Hikichi, H. Hirano, 2015, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

LTCC-based three dimensional inductors with nano-ferrite embedded core for one-chip tunable RF systems

M. Esashi, Y. Tsai, S. Tanaka, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

Near-field optical apertured tip and modified structures for local field enhancement.

M. Esashi, T. Ono, S. Tanaka, 2001, Applied optics.

Simple Removal Technology of Chemically Stable Polymer in MEMS Using Ozone Solution

M. Esashi, S. Tanaka, S. Yoshida, 2013, Journal of Microelectromechanical Systems.

Ring-shape SMA micro actuator with parylene retention spring for low power consumption, large displacement linear actuation

D. W. de Lima Monteiro, S. Tanaka, T. Tsukamoto, 2015, International Conference on Solid-State Sensors, Actuators and Microsystems.

Thin film transfer technology for tunable SAW filter using integrated ferroelectric varactors

M. Esashi, S. Tanaka, H. Hirano, 2011, 2011 IEEE International Ultrasonics Symposium.

Wideband tunable love wave filter using electrostatically-actuated MEMS variable capacitors integrated on lithium niobate

M. Esashi, M. Esashi, K. Hashimoto, 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

Low-voltage PZT-actuated MEMS switch monolithically integrated with CMOS circuit

M. Esashi, M. Esashi, S. Tanaka, 2012, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).