Z. Wang

Assembly and characterization of micromachined combustor

X. Shan, Z. Wang, Y. Jin, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

A 3-D wafer level hermetical packaging for MEMS

Z. Wang, Y. Jin, C.K. Wong, 2004, Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004..

Evaluation of Printed Heating Element for Micro-System Applications

L. L. Wai, Z. Wang, W. Fan, 2007, 2007 9th Electronics Packaging Technology Conference.

Influence of Radiative Energy Transfer on the Thermal Behavior of Bonded InGaAs/GaAs Lasers

Z. Wang, J. Teo, L. Goi, 2009, IEEE Transactions on Advanced Packaging.

CMP of PC, PMMA and SU-8 Polymers

Z. Zhong, Z. Wang, Y. S. Tan, 2005, Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.

Carbon Nanotubes (CNTs) as conductive filler for polymer composite

B. Tay, Z. Wang, J. Wei, 2008, 2008 2nd IEEE International Nanoelectronics Conference.

Mechanical Properties, Morphologies and Thermal Decomposition Kinetics of Poly(lactic acid) Toughened by Waste Rubber Powder

J. Zhu, Shi-bin Nie, Z. Wang, 2015 .

Modified Face-Down Bonding of Ridge-Waveguide Lasers Using Hard Solder

X.Q. Shi, Z. Wang, J. Teo, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

An optimized face-down bonding process for laser diode packages

X.Q. Shi, Z. Wang, G.Y. Li, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Single-chip fabrication of integrated fluid systems (IFS)

Z. Wang, H. Gong, M. K. Lim, 1998, Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176.