C.K. Wong

Assembly and characterization of micromachined combustor

X. Shan, Z. Wang, Y. Jin, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

A 3-D wafer level hermetical packaging for MEMS

Z. Wang, Y. Jin, C.K. Wong, 2004, Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004..

Influence of solder volume on interfacial reaction between Sn-Ag-Cu solder and TiW/Cu/Ni UBM

J. Pang, F. L. Ng, C.K. Wong, 2005, 2005 7th Electronic Packaging Technology Conference.

Tri-Layer Structures Subjected to Combined Temperature and Mechanical Loadings

C.K. Wong, E. Wong, 2008, IEEE Transactions on Components and Packaging Technologies.

Low temperature bonding process for wafer-level MEMS packaging

J. Wei, C.K. Wong, L.C. Lee, 2004, 2004 IEEE International Conference on Semiconductor Electronics.

Low temperature glass-to-glass wafer bonding

Loke Chong Lee, Jun Wei, S. M. L. Nai, 2003 .

Silicon-to-silicon wafer bonding with gold as intermediate layer

C.K. Wong, S. Nai, C.K. Wong, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Fabrication of thermoelectric cooler for device integration

C.K. Wong, W. Fan, K. M. Chua, 2005, 2005 7th Electronic Packaging Technology Conference.

Process simulation of Kovar-glass-silicon bonding for micromachined combustor

Xue Chuan Shan, Ying Zhao, Min Miao, 2006, International Commission for Optics.

Low temperature Si-to-Si wafer bonding with sol-gel coating as intermediate layer

C.K. Wong, S. Deng, C. Tan, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).