D. Mao

发表

Processing, structure, and electrical properties of MnO2-doped Pb(Yb1/2Nb1/2)0.10(Zr0.47Ti0.53)0.90O3 ceramics

Yixuan Zhang, Haiyan Chen, D. Mao, 2013 .

The effect of different TSV electroplating levelers on the copper residual stress

Huiqin Ling, Ming Li, D. Mao, 2012 .

Through-silicon via filling process using pulse reversal plating

Huiqin Ling, Ming Li, D. Mao, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

The preparation of LiCoO2 nanoplates via a hydrothermal process and the investigation of their electrochemical behavior at high rates

Zhiyu Wang, D. Mao, Weijie Song, 2009, Nanotechnology.

Influence of leveler concentration on copper electrodeposition for through silicon via filling

Huiqin Ling, Ming Li, D. Mao, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Interdiffusion of an Au/Ni/Cr multilayer metallization on silicon substrates

Dali Mao, D. Mao, Benda Yan, 1989 .

Titania nanostructures fabricated through anodization of Ti6Al4V alloy

Ming Li, D. Mao, D. Ding, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Preparation and characterization of a titanium-substituted hydroxyapatite photocatalyst

Ming Li, D. Mao, Chengkang Chang, 2007 .

Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition for appliance industry

T. Hang, Anmin Hu, Ming Li, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition for appliance industry

T. Hang, Anmin Hu, Ming Li, 2009 .

Influence of reflow atmosphere on SAC305 solder joints

Ming Li, D. Mao, D. Ding, 2011, 2011 International Symposium on Advanced Packaging Materials (APM).

Study on the adhesion and reliability of Epoxy Molding Compound and shaped Pd Preplated leadframes

Ming Li, Wenjing Zhang, D. Mao, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Microstructural characterization of electroplating Sn on lead-frame alloys

Ming Li, D. Mao, D. Ding, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Wetting behavior of electrolyte in fine pitch Cu/Sn bumping process by electroplating

T. Suga, Ming Li, D. Mao, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

The Application of Nanocone Array in Pd Pre-Plated Frame

Huiqin Ling, Ming Li, D. Mao, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Influence of Cr alloying on the oxidation resistance of Sn–8Zn–3Bi solders

Anmin Hu, Ming Li, D. Mao, 2013, Journal of Materials Science: Materials in Electronics.

Controlled crystallization of glass–ceramics with two nucleating agents

Ming Li, Anmin Hu, Dali Mao, 2009 .

Thermal reliability of Ag-8Au-3Pd alloy wire bonds

Ming Li, Dali Mao, Hope Chiu, 2013, 2013 3rd IEEE CPMT Symposium Japan.

Thermal stability and electrical characteristics of NiSi films with electroplated Ni(W) alloy

Anmin Hu, Ming Li, D. Mao, 2011 .

Thermal stability and in vitro bioactivity of Ti–Al–V–O nanostructures fabricated on Ti6Al4V alloy

Ming Li, D. Mao, D. Ding, 2009, Nanotechnology.

Anodic growth of uniform nanotube arrays on biphase Ti35Nb5Zr alloy

Ming Li, Lin Huang, D. Mao, 2010 .

Upper Critical Magnetic Field for a Modified Maltifiamental Nb3A1Wire

H. Wada, D. Mao, K. Itoh, 1997 .

Ni-doped TiO2 nanotube arrays on shape memory alloy

D. Mao, Bangshang Zhu, C. Ning, 2011 .

Luminescent properties of Ca2MgSi2O7 phosphor activated by Eu2+, Dy3+ and Nd3+

D. Mao, Chengkang Chang, Lingyong Jiang, 2004 .

Concentration quenching of Eu2+ in Ca2MgSi2O7: Eu2+ phosphor

D. Mao, Chengkang Chang, Lingyong Jiang, 2003 .

Preparation and Photoluminescence of Single-Crystalline GdVO4:Eu3+ Nanorods by Hydrothermal Conversion of Gd(OH)3 nanorods

D. Mao, Chengkang Chang, Meng Gu, 2008 .

Depressing effect of 0.1 wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Anmin Hu, Ming Li, D. Mao, 2010 .

Electroless plating of copper nano-coned array for high reliability packaging

T. Hang, Anmin Hu, Ming Li, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Diffusion barrier performance of W/Ta-W-N double layers for Cu metallization

Huiqin Ling, Ming Li, D. Mao, 2006 .

Diffusion barrier performance of reactively sputtered Ta-W-N between Cu and Si

Huiqin Ling, Ming Li, D. Mao, 2004 .

Diffusion barrier performances of thin Mo, Mo-N and Mo/Mo-N films between Cu and Si

Huiqin Ling, Ming Li, D. Mao, 2005 .

Novel composite proton-exchange membrane based on proton-conductive glass powders and sulfonated poly (ether ether ketone)

Ming Li, Q. Xie, Haibin Li, 2015 .

Simulation of electric field uniformity in through silicon via filling

Huiqin Ling, Ming Li, D. Mao, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Improved performance of fuel cell with proton-conducting glass membrane

Ming Li, Haibin Li, D. Mao, 2012 .

Thermal dehydration kinetics of a rare earth hydroxide, Gd(OH)3

D. Mao, Chengkang Chang, 2007 .

An investigation into copper oxidation behavior

Anmin Hu, Ming Li, D. Mao, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Influence of crystal orientation on copper oxidation failure

Jie Gao, Anmin Hu, Ming Li, 2009 .

Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

Anmin Hu, Ming Li, D. Mao, 2009 .

Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder

Jing Hu, Ming Li, Anmin Hu, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Microstructure evolution of AZ31 Mg alloy during equal channel angular extrusion

W. Ding, Bing Chen, Li Jin, 2006 .

Luminescent properties of CaMgSi2O6 and Ca2MgSi2O7 phosphors activated by Eu2+, Dy3+and Nd3+

D. Mao, Chengkang Chang, Lingyong Jiang, 2003 .

Electrodeposition of Co-Ni nanostructures

Ming Li, D. Mao, D. Ding, 2011, 2011 International Symposium on Advanced Packaging Materials (APM).

Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution

Anmin Hu, Ming Li, D. Mao, 2011 .

Long lasting phosphorescence of Gd2O2S:Eu,Ti,Mg nanorods via a hydrothermal routine

D. Mao, Chengkang Chang, Meng Gu, 2008 .

Long lasting behavior of Gd2O2S:Eu3+ phosphor synthesized by hydrothermal routine

T. Hang, D. Mao, Chengkang Chang, 2008 .

Eu2+ activated long persistent strontium aluminate nano scaled phosphor prepared by precipitation method

D. Mao, Chengkang Chang, Zhao-Xin Yuan, 2006 .

Effect of nucleation temperatures and time on crystallization behavior and properties of Li2O–Al2O3–SiO2 glasses

Ming Li, D. Mao, K. Liang, 2006 .

Photoluminescence of Eu single doped and Eu/Dy codoped Sr2Al2SiO7 phosphors with long persistence

Zhiyu Wang, Yixuan Zhang, D. Mao, 2009 .

Luminescent properties of Sr2MgSi2O7 and Ca2MgSi2O7 long lasting phosphors activated by Eu2+, Dy3+

D. Mao, Chengkang Chang, Qin Fei, 2005 .

Effect of composition on the luminescent properties of Sr4Al14O25: Eu2+, Dy3+ phosphors

D. Mao, Chengkang Chang, W. Ying, 2004 .

Preparation of long persistent SrO·2Al2O3 ceramics and their luminescent properties

D. Mao, Chengkang Chang, Jian-nan Shen, 2003 .

Effects of the surface hardness of MIS leadframe on the bonding strength

Ming Li, D. Mao, Weiping Li, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Photoluminescence and afterglow behavior of Eu2+, Dy3+ and Eu3+, Dy3+ in Sr3Al2O6 matrix

Zhiyu Wang, D. Mao, Xi Chen, 2010 .

Preparation and in vitro bioactivities of calcium silicate nanophase materials

Ming Li, D. Mao, Chengkang Chang, 2005 .

A new long persistent blue-emitting Sr2ZnSi2O7:Eu2+, dy3+ prepared by sol-gel method

Bin Zhang, D. Mao, Chengkang Chang, 2004 .

Luminescence of long-lasting CaAl2O4:Eu2+,Nd3+ phosphor by co-precipitation method

Jie Xu, D. Mao, Chengkang Chang, 2006 .

Rietveld analysis for Eu2+ doped 4SrO·7Al2O3 and its luminescent properties

D. Mao, Chengkang Chang, Zhao-Xin Yuan, 2004 .

Long lasting phosphorescence of Sr4Al14O25:Eu2+,Dy3+ thin films by magnetron sputtering

D. Mao, Chengkang Chang, 2004 .

Luminescent properties of CaMgSi2O6-based phosphors co-doped with different rare earth ions

D. Mao, Chengkang Chang, Lingyong Jiang, 2004 .

Eu2+ Activated Long Persistent Strontium Aluminate Nano Scaled Phosphor Prepared by Precipitation Method.

D. Mao, Chengkang Chang, Zhao-Xin Yuan, 2006 .

Performances of CaSiO3 ceramic sintered by Spark plasma sintering

Anmin Hu, Ming Li, D. Mao, 2008 .

Rietveld Analysis for Eu2+ Doped 4SrO×7Al2O3 and Its Luminescent Properties.

D. Mao, Chengkang Chang, Zhao-Xin Yuan, 2004 .

Luminescent Properties of CaMgSi2O6‐Based Phosphors Co‐Doped with Different Rare Earth Ions.

D. Mao, Chengkang Chang, Lingyong Jiang, 2004 .

Preparation of Calcium Silicate Nanobelts and the In Vitro Behavior in a Simulated Body Fluid

Huiqin Ling, D. Mao, Chengkang Chang, 2007 .

Growth behavior, morphology and properties of lithium aluminosilicate glass ceramics with different amount of CaO, MgO and TiO2 additive

Ming Li, D. Mao, A. Hu, 2008 .

Crystallization of spodumene-diopside in the las glass ceramics with CaO and MgO addition

Ming Li, D. Mao, A. Hu, 2007 .

Characteristics of crystals precipitated in sintered apatite/wollastonite glass ceramics

D. Mao, J. Wu, C. K. Chang, 2000 .

Mechanical properties and microstructure of AZ31 Mg alloy processed by two-step equal channel angular extrusion

W. Ding, Li Jin, D. Mao, 2005 .

An electron back-scattered diffraction study on the microstructure evolution of AZ31 Mg alloy during equal channel angular extrusion

W. Ding, Li Jin, D. Mao, 2006 .

Effect of Zn content on tensile and electrochemical properties of 3003 Al alloy

Ming Li, D. Mao, Gao Yongjin, 2010 .

Effect of Second Phase on the Mechanical Properties of Mg-Al-Zn Alloy by Equal Channel Angular Extrusion

W. Ding, Li Jin, D. Mao, 2007 .

Magnetization measurement for a nearly stoichiometric Nb3Al wire

H. Wada, D. Mao, K. Itoh, 1998 .

Field and temperature dependences of critical current in direct-heated Nb-tube processed Nb/sub 3/Al wires

H. Wada, D. Mao, K. Itoh, 1997, IEEE Transactions on Applied Superconductivity.

Microstructural evolution of Sn-9Zn-3Bi and Sn-9Zn-3Bi-0.3Cr solder under high-temperature and high-humidity conditions

Xi Chen, Ming Li, D. Mao, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Electrochemical corrosion behaviour of Sn-8Zn-3Bi-XCr solder in 3.5% NaCl

Ming Li, D. Mao, Jingjing Hu, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Study on the properties of Sn–9Zn–xCr lead-free solder

Ming Li, Anmin Hu, Dali Mao, 2008 .

Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy

Ming Li, Dali Mao, Anmin Hu, 2006 .

Effects of alloying elements on the characteristics of Sn-Zn lead-free solder

Ming Li, Xi Chen, Dali Mao, 2005, 2005 6th International Conference on Electronic Packaging Technology.

Effect of Second-Phase Particles on Grain Refinement of Mg-Al-Zn Alloy during ECAE

W. Ding, Li Jin, D. Mao, 2007 .

Oxidation of the copper alloy with pure copper plating

Ming Li, D. Mao, Yuchen Liu, 2012 .

Bainite Transformation in Fe-0.34%C-Nb Steels

Wei Wang, D. Mao, S. Zhao, 2007 .

On Bainite Transformation Kinetics and Mechanism

Wei Wang, D. Mao, S. Zhao, 2007 .

INTERDIFFUSION OF Au/Ni/Cr ON SILICON SUBSTRATE

D. Mao, B. Yan, D. Lin, 1988 .

Effect of reflow time on shear property of two-step electroplated Sn-3.5Ag solder bumps

Ming Li, D. Mao, Qinghua Zhao, 2012 .

Microstructure evolution of Ag–8Au–3Pd alloy wire during electromigration

Liming Gao, Ming Li, D. Mao, 2015 .

Behavior of intermetallics formation and evolution in Ag–8Au–3Pd alloy wire bonds

Ming Li, Tao Hang, Dali Mao, 2014 .

IMC formation between electroless Ni/Pd/Au surface finish and SnAgCu solder

Yu Wang, Ming Li, D. Mao, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Effect of a trace of Cr on intermetallic compound layer for tin–zinc lead-free solder joint during aging

Ming Li, Anmin Hu, Dali Mao, 2009 .

Interfacial reactions and reliability of Sn-Zn-Bi-XCr solder joints with Cu pads

Ming Li, Xi Chen, Dali Mao, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Effect of Aging on the Interfacial Reaction between Sn-9Zn-xCr Solder and Cu Substrate

Xi Chen, Ming Li, D. Mao, 2007, 2007 8th International Conference on Electronic Packaging Technology.

Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers

Ming Li, Dali Mao, Mingzhi Ni, 2012, Microelectron. Reliab..

Through silicon via filling by copper electroplating in acidic cupric methanesulfonate bath

Huiqin Ling, Ming Li, D. Mao, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

The hydrothermal preparation, crystal structure and photoluminescent properties of GdOOH nanorods

D. Mao, Chengkang Chang, Qing-an Zhang, 2006 .

Characterization of nickel nanocones routed by electrodeposition without any template

T. Hang, Ming Li, D. Mao, 2008, Nanotechnology.

Anodic fabrication and bioactivity of Nb-doped TiO2 nanotubes

Ming Li, Yan Li, Shuo Bai, 2009, Nanotechnology.

Structural control of a cobalt nanocone array grown by directional electrodeposition

T. Hang, Ming Li, D. Mao, 2010 .

Superhydrophobic nickel films fabricated by electro/electroless deposition

Ming Li, D. Mao, A. Hu, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

One-step hydrothermal routine for pure-phased orthorhombic LiMnO2 for Li ion battery application

Dali Mao, Yangxing Li, Fuqiang Huang, 2008 .

Phase conversion and morphology evolution during hydrothermal preparation of orthorhombic LiMnO2 nanorods for lithium ion battery application

Dali Mao, Fuqiang Huang, D. Mao, 2007 .

Preparation and properties of electroless deposited NiP, NiWP as barrier layer on p-type Si

Ming Li, D. Mao, Y. Xin, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization

Ming Li, D. Mao, Jinglin Bi, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Fine pitch and high density Sn bump fabrication

T. Suga, Ming Li, D. Mao, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Microstructure Evolution and Mechanical Properties of AZ 31 Mg Alloy Processed by Equal Channel Angular Extrusion

Li Jin, D. Mao, W. Ding, 2005 .

Low temperature bonding method using Cu micro cones

Ming Li, D. Mao, Zhuo Chen, 2012 .

Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes

Ming Li, Tao Hang, Dali Mao, 2007 .

Electroless plating copper cones on leadframe to improve the adhesion with epoxy molding compound

T. Hang, Ming Li, Wenjing Zhang, 2012 .

Wettability and In Vitro Bioactivity of Doped TiO 2 Nanotubes: Wettability and In Vitro Bioactivity of Doped TiO 2 Nanotubes

Ming Li, D. Mao, D. Ding, 2010 .

Effects of Trace Element Ag on Oxidation Failure of Copper Lead Frame

Ming Li, D. Mao, Hong Shen, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates

Jing Hu, Ming Li, Anmin Hu, 2011, Microelectron. Reliab..

Oxidation behavior of Sn-9Zn-3Bi-xCr solders under high-temperature exposure

Ming Li, D. Mao, Jingjing Hu, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Preparation and Properties of Sn-9Zn-3Bi-Cr Based Lead-free Solder

Ming Li, D. Mao, A. Hu, 2007, 2007 8th International Conference on Electronic Packaging Technology.

Study of free air ball formation in Ag-8Au-3Pd alloy wire bonding

Ming Li, Xu Wang, Zhong Lv, 2014, Microelectron. Reliab..

Fabrication and hydrogen sensing properties of doped titania nanotubes

Ming Li, D. Mao, D. Ding, 2009, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Preparation of Microcones Array Material for Microelectronic Package

Huiqin Ling, Ming Li, D. Mao, 2007, 2007 8th International Conference on Electronic Packaging Technology.

Preparation and Characterization of Perfluorosulfonate‐Free Phosphosilicate Glass‐Based Composite Proton‐Exchange Membrane

Haibin Li, D. Mao, Min Li, 2013 .

The effect of polyethylene glycols upon copper electrodeposition in methanesulfonate electrolytes

Huiqin Ling, Ming Li, D. Mao, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Collaborative effect between additives and current in TSV via filling process

Huiqin Ling, Ming Li, D. Mao, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.