Baojin Chu

发表

Qiming Zhang, E. Furman, Shengguo Lu, 2008, Science.

Xin Zhou, Minren Lin, Q.M. Zhang, 2007, IEEE Transactions on Dielectrics and Electrical Insulation.

Kailiang Ren, Qin Chen, Qiming Zhang, 2007 .

Pan Chen, Baojin Chu, Wanfeng Zhou, 2019, IET Nanodielectrics.

Pan Chen, Baojin Chu, Xiaotong Zhang, 2015, Advanced materials.

Jie Liu, Pan Chen, Baojin Chu, 2021, Journal of Materials Science: Materials in Electronics.

Yang Zhou, Jie Liu, Baojin Chu, 2018, Applied Physics Letters.

Jie Liu, Pan Chen, Baojin Chu, 2019, IEEE Transactions on Dielectrics and Electrical Insulation.

Shuhui Yu, S. Luo, R. Sun, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

R. Zuo, Xu Yang, Baojin Chu, 2022, Journal of Materials Science: Materials in Electronics.

Pan Chen, Baojin Chu, Wanfeng Zhou, 2019, Journal of the American Ceramic Society.

Yalin Lu, X. Zhai, Baojin Chu, 2018, Chemistry of Materials.

Yang Zhou, Shutao Chen, Jie Liu, 2017, IEEE Transactions on Dielectrics and Electrical Insulation.

D. Tian, Baojin Chu, Yu Hou, 2020, Ceramics International.

D. Tian, Pan Chen, Xu Yang, 2021, Acta Materialia.

Qin Chen, Yong Wang, Xin Zhou, 2010, IEEE Transactions on Dielectrics and Electrical Insulation.

J. Yi, Hong Zhang, Pan Chen, 2021, Ceramics International.

Shuhui Yu, S. Luo, Baojin Chu, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Baojin Chu, Q. Pan, 2019, Journal of Applied Physics.

Yang Zhou, Jie Liu, D. Salem, 2019, Applied Physics Express.

Jie Liu, Pan Chen, Baojin Chu, 2021, Journal of Materials Science: Materials in Electronics.

L. Eric Cross, Wenyi Zhu, Baojin Chu, 2009 .

Genshui Wang, X. Dong, W. Peng, 2019, Physical Review Materials.

D. Jeong, D. Tian, Baojin Chu, 2023, Actuators.

Q.M. Zhang, Baojin Chu, Xin Zhou, 2006, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

Jie Liu, Pan Chen, Baojin Chu, 2021, Journal of Materials Science: Materials in Electronics.

Shuhui Yu, S. Luo, Baojin Chu, 2022, International Conference on Electronic Packaging Technology.

Yang Zhou, Jie Liu, Baojin Chu, 2019, Science China Physics, Mechanics & Astronomy.

Qiming Zhang, Baojin Chu, Yong Wang, 2009, 2009 IEEE 9th International Conference on the Properties and Applications of Dielectric Materials.

Q.M. Zhang, Baojin Chu, F. Bauer, 2006, IEEE Transactions on Dielectrics and Electrical Insulation.

Jie Liu, Pan Chen, Baojin Chu, 2020, Science China Materials.

Shuhui Yu, S. Luo, Junyi Yu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Qiming Zhang, E. Furman, Shengguo Lu, 2008, Science.

Baojin Chu, Yaping Che, Jingjing Zuo, 2023, Journal of Materials Science: Materials in Electronics.

Baojin Chu, Q. Pan, Xiaoyan Zhang, 2023, Journal of Applied Physics.