Jiajie Fan

发表

C. Qian, Jiajie Fan, Xuejun Fan, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Jiajie Fan, R. K. Bradley, Xuejun Fan, 2019, Journal of Materials Science: Materials in Electronics.

M. Yazdan Mehr, Cheng Qian, Jiajie Fan, 2015, 2015 12th China International Forum on Solid State Lighting (SSLCHINA).

Jiajie Fan, W. Driel, Xuejun Fan, 2018 .

Jiajie Fan, Xuejun Fan, Guoqi Zhang, 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

C. Qian, Jiajie Fan, Xuejun Fan, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

C. Qian, Jiajie Fan, Xuejun Fan, 2017, Journal of Materials Science: Materials in Electronics.

Guo Qi Zhang, C. Qian, Jiajie Fan, 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

C. Qian, Jiajie Fan, Xuejun Fan, 2015, 2015 12th China International Forum on Solid State Lighting (SSLCHINA).

M. Pecht, Jiajie Fan, Xuejun Fan, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Jiajie Fan, Xuejun Fan, Guoqi Zhang, 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

M. Pecht, Qin Yang, K. Yung, 2016, 2016 3rd Asia-Pacific World Congress on Computer Science and Engineering (APWC on CSE).

Tao Jiang, Jiajie Fan, Xuejun Fan, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Jiajie Fan, W. Cai, Xuejun Fan, 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

C. Qian, Jiajie Fan, Xuejun Fan, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

C. Qian, Jiajie Fan, Xuejun Fan, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Guoqi Zhang, Jiajie Fan, Xuejun Fan, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Jiang Zhou, G. Q. Zhang, Cheng Qian, 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Winco K. C. Yung, Xuejun Fan, Guoqi Zhang, 2020, Laser & Photonics Reviews.

Jiajie Fan, Xuejun Fan, S. Vollebregt, 2022, Journal of physics. Condensed matter : an Institute of Physics journal.

J. J. Fan, C. Qian, J. L. Huang, 2021, Nano-Bio- Electronic, Photonic and MEMS Packaging.

Cell K. Y. Wong, S. Kjelstrup, Jiajie Fan, 2016, IEEE Electron Device Letters.

Jiajie Fan, Xuejun Fan, S. Vollebregt, 2023, Journal of the Mechanics and Physics of Solids.

Jiajie Fan, Xuejun Fan, S. Vollebregt, 2023, Journal of the Mechanics and Physics of Solids.

C. Qian, Jiajie Fan, Xuejun Fan, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

C. Qian, Jiajie Fan, Xuejun Fan, 2016, 2016 13th China International Forum on Solid State Lighting (SSLChina).

Liqiang Cao, Jiajie Fan, Hengyun Zhang, 2020, IEEE Transactions on Power Electronics.

Jiajie Fan, Yu Zhang, H. V. van Zeijl, 2021, Journal of Materials Science: Materials in Electronics.

Michael G. Pecht, Daeil Kwon, Jiajie Fan, 2016, IEEE Access.

Guoqi Zhang, Cheng Qian, Jiajie Fan, 2018, IEEE Access.

Moon-Hwan Chang, Jiajie Fan, Bo Sun, 2018, Prognostics and Health Management of Electronics.

Yang Liu, G. Q. Zhang, Hao Zhang, 2018, Microelectron. Reliab..

Willem D. van Driel, G. Q. Zhang, Cheng Qian, 2017, Microelectron. Reliab..

Jiajie Fan, Xuejun Fan, Fengze Hou, 2021, IEEE Transactions on Electron Devices.

Jiajie Fan, Xuejun Fan, Guoqi Zhang, 2023, IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Xiaopeng Jiang, Michael G. Pecht, Bo Sun, 2017, IEEE Transactions on Power Electronics.

Lixia Zhao, C. Qian, Jiajie Fan, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Jiajie Fan, M. Ibrahim, Guoqi Zhang, 2023, 2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS).

Mark D. Placette, Jiajie Fan, Xuejun Fan, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Winco K. C. Yung, Zhou Jing, Jiajie Fan, 2021, Expert Syst. Appl..

M. Pecht, Jiajie Fan, K. C. Yung, 2011, IEEE Transactions on Device and Materials Reliability.

M. Pecht, Kam-Chuen Yung, Jiajie Fan, 2012, IEEE Transactions on Device and Materials Reliability.

Michael Pecht, Guoqi Zhang, Cheng Qian, 2015, IEEE Transactions on Device and Materials Reliability.

Jiajie Fan, Wei Chen, Guoqi Zhang, 2020, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Jiajie Fan, H. Ye, Chenshan Gao, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Jiajie Fan, Xuejun Fan, Guoqi Zhang, 2022, Electronic Components and Technology Conference.

Moumouni Guero Mohamed, Jiajie Fan, Zhi Tang, 2019, 2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS).

Jiajie Fan, Xuejun Fan, Guoqi Zhang, 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Michael Pecht, Kam-Chuen Yung, Jiajie Fan, 2014, IEEE Transactions on Device and Materials Reliability.

Bo Sun, Guoqi Zhang, Guohao Zhang, 2019, IEEE Access.