M. Barako
发表
M. Asheghi,
K. Goodson,
N. Sun,
2018
.
Kenneth E. Goodson,
Marc T. Dunham,
Mehdi Asheghi,
2015
.
Allison C Hinckley,
M. Toney,
K. Goodson,
2021,
Advanced Electronic Materials.
T. Kenny,
M. Asheghi,
K. Goodson,
2020
.
M. Asheghi,
K. Goodson,
J. Santiago,
2018,
ACS applied materials & interfaces.
M. Asheghi,
K. Goodson,
M. Barako,
2021,
International Journal of Heat and Mass Transfer.
Kenneth E. Goodson,
Juan G. Santiago,
Catherine Gorle,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
M. Asheghi,
K. Goodson,
J. Santiago,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials.
E. Pop,
R. Dauskardt,
K. Goodson,
2017,
ACS applied materials & interfaces.
J. Tice,
M. Barako,
V. Gambin,
2018,
Nanotechnology.
M. Asheghi,
K. Goodson,
J. Santiago,
2018,
Advanced Functional Materials.
M. Asheghi,
K. Goodson,
A. Sood,
2017,
ACS applied materials & interfaces.
M. Barako,
Y. Won,
Jonggyu Lee,
2018,
ACS applied materials & interfaces.
M. Povinelli,
Georgia T. Papadakis,
L. A. Sweatlock,
2020,
Scientific Reports.
M. Povinelli,
L. A. Sweatlock,
J. Tice,
2022,
Journal of Thermophysics and Heat Transfer.
M. Barako,
P. Shamberger,
A. Hoe,
2021,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
T. Kenny,
M. Asheghi,
K. Goodson,
2015,
ACS applied materials & interfaces.
Kenneth E. Goodson,
Mehdi Asheghi,
Amy Marconnet,
2013,
Journal of Electronic Materials.
F. Prinz,
M. Asheghi,
K. Goodson,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Ethan C. Ahn,
M. Asheghi,
K. Goodson,
2017,
Scientific Reports.
T. Kenny,
K. Goodson,
M. Barako,
2018
.
M. Asheghi,
K. Goodson,
A. Sood,
2016,
Nano letters.
M. Asheghi,
M. Asheghi,
K. Goodson,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
A. Elwany,
M. Barako,
J. Felts,
2022,
Applied Thermal Engineering.
M. Asheghi,
K. Goodson,
A. Marconnet,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Asheghi,
K. Goodson,
K. Ramakrishna,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
M. Asheghi,
K. Goodson,
M. Barako,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
M. Asheghi,
K. Goodson,
D. Agonafer,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
K. Goodson,
J. Tice,
M. Barako,
2018,
Journal of Applied Physics.
J. Tice,
M. Barako,
Y. Won,
2017,
Scientific Reports.
M. Asheghi,
K. Goodson,
A. Marconnet,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
M. Barako,
P. Shamberger,
A. Hoe,
2020
.
M. Povinelli,
L. A. Sweatlock,
M. Barako,
2017
.
M. Povinelli,
Georgia T. Papadakis,
L. A. Sweatlock,
2020,
2020 Conference on Lasers and Electro-Optics (CLEO).
M. Povinelli,
L. A. Sweatlock,
M. Barako,
2018,
Optica.
Eva S. Rosker,
V. Radisic,
M. Goorsky,
2022,
Flexible and Printed Electronics.
M. Barako,
P. Shamberger,
A. Hoe,
2020,
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Eva S. Rosker,
M. Goorsky,
J. Tice,
2020,
ACS applied materials & interfaces.
M. Asheghi,
K. Goodson,
A. Sood,
2018
.
M. Barako,
Y. Won,
Jonggyu Lee,
2022,
Nanoscale.
Eva S. Rosker,
M. Goorsky,
J. Tice,
2022,
IEEE Access.
M. Barako,
Yoonjin Won,
Quang N Pham,
2023,
Langmuir : the ACS journal of surfaces and colloids.
M. Povinelli,
M. Barako,
Shao-Hua Wu,
2017,
2017 Conference on Lasers and Electro-Optics (CLEO).
M. Asheghi,
K. Goodson,
J. Santiago,
2018,
ACS applied materials & interfaces.
K. Goodson,
S. LeBlanc,
Baoxing Chen,
2013
.
J. Tice,
M. Barako,
Y. Won,
2017,
Scientific Reports.
M. Barako,
P. Shamberger,
J. C. Lago,
2023,
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).