M. Redmond

Optimization of Thermoelectric Coolers for Hotspot Cooling in Three-Dimensional Stacked Chips

M. Redmond, Satish Kumar, 2015 .

Thermal management of 3-D stacked chips using thermoelectric and microfluidic devices

M. Redmond, 2013 .

Hotspot Cooling in Stacked Chips Using Thermoelectric Coolers

Saibal Mukhopadhyay, Owen Sullivan, Kavin Manickaraj, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.