M. Dai
发表
Ming-Ji Dai,
Chun Kai Liu,
M. Dai,
2007,
2007 International Microsystems, Packaging, Assembly and Circuits Technology.
M. Kao,
W. Lo,
J. Lau,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
G. J. Snyder,
M. Dai,
C. C. Li,
2015
.
M. Dai,
Chun-Kai Liu,
C. C. Li,
2013
.
G. J. Snyder,
M. Dai,
C. C. Li,
2015,
Electronic Components and Technology Conference.
M. Dai,
Y. Tzeng,
J. Jiang,
2013,
2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013).
Kuo-Ning Chiang,
Ming-Ji Dai,
Tuan-Yu Hung,
2014
.
G. Luo,
Shih-Chiang Huang,
M. Dai,
2008
.
Kuo-Ning Chiang,
Ming-Ji Dai,
Chun-Kai Liu,
2014
.
D. Yao,
M. Dai,
R. Tain,
2013
.
An-Chun Luo,
Yu-Shan Deng,
Min-Ji Dai,
2018,
2018 4th International Conference on Frontiers of Signal Processing (ICFSP).
M. Brillhart,
Peng Su,
J. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
W. Lo,
Kuan-Neng Chen,
Shih-Hsien Wu,
2022,
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Sheng-Tsai Wu,
John H. Lau,
Heng-Chieh Chien,
2011
.
Sheng-Tsai Wu,
John H. Lau,
T.-H. Chen,
2011
.
M. Kao,
W. Lo,
J. Lau,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Kuo-Shu Kao,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer
Sheng-Tsai Wu,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Sheng-Tsai Wu,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
J. H. Lau,
M. Brillhart,
Li Li,
2011
.