Xinying Li

Experiment and theoretical prediction for surface roughness of PV polycrystalline silicon wafer in electroplated diamond wire sawing

Xinying Li, Yufei Gao, Youkang Yin, 2020 .

Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing

Xinying Li, Yufei Gao, Wei Zhou, 2022, Engineering Fracture Mechanics.

Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal

Xinying Li, Yufei Gao, Youkang Yin, 2020 .

Study on cutting PV polysilicon with a new type of diamond abrasives-helix-distribution saw wire based on controlling the subsurface microcrack damage depth

Xinying Li, Yufei Gao, Youkang Yin, 2020, The International Journal of Advanced Manufacturing Technology.

Nucleation location and propagation direction of radial and median cracks for brittle material in scratching

Lei Zhang, Xinying Li, Yufei Gao, 2019, Ceramics International.

Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw

Xinying Li, Yufei Gao, Youkang Yin, 2020 .

The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon

Lei Zhang, Xinying Li, Yufei Gao, 2019, Materials Science in Semiconductor Processing.

Switchable quantum anomalous and spin Hall effects in honeycomb magnet EuCd2As2

Xinying Li, Ying Dai, Baibiao Huang, 2022 .