T. A. Tollefsen
发表
O. Løvvik,
A. Larsson,
T. A. Tollefsen,
2017,
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
O. Løvvik,
A. Larsson,
T. A. Tollefsen,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
O. Løvvik,
A. Larsson,
T. A. Tollefsen,
2019,
Metallurgical and Materials Transactions A.
O. Løvvik,
A. Larsson,
T. A. Tollefsen,
2015,
2015 European Microelectronics Packaging Conference (EMPC).
Antonia Neels,
Dag W. Breiby,
Xavier Maeder,
2013,
Metallurgical and Materials Transactions B.
O. Løvvik,
A. Larsson,
T. A. Tollefsen,
2012,
Metallurgical and Materials Transactions B.
T. A. Tollefsen,
K. Aasmundtveit,
Hoang-Vu Nguyen,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
T. A. Tollefsen,
K. Aasmundtveit,
Hoang-Vu Nguyen,
2018,
Intermetallic Compounds - Formation and Applications.
Solid-Liquid Interdiffusion (SLID) bonding — Intermetallic bonding for high temperature applications
T. A. Tollefsen,
K. Aasmundtveit,
N. Hoivik,
2013,
2013 Eurpoean Microelectronics Packaging Conference (EMPC).
A. Larsson,
T. A. Tollefsen,
K. Aasmundtveit,
2011
.
Ole Martin Løvvik,
Knut Aasmundtveit,
O. Løvvik,
2013,
Metallurgical and Materials Transactions A.
A. Larsson,
T. A. Tollefsen,
K. Aasmundtveit,
2012,
2012 4th Electronic System-Integration Technology Conference.
K. Schjølberg-Henriksen,
A. Larsson,
T. A. Tollefsen,
2012,
2012 4th Electronic System-Integration Technology Conference.
Astrid-Sofie B. Vardøy,
T. A. Tollefsen,
K. Aasmundtveit,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
A. Larsson,
T. A. Tollefsen,
K. Aasmundtveit,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).